Nepes Co., Ltd.

Seok Hwi Cheon

Jun Kyu Lee

Yun Mook Park

Yong Woon Yeo

Eung Ju Lee

Yongtae Kwon

Hyo Young Kim

Disclosed are a chip package capable of improving the strength of a package and simplifying a manufacturing process and a manufacturing method therefor. This invention may improve the durability of the package by further forming a reinforcing layer on a chip by using an adhesive layer and molding the chip and the reinforcing layer so as to be integrated by using a molding layer. Also, the strength of the package may be improved by having a structure in which solder balls are formed between a base substrate and a re-wiring layer and integrated with the molding layer, and a wiring layer may be formed directly on the molding layer by using polyimide (PI) as the molding layer without using a separate insulating layer formed on the molding layer as in the conventional art.

Growing community of inventors

Cheongju-si, South Korea

Seok Hwi Cheon