Hyundai Motor Company

Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Kia Motors Corporation

Kia Corporation

Korea Institute of Science and Technology

Inha University Research and Business Foundation

Seoul National University

Hyundai Transys Incorporated

Lotte Chemical Corporation

Woobo Tech Co., Ltd.

Daechang Seat Co.,ltd-dongtan

Daewon Precision Industrial Co., Ltd

Hanwha Advanced Materials Corporation

Irevo, Inc.

Seok Hwan Kim

Han Bit Kim

Kyung Ho Lee

Kyung Moon Jung

Se Yeon Hwang

Jae Hun Kim

Sang Ho Kim

Seon Chae Na

Su Hwan Hwang

Chul Kyu Kim

Seok Pil Lee

Kyung Ho Kim

Kang Heon Hur

Kyung Min Kim

Sung Han Kim

Deok Ha Woo

Kyung Su Lee

Kee-Won Kwon

Sung Min Cho

Seung Jae Song

Jong Man Kim

Junhan Bae

So Young Yoo

Sang Sun Park

Young Ho Choi

Youngsoo Sohn

Hyeong Jong Kim

In Bae Chang

Jung Hoon Chun

Ju Yeong Oh

Hyung Yun Choi

Yeo Ok Jeon

Seon Hyeok Lee

Seung Wook Park

Dong Woo Kim

Hyung Joon Kim

Young Bok Yoon

Jong Hyun Kim

Sun Ho Kim

Ju Ho Kim

Young Min Jhon

Sang Kyu Lee

Kyoung Min Lee

Chulki Kim

Dae Sik Kim

Jeong Seok Oh

Chul Ju Lee

Gil Ju Kim

Taikjin Lee

Tae Ho Yun

Won Jin Seo

Kie Youn Jeong

Sang Uk Yu

Jung Ho Shim

Suk Won Hong

Joo Young Hwang

Min Ah Seo

Seung Hyun Kim

Youngho Cho

Taik Jin Lee

Jung Gyun Noh

Kyungho Kim

Kyoungho Kim

Young Bok Sung

Gi Man Kim

Han Su Yoo

Chul Ki Kim

Kyung Mo Yang

Eun Seok Kim

Tae Hee Won

Joung Myung Lim

Ji Hwan Choi

Byung Kook Nam

Hyun Sang Kwak

Seong Hwan Park

Tae Hong Han

KieYoun Jeong

Ki Ho Park

Byeong Hui Kim

Ji Sung Bae

Yong Ku Kwon

Do Wan Lim

Sang Hyeok Yun

Hyo Suk Kim

Joon Woo Gi

Byeong Ho Park

Subeen Park

Dae Keon Jang

Byeong Kwang Kim

Hae Ii Jeong

Sung Il Jo

Yong Bum Lee

Chang Youn Kim

DuckHyoung Hwang

Daehyeon Hwang

Sung Ki Shin

Sang Ho Seo

Tae Sik Moon

Jong Gil Won

Hyo-suk Kim

A camera module includes: a housing defining an internal space; a first lens module disposed in the internal space to move along an optical axis direction, the first lens module including at least one first bearing member; a second lens module disposed in the internal space to move along the optical axis direction, the second lens module including at least one second bearing member; a shaft disposed in the housing and supporting a first side of the first lens module and contacting the at least one first bearing member and supporting a first side of the second lens module and contacting the at least one second bearing member; at least one first ball member supporting a second side of the first lens module; and at least one second ball member supporting a second side of the second lens module.

Camera module

A tether anchor of a seatback of a vehicle seat includes a first wire fixed in at least a first end of the first wire to a seatback frame and forming a cover mounting part for fixing a cover, a second wire fixed at both ends of the second wire to the seatback frame and forming an anchor part for fixing a top tether of a car seat while crossing the cover mounting part of the first wire, and a cover mounted on the cover mounting part. The cover may be mounted on the cover mounting part so as to expose the anchor part to a rear of the seatback, and to seal the rear of the seatback.

Tether anchor of seatback of vehicle seat

The present disclosure relates to a power supply device, and more specifically, to a seat power supply device including an improved power supply structure for a vehicle seat. The seat power supply device includes a pogo pin assembly fixed to a vehicle and electrically connected to a power source; and a distribution element electrically connected to the pogo pin assembly and configured to supply power from the power source to an electronic part of a seat.

Seat power supply device for vehicle and power supply method using the same

A camera module is provided. The camera module includes a lens barrel in which at least one lens is installed; and a lens holder to which the lens barrel is fixedly installed, wherein one of the lens holder and the lens barrel is provided with a coupling protrusion, and the other thereof is provided with a coupling groove into which the coupling protrusion is inserted, the lens holder is provided with a support portion that supports one end portion of the lens barrel, wherein the one end portion of the lens barrel is disposed between the coupling protrusion and the support portion, and the support portion of the lens holder elastically supports the lens barrel in an optical axis direction.

An aperture module includes: a base; a rotating plate rotatably disposed on the base; and blades configured to form an incident hole and move by rotation of the rotating plate to change a size of the incident hole. The blades are disposed in an opening disposed inside the rotating plate.

Aperture module and camera module

A camera module includes: a first substrate on which an image sensor configured to convert an optical signal incident through a lens module into an electrical signal is disposed and a first connection terminal is disposed; a second substrate spaced apart from the first substrate and including a second connection terminal formed in a position facing the first connection terminal; and a terminal connector electrically connecting the first connection terminal and the second connection terminal to each other and configured to maintain a preset distance between the first substrate and the second substrate. In the camera module, the terminal connector includes: a connecting member including a first connection portion, a second connection portion, and a deformable portion; and a support member configured to maintain the preset distance between the first substrate and the second substrate.

A device for folding a seat may include: a lower arm stopper fixed to a predetermined radial position with respect to a reclining hinge shaft of a seatback as a center; a lock plate configured to rotate about a rotation shaft as a center while being hooked to the lower arm stopper in a process of reclining forward together with the seatback with respect to the reclining hinge shaft as the center; and a folding link limited to rotate by being hooked to the lock plate and configured to make folding rotation together with the seatback with respect to a folding hinge shaft, as a center, located at a part above the reclining hinge shaft, by being released from being hooked to the lock plate according to the rotation of the lock plate.

Device for folding seat

A power supply and signal transmission device for a vehicle seat rail is provided. The device includes a contact-type power supply unit configured to supply power to an electrical device mounted on a seat, and a contact-type signal transmission unit configured to transfer seat drive control signals. The contact-type power supply unit and the contact-type signal transmission unit are directly mounted on the seat rail.

Power supply and signal transmission device for vehicle seat rail

The present disclosure relates to a retina imaging method in which a light from a light source into two lights is dispersed, at least one eyeground image of the eyeball at a first magnification is obtained by adjusting the paths of the two lights incident on the eyeball, and a plurality of DIC images are obtained at a second magnification higher than the first magnification with respect to the retina of the entirety of the obtained at least one eyeground image by adjusting the paths of the two lights incident on the eyeball.

Retina imaging method and device, and retina and optic nerve function evaluation system

A semiconductor package includes: a connection member having a first surface and a second surface opposing each other in a stacking direction of the semiconductor package and including an insulating member and a redistribution layer formed on the insulating member and having a redistribution via; a semiconductor chip disposed on the first surface of the connection member and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip; a passivation layer disposed on the second surface of the connection member; UBM pads disposed on the passivation layer and overlapping the redistribution vias in the stacking direction; and UBM vias connecting the UBM pads to the redistribution layer through the passivation layer, not overlapping the redistribution vias with respect to the stacking direction, and having a non-circular cross section.

Semiconductor package for reducing stress to redistribution via

An optical assembly includes: a camera module; at least one actuator configured to move the camera module; and a connection substrate having one end connected to the camera module such that at least a portion of the connection substrate is configured to move along with movement of the camera module. The connection substrate includes a rigidity reduction portion reducing rigidity of the connection substrate in a portion of the substrate in which distortion or warpage occurs according to the movement of the camera module.

Optical assembly

An apparatus of adjusting height of a headrest for a motor vehicle is provided. By forming the headrest with two divided parts, a rear portion fastened to a seatback by a stay and a front portion assembled to the rear portion movably in an up and down direction, the apparatus allows an occupant to adjust the height of the front portion according to his or her body size or preference, and thus is configured for comfortably supporting the head or neck portion of the occupant with the front portion regardless of the body size of the occupant.

Apparatus for adjusting height of headrest for motor vehicle

Provided are a semiconductor device and a semiconductor system. A semiconductor device includes a non-volatile memory; a device interface circuit which receives an input/output (I/O) request from a host; and a device controller which executes a data access according to the I/O request on the non-volatile memory, and transmits an interrupt to the host a predetermined time before completion of the data access.

Semiconductor device and semiconductor system

An electronic component module includes a semiconductor package having a first surface provided as a mounting surface and a second surface opposing the first surface, and including a semiconductor chip, a component package having a first surface facing the second surface of the semiconductor package, and a second surface opposing the first surface of the component package, the component package including a passive component, and a connector disposed on the second surface of the component package and having a connection surface configured to be mechanically coupled to an external device, the connector including a plurality of connection lines arranged on the connection surface.

Package-on-package and package connection system comprising the same

Growing community of inventors

Suwon-si, South Korea

Seok Hwan Kim