Samsung Electro-Mechanics Co., Ltd.

Seok Hwan Ahn

Tae Hoon Kim

Jeong Min Cho

Young Gwan Ko

Myung Sam Kang

Se Woong Paeng

Jin Gul Hyun

Jong Yoon Jang

Han Bit Kim

Kyung Ho Lee

Sung Han Kim

Mi Sun Hwang

Suk Hyeon Cho

Han Saem Lee

Yong Sam Lee

Hyo Seung Nam

Dae Hui Jo

Sang Yul Ha

There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a plurality of coil layers and high-rigidity insulating layers disposed on and beneath the plurality of coil layers; and external electrodes disposed on external surfaces of the body and connected to the coil layers. Build-up insulating layers are disposed between the high-rigidity insulating layers to cover the coil layers, and the high-rigidity insulating layers have a Young's modulus greater than that of the build-up insulating layers.

Inductor including high-rigidity insulating layers

Method of manufacturing an inductor

A coil electronic component includes a body portion and an external electrode. The body portion includes a coil layer and a reinforcing layer disposed on at least one of an upper portion and a lower portion of the coil layer. The external electrode is disposed on an outer surface of the body portion. The coil layer includes an insulating layer, a coil pattern, and a first conductivity type via penetrating through the insulating layer to be connected to the coil pattern, and the reinforcing layer has a higher degree of rigidity than the insulating layer.

Coil electronic component

A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an inner layer including at least one insulating layer and wiring parts, and outer layers disposed on opposing sides of the inner layer, the outer layers including reinforcing layers and wiring parts, the reinforcing layers having a greater degree of rigidity than the insulating layer.

Printed circuit board with inner layer and outer layers and method of manufacturing the same

A printed circuit board and a method of manufacturing the same. In one embodiment, a printed circuit board includes: a core made of a glass material; an insulator surrounding the core; and a via connecting internal circuit layers through the core and the insulator.

Printed circuit board and method of manufacturing the same

A printed circuit board having a plating pattern buried in a via. The printed circuit board has: an insulating substrate including an electrically insulating resin; a via hole passing through the insulating substrate; a via including a metal layer formed on an inner wall of the via hole and a filler charged in the via hole; a circuit layer including a circuit pattern buried in the insulating substrate and transmitting an electrical signal; and a plating pattern buried in an end of the filler.

Printed circuit board having plating pattern buried in via

Disclosed is a printed circuit board having a plating pattern buried in a via and a method of manufacturing the same. The method of manufacturing the printed circuit board includes forming a negative pattern for forming a plating pattern, thus remarkably reducing the generation of plating thickness deviation in a plating process for forming a circuit pattern, and the printed circuit board has improved electrical signal transmission properties.

Method of manufacturing a printed circuit board

Growing community of inventors

Suwon-si, South Korea

Seok Hwan Ahn