Samsung Electronics Co., Ltd.

Other

Seok-Hun Hyun

Jung-Hwan Choi

Chang-Kyo Lee

Kyung-Soo Ha

Ki-Seok Oh

Yeon-Kyu Choi

Dae-Sik Moon

Gil-Hoon Cha

Seong-Jin Jang

Young-Soo Sohn

Jin-Hoon Jang

Jeong-Kyoum Kim

Young-Hoon Son

Ki-Ho Kim

Yang-Ki Kim

Seong-Hwan Jeon

In-Dal Song

Min-Su Ahn

Tae-Sik Na

Yong-cheol Bae

Jin-Seok Heo

Bo-bae Shin

Won-young Lee

Jin-Hyeok Baek

Joung-Wook Moon

A memory device includes a clock receiver configured to receive, from a memory controller, a write clock that is used to receive write data during a data write operation, a duty monitor configured to generate first monitoring information by monitoring a duty of the write clock, and a duty adjuster configured to adjust the duty of the write clock in response to a duty control signal and output an adjusted write clock. The memory device provides the first monitoring information to the memory controller, and receives the duty control signal, generated using the first monitoring information, from the memory controller.

Memory device adjusting duty cycle and memory system having the same

A method of operating memory devices disposed in different ranks of a multi-rank memory device and sharing a signal line includes receiving, in all of the memory devices included in the multi-rank memory device, on-die termination (ODT) state information of the signal line. The method further includes storing, in each of the memory devices of the multi-rank memory device, the ODT state information of the signal line in a mode register. The method further includes generating, in each of the memory devices of the multi-rank memory device, a control signal based on the ODT state information of the signal line stored in the mode register. The method further includes changing, in each of the memory devices of the multi-rank memory device, an ODT setting of the signal line in response to the control signal.

Method and memory system for optimizing on-die termination settings of multi-ranks in a multi-rank memory device

A semiconductor package includes a first layer including a first semiconductor chip and a first through via, a first redistribution layer disposed on a surface of the first layer, and including a first-first wiring and a second-first wiring, and a second layer including a second semiconductor chip, and stacked on the first layer. The first semiconductor chip includes a first-first buffer, and the first-first buffer is electrically connected between the first-first wiring and the second-first wiring.

Semiconductor package and manufacturing method thereof

A semiconductor package includes a first layer of one or more first semiconductor chips each having a first surface at which one or more first pads are exposed, a second layer of one or more second semiconductor chips disposed over the first layer and each having a second surface at which one or more second pads are exposed, and a first redistribution layer between the first layer and the second layer and electrically connected to the one or more first pads. The first layer may include one or more first TPVs extending through a substrate (panel) of the first layer and electrically connected to the first redistribution layer.

Semiconductor package and method of manufacturing the same

A memory device determines an operation mode based on an external voltage. The memory device includes a cell array including a plurality of memory cells; and a mode selector that detects a level of at least one voltage signal externally provided and selects any one of a plurality of operation modes corresponding to a plurality of standards according to a result of detecting the level of the at least one voltage signal. The memory device further includes a mode controller that, in response to a mode selecting signal from the mode selector, outputs setting information for setting the memory device to communicate with a memory controller via an interface according to a selected standard from among the plurality of standards; and a calibrating circuit that generates a control code for controlling circuit blocks in the memory device according to the setting information.

Memory device determining operation mode based on external voltage and method of operating the same

A memory device may include a data output circuit configured to multiplex a plurality of data signals read from a memory cell array, wherein the data output circuit includes a clock boosting circuit configured to receive a plurality of internal clock signals generated based on a first power voltage, and to generate a plurality of boosted clock signals by boosting the plurality of internal clock signals based on a second power voltage having a voltage level greater than that of the first power voltage, and a data output driver configured to multiplex and output the plurality of data signals synchronized with the boosted clock signals.

Data output circuit and memory device including the same

A memory device capable of rescuing defective characteristics that occur after packaging includes a memory cell array including a plurality of memory cells and an antifuse circuit unit including at least one antifuse. The antifuse circuit unit stores a defective cell address of the memory cell array in the at least one antifuse and reads the defective cell address to an external source. The antifuse circuit unit stores a defective characteristic code in the at least one antifuse, wherein the defective characteristic code is related to at least one of a timing parameter spec., a refresh spec., an input/output (I/O) trigger voltage spec., and a data training spec. of the memory device, and outputs the defective characteristic code to an external source.

Semiconductor device capable of rescuing defective characteristics occurring after packaging

Growing community of inventors

Seongnam-si, South Korea

Seok-Hun Hyun