Samsung Electronics Co., Ltd.

Seok-ho Park

Ki-sang Kang

Se-Jang Oh

A wafer probing system, and a wafer-probing needle calibrating method using the same are provided. The system comprises a main support, a wafer chuck mounted on the main support, a needle chuck for contacting one of the plurality of needles. The needle chuck is comprised of a conductive signal line, and a shield line for shielding the signal line. Further, the system includes positioning means, for determining the position of the plurality of needles, moving means, for vertically moving the needle chuck, being coupled to the support, and means for horizontally moving the support based on the determined position of the plurality of needles. With the present invention system and method, signals applied to wafer probing needles can be accurately calibrated.

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Yongin, South Korea

Seok-ho Park