Samsung Electronics Co., Ltd.

Seok Goh

Taehyun Kim

Jin-Ho Kim

Jung-Hyeon Kim

Dongsoo Lee

In-Ku Kang

Tae-Gyeong Chung

Jeong-Hoon Kim

Yong-Jae Lee

Jong-won Han

Sang-Geun Kim

Ho-Jeong Choi

Byoung-jun Min

Dong-Chul Han

Kyoungbok Cho

Sang-Sik Lee

Bo-Woo Kim

An apparatus for mounting a semiconductor device includes a mounting component and a loading component. The mounting component is configured to mount the semiconductor device onto a circuit board. The loading component is disposed adjacent to the mounting component, and is configured to supply the semiconductor device and the circuit board to the mounting component.

Apparatus for mounting semiconductor device

A test socket is provided that includes a socket body to receive an object to be tested, a lid disposed on the socket body, one or more pushers coupled to a first surface of lid to apply force to a first surface of the object toward the socket body, and a temperature controlling member to provide a temperature to the object. A semiconductor package may be tested in a test apparatus that includes the test socket, the methods of testing including receiving a semiconductor package in a socket in a test chamber, applying a first temperature to the test chamber to test the semiconductor package at a first test temperature, and applying a second temperature to the semiconductor package to test the semiconductor package at a second test temperature by controlling the application of the second temperature with the socket.

Test socket, and test apparatus with test socket to control a temperature of an object to be tested

A stacked package and method of manufacture are provided. The stacked package may include a first semiconductor package, a second semiconductor package, plugs and spacers. The second semiconductor package may be stacked on the first semiconductor package. The plugs may electrically connect the first semiconductor to the second semiconductor package. The spacer may be interposed between the first semiconductor package and the second semiconductor package to form a gap between the first semiconductor package and the second semiconductor package, thereby preventing an electrical short between the plugs.

Stacked package including spacers and method of manufacturing the same

A variety of non-rectangular IC chips having a stepped or modified periphery or edge profile including one or more recessed or indented peripheral regions are provided for incorporation in modified package configurations, single chip packages and multi-chip assemblies, both stacked and/or planar. In the planar configurations, the recessed regions may be utilized, in cooperation with another appropriately sized IC chip, to increase the packing density of the resulting device. Similarly, in the stacked configuration, the recessed regions may be utilized to provide access to bond pads of lower chips and thereby reduce the need for spacers or peripheral thinning techniques and thereby improve the strength of the resulting assembly and/or reduce the overall height of the stacked structure.

Semiconductor package having step type die and method for manufacturing the same

An apparatus for removing a wafer ring tape, on which defective chips remain, from a wafer ring after normal chips are detached from the wafer ring tape, is provided. The apparatus comprises a ring table for supporting a tape-adhered wafer ring in which the wafer ring tape is attached to the wafer ring; a detaching head positionable above the ring table and movable for detaching the wafer ring tape from the wafer ring; a blocking pin disposed under the ring table to support the wafer ring tape detached from the wafer ring; and a pair of compressing plates disposed under the ring table to compress the wafer ring tape supported by the blocking pin.

Apparatus for removing wafer ring tape

Automated equipment mounts heat sinks on printed circuit boards. First heat sinks, semiconductor modules and second heat sinks are consecutively seated on a plurality of built-up pads as the built-up pads move from station to station around a built-up pad conveyer. Rivets are mounted in a first heat sink and inserted through holes in a semiconductor module and a second heat sink when seating the semiconductor module and the second heat sink. Working the rivets fixes the first heat sink, the semiconductor module and the second heat sink permanently, and thereby forms a semiconductor product. After that, a label is attached on the semiconductor product and the riveting quality and the labeling quality of the semiconductor product are inspected.

Heat sink to semiconductor module assembly equipment and method

A module appearance inspection apparatus includes a warpage checking unit, a visual checking unit, a first module transfer unit for unloading the module from a module tray, a second module transfer unit for transferring the module within the apparatus, and a third module transfer unit for loading the module to a module tray. The apparatus can replace the first and third module transfer units with a single module transfer unit. In this case, the apparatus includes: a warpage checking unit; a visual checking unit; a supply unit in which module trays are stacked; a storage unit in which module trays also can be stacked; a tray transfer unit which moves a module tray from the supply unit to the storage unit; a first module transfer unit which unloads and loads the module from and to the module tray on the tray transfer unit; and a second module transfer unit which transfers the module from the warpage checking unit or the visual checking unit.

Growing community of inventors

Cheonan-si, South Korea

Seok Goh