Amkor Technology Singapore Holding Pte. Ltd.

Amkor Technology, Inc.

Seok Geun Ahn

Min Hwa Chang

Dong Hyun Kim

Ah Ra Jo

Won Chul Do

Min Kyun Yoo

Jae Hun Bae

Young Rae Kim

A semiconductor device includes a low-density substrate, a high-density patch positioned inside a cavity in the low-density substrate, a first semiconductor die, and a second semiconductor die. The first semiconductor dies includes high-density bumps and low-density bumps. The second semiconductor die includes high-density bumps and low-density bumps. The high-density bumps of the first semiconductor die and the high-density bumps of the second semiconductor die are electrically connected to the high-density patch. The low-density bumps of the first semiconductor die and the low-density bumps of the second semiconductor die are electrically connected to the low-density substrate.

Semiconductor device and manufacturing method thereof

Semiconductor device

Growing community of inventors

Gyeonggi-do, South Korea

Seok Geun Ahn