Samsung Electronics Co., Ltd.

Seok-chan Lee

Gwang-Man Lim

Seok-Jae Han

Il-Mok Kang

Seok-cheon Kwon

Sang-chul Kang

Sung-hoon Chun

Dong-Min Kim

Eun-Jin Yun

Jae-bum Lee

Kyung-Man Kim

Hye-jin Kim

Ki-Sun Kim

Sang-Ho An

Sung-Kug Cho

Sil-wan Chang

Jong-rak Sohn

Yang-seok Ki

Byoung-young Ahn

Ju-seok Lee

A storage system performing data deduplication includes a storage device configured to store data received from a host, and a controller configured to receive the data and an index associated with the data received from the host. The controller includes a memory configured to store mapping information and a reference count, the mapping information associating the index received from the host with a physical address of the storage system, the reference count associated with the index received from the host. The controller determines whether the data received from the host corresponds to a duplicate of data previously stored in the storage device by reading, from the memory, the mapping information and the reference count, the reading based on the index received from the host. The controller performs a deduplication process by updating the reference count if the data received from the host corresponds to the duplicate of data previously stored.

Storage system performing data deduplication, method of operating storage system, and method of operating data processing system

Provided is a memory card, which includes two pairs of opposite edges, first row terminals arranged adjacent to an insertion-side edge of the memory card, and second row terminals arranged apart from the insertion-side edge of the memory card. The memory card can be easily reset in terms of software without controlling power supply in terms of hardware. Also, the memory card can be smoothly attached and detached during insertion of the memory card into a socket and reduce damage to a device.

Memory card having multi-row terminals

A semiconductor package comprising: a base substrate; a first semiconductor chip unit attached to the base substrate and including at least one first semiconductor chip; a second semiconductor chip unit stacked on the first semiconductor chip unit and including at least one second semiconductor chip; at least one third semiconductor chip disposed between the first semiconductor chip unit and the second semiconductor chip unit and having an area smaller than that of the at least one first semiconductor chip and that of the at least one second semiconductor chip; and an insulating material layer disposed between the first semiconductor chip unit and the second semiconductor chip unit to surround at least a portion of the at least one third semiconductor chip and having a thickness larger than that of the third semiconductor chip.

Stacked semiconductor package including a smaller-area semiconductor chip

Disclosed are a card socket device and an electronic apparatus including the same. The card socket device includes a seat portion configured to receive an attachable card; and one or more connection terminal portions formed in the seat portion and configured to form an electrical connection with one or more connection pads formed in a bottom surface of the attachable card, wherein the seat portion is configured such that a space accommodating the attachable card is upwardly opened.

Card socket device and electronic apparatus including the same

Semiconductor packages including stacked semiconductor chips are provided. The semiconductor packages may include first semiconductor chips and a second semiconductor chip that are stacked sequentially on a board. The semiconductor packages may also include a wiring layer on the memory chips and the wiring layer may include redistribution patterns and redistribution pads. Each of the memory chips may include a data pad. The data pads of the first semiconductor chips may be electrically connected to the board via the second semiconductor chip, some of redistribution patterns, and some of redistribution pads.

Semiconductor package including stacked semiconductor chips and a redistribution layer

Memory card

Provided are a socket, a semiconductor package, a test device and a method of manufacturing a semiconductor package. A socket to test a semiconductor package comprising a housing, a trench receiving a semiconductor package in the housing, at least one probe connected to the semiconductor package at a bottom of the trench, and at least one connector electrically connecting a plurality of contact points exposed at a side of the semiconductor package when the semiconductor package is inserted into the trench. A semiconductor package with contacts exposed from a side of a package substrate, and a method of manufacturing such a semiconductor package are also disclosed.

Semiconductor package, test socket and related methods

A stacked semiconductor package including a first printed circuit board and a second printed circuit board is provided. The first printed circuit board may include a first surface upon which a first semiconductor chip is mounted and a second surface upon which at least one connecting structure is attached. The first printed circuit board may further include at least one thermal via and a heat sink and the at least one thermal via and the heat sink may be disposed under the first semiconductor chip with the heat sink being disposed between the first surface and the second surface. The second printed circuit board may include a third surface upon which a second semiconductor chip is mounted. The second printed circuit board may be disposed under the first printed circuit board with the at least one connecting structure connecting the first printed circuit board to the second printed circuit board.

Stacked semiconductor package

Growing community of inventors

Hwaseong-si, South Korea

Seok-chan Lee