Samsung Electro-mechanics Co., Ltd.

Seohyun Park

Seok Yoon Hong

Hansu Park

Hyukki Kwon

An electronic device package includes: a board including first surface and a second surface facing away from each other, and including a first layer adjacent to the first surface and a second layer adjacent to the second surface, wherein a step portion is formed on a side surface between the first layer and the second layer; an electronic device mounted on the first surface; an antenna layer formed in the second layer or on the second surface; a molded portion formed to cover the electronic device on the first surface; and a conductive film formed to cover a surface of the molded portion and a side surface of the first layer, and including an end portion positioned at the step portion.

Growing community of inventors

Suwon-si, South Korea

Seohyun Park