Samsung Electronics Co., Ltd.

Semes Co., Ltd.

Corning Precision Materials Co., Ltd.

Seohyun Kim

Kuntack Lee

Sangjine Park

Jihoon Jeong

Younghoo Kim

Sukhoon Kim

Young-Hoo Kim

Hae-Won Choi

Yongmyung Jun

Seungbu Baek

Hyunchul Kim

Sangwoo Kim

Namsu Kim

Youngchan Kim

Kihoon Choi

Kyungwook Park

Jaeseong Lee

Anton Koriakin

Seungtaek Oh

Keonyoung Kim

Hyunjin Ko

Ohchel Kwon

Yunyoung Kwon

Gunsang Yoon

Hyunwoo Nho

Jaeseong Ryu

Myunggon Kim

Daewoong Choi

Jae Seong Ryu

Inkwang Bae

Hyeongkwon Jeong

A substrate processing apparatus includes a processing chamber providing a processing space for processing a substrate and processing a substrate, a substrate support configured to support the substrate, a blocking plate below the substrate support and configured to prevent supercritical fluid from being directly sprayed onto the substrate, a first supply device configured to supply supercritical fluid under a first condition to the processing chamber, a second supply device configured to supply supercritical fluid under a second condition at a higher temperature than that of supercritical fluid under the first condition to the processing chamber, a discharge device configured to discharge supercritical fluid from the processing chamber, and a control device configured to control operations of the first supply device, the second supply device, and the discharge device. The control device is configured to direct the first supply device to supply supercritical fluid prior to the second supply device.

Substrate processing apparatus, semiconductor manufacturing equipment, and substrate processing method

A supercritical fluid processing apparatus including a supercritical fluid supply module including a gas liquefier to liquefy a gas transferred from a gas supply and provide a liquefied fluid, a storage tank to change the liquefied fluid to a supercritical state and store a supercritical fluid, and an internal pipe connecting the gas liquefier to the storage tank; an exhaust fluid supply module including an exhaust fluid liquefier including a regeneration storage tank to collect a first exhaust fluid from the storage tank, and a refrigerant pipe to liquefy the first exhaust fluid in the regeneration storage tank and maintain the liquefied first exhaust fluid at a predetermined temperature/pressure; a first exhaust pipe to transfer the first exhaust fluid from the storage tank to the exhaust fluid liquefier; and a resupply pipe to resupply the first exhaust fluid collected and liquefied in the exhaust fluid liquefier to the storage tank.

Supercritical fluid processing apparatus and substrate processing system including the same

A substrate processing apparatus includes a chamber including an upper chamber and a lower chamber coupled to each other to provide a space for processing a substrate, a substrate support configured to support the substrate within the chamber, an upper supply port provided in the upper chamber and configured to supply a supercritical fluid on an upper surface of the substrate within the chamber, a recess provided in a lower surface of the upper chamber, the recess including a horizontal extension portion extending in a direction parallel with the upper surface of the substrate in a radial direction from an outlet of the upper supply port and an inclined extension portion extending obliquely at an angle from the horizontal extension portion, and a baffle member disposed within the recess between the upper supply port and the substrate.

Substrate processing apparatus and substrate processing method

In a substrate processing method, a rinse process using a rinse solution is performed on a development-processed photoresist pattern on a substrate. A substitution process including a first substitution step using a mixed solution of a non-polar organic solvent and a surfactant and a second substitution step using the non-polar organic solvent is performed on the substrate. The substitution process is performed a plurality of times until the rinse solution remaining on the substrate is less than a predetermined value. A supercritical fluid drying process is performed on the substrate to dry the non-polar organic solvent remaining on the substrate.

Substrate processing method and substrate processing system

A substrate processing chamber includes a housing providing a process space; a spin apparatus provided in the housing; and a fluid spraying nozzle configured to spray fluid into the process space, wherein the spin apparatus includes: a spin chuck configured to support a substrate; a rotation driving part configured to rotate the spin chuck; and a weight sensor configured to measure a weight of the substrate supported on the spin chuck.

Substrate processing chamber, substrate processing system including the same, and substrate processing method using the same

A substrate processing method includes providing a surface tension reducing agent as a gas onto a substrate, the substrate having an exposed photoresist layer and layer of developer on the exposed photoresist layer, and causing a bulk flow of the developer in order to remove the developer from the substrate.

Substrate processing method, micropattern forming method, and substrate processing apparatus

An apparatus for processing a substrate may include a wet chamber, a dry chamber, a first transfer robot and a shared shutter. The wet chamber may be configured to process the substrate using a chemical. The dry chamber may be adjacent the wet chamber and configured to dry the substrate processed by the wet chamber. The first transfer robot may be configured to transfer the substrate between the wet chamber and the dry chamber. The shared shutter may be between the wet chamber and the dry chamber. A connection opening through which the substrate may be transferred may be formed between the wet chamber and the dry chamber. The shared shutter may be configured to open and close the connection opening.

Apparatus for processing a substrate

An electronic device is disclosed and includes an optical sensor module, a window, a first shield-printed layer, and a second shield-printed layer. The optical sensor module includes a first optical sensor and a second optical sensor. The window covers the optical sensor module. The first shield-printed layer is printed in a first region for transmitting a sensor light from the first optical sensor on a lower surface of the window facing the optical sensor module. The second shield-printed layer is printed in a second region for transmitting a sensor light from the second optical sensor on the lower surface of the window. The first and second shield-printed layers are printed using a same coloring material.

Electronics device including optical sensor module having shield printed layers using a coloring material

Provided is a method of preparing a light scattering layer including voids as a light scattering enhancer instead of metal oxide particles. Provided is also a light scattering layer including voids as a light scattering enhancer instead of metal oxide particles. Provided is also an organic electroluminescent device including the light scattering layer that includes voids as the light scattering enhancer instead of metal oxide particles.

Method of preparing light scattering layer

Growing community of inventors

Gyeonggi-do, South Korea

Seohyun Kim