Samsung Display Co., Ltd.

Ensil Tech Co., Ltd.

Ensiltech Corporation

Seog-Young Lee

Oh-Seob Kwon

Jae-Sang Ro

Won-Eui Hong

Sung-Soo Koh

Jung-Jun Im

Dong-Seop Park

Byung-Uk Han

A mother substrate for forming flat panel display apparatuses and a method of manufacturing the same, the mother substrate including a substrate; a plurality of display units on the substrate, the display units being for forming a plurality of flat panel display apparatuses; a sealing substrate facing the display units; sealing members between the substrate and the sealing substrate, the sealing members surrounding each of the display units; a plurality of wiring units between the substrate and the sealing substrate, the wiring units overlapping the sealing members; a connecting unit including a conductive material, the connecting unit connecting adjacent wiring units in one direction and having a width that is greater than a width of each of the wiring units; and inlets connected to the plurality of wiring units and an external power source, the inlets being for applying a voltage to the plurality of wiring units.

Mother substrate for flat panel display apparatus and method of manufacturing the same

A flat panel display apparatus includes a substrate; a display unit disposed on the substrate; a sealing substrate disposed to face the display unit; a sealing member disposed between the substrate and the sealing substrate to surround the display unit; a wiring unit disposed between the substrate and the sealing substrate, including a region that overlaps the sealing member, and including a plurality of wiring members that are spaced apart from each other in at least a portion of the region that overlaps the sealing member; and a lead-in unit connected to the wiring unit to apply a voltage to the wiring unit, and formed to be electrically connectable to an external power source.

Flat panel display apparatus, mother substrate for flat panel display apparatuses, method of manufacturing the flat panel display apparatus, and method of manufacturing the mother substrate

In a flat panel display apparatus and a method of manufacturing the same, the flat panel display apparatus includes a substrate, a display unit disposed on the substrate, a sealing substrate disposed facing the display unit, a sealing member disposed between the substrate and the sealing substrate so as to surround the display unit, a wiring unit disposed between the substrate and the sealing substrate so as to partially overlap the sealing member, and at least three inlet portion groups to which voltage is applied via an external power source. The inlet portion groups are connected to the wiring unit. Each inlet portion group includes a plurality of sub-inlet portions.

Flat panel display apparatus and method for manufacturing the same

A flat panel display apparatus includes a first substrate having a display region, a second substrate facing the first substrate and bonded to the first substrate, a groove portion in an edge of at least one of the first substrate and the second substrate, and a wiring portion and a bonding member arranged in the groove portion. The bonding member contacts the wiring portion. The wiring portion is configured to receive power and to supply heat to the bonding member. The bonding member is configured to bond the first substrate and the second substrate using the heat supplied from the wiring portion disposed in the groove portion.

Flat panel display apparatus and mother substrate for flat panel display apparatus

An organic electroluminescence apparatus comprises: a substrate having a pixel region and sealing regions; an organic electroluminescence device located in the pixel region of the substrate; and a sealing substrate having a pixel region and sealing regions corresponding to the pixel region and the sealing regions of the substrate. The sealing regions of the sealing substrate comprise conductive layers continuously connected to each other. In a method of manufacturing organic electroluminescence apparatus by sealing the substrate and the sealing substrate using a glass frit, manufacturing costs and process time can be greatly reduced.

Growing community of inventors

Seoul, South Korea

Seog-Young Lee