Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Seog-soon Baek

Yong-soo Oh

Su-ho Shin

Seung-ju Shin

Hoon Song

Keon Kuk

Hyun-cheol Kim

Ki-deok Bae

Byeoung Ju Ha

Young-soo Oh

Byeoung-ju Ha

An ink-jet printhead includes a substrate on which an ink chamber to be supplied with ink to be ejected is formed on a front surface of the substrate, a manifold for supplying ink to the ink chamber is formed on a rear surface of the substrate, and an ink passage in communication with the ink chamber and the manifold is formed parallel to the front surface of the substrate, a nozzle plate formed on the front surface of the substrate, a nozzle formed through the nozzle plate through which ink is ejected from the ink chamber, a heater formed on the nozzle plate, and an electrode electrically connected to the heater for applying current to the heater.

Ink-jet printhead and method for manufacturing the same

A monolithic ink-jet printhead includes a substrate having an ink chamber to be filled with ink to be ejected on a front surface, a manifold for supplying ink to the ink chamber on a rear surface, and an ink channel communicating between the ink chamber and the manifold, a barrier wall formed on the front surface of the substrate to a predetermined depth and defining at least a portion of the ink chamber in a width-wise direction, a nozzle plate including a plurality of material layers stacked on the substrate and having a nozzle penetrating the nozzle plate, so that ink ejected from the ink chamber is ejected through the nozzle, a heater formed between adjacent material layers and located above the ink chamber for heating ink to be supplied within the ink chamber; and a conductor for providing current across the heater being provided between adjacent material layers.

Methods for manufacturing monolithic ink-jet printheads

Monolithic ink-jet printhead having an ink chamber defined by a barrier wall and manufacturing method thereof

Ink-jet printhead

A microgyroscope with two resonant plates is provided. The microgyroscope includes a substrate; first and second frames provided on the substrate to have a predetermined height, the first and second frames facing each other; a plurality of anchors supporting the first and second frames with respect to the substrate; first and second resonant plates provided between the first and second frames to be separated from each other by a predetermined distance; and a matching link unit connected to the first and second resonant plates so that it links the motion of one resonant plate to the motion of the other resonant plate such that the matching link unit is moved by the motion of one resonant plate in a first direction and then moves the other resonant plate in a second direction opposite to the first direction. In the microgyroscope, the difference between the resonance frequencies of the two resonant plates is removed by a self resonant matching structure implemented by the matching link, so that the range of an allowable process error is large, and the microgyroscope can be easily manufactured. Additionally, the reliability and the linearity of a resonance structure are improved. Since the driving beam and the sensing beam are separately designed, mode coupling can be prevented, thereby increasing the sensing sensibility.

Microgyroscope with two resonant plates

A method of fabricating a micro electromechanical system (MEMS) structure which can be vacuum-packaged at the wafer level is provided. The method includes the steps of forming a multilayered stack including a signal line on a first wafer; bonding a second wafer to the multilayered stack; polishing the first wafer to a predetermined thickness; forming a MEMS structure in a vacuum area of the first wafer and a pad outside the vacuum area, the MEMS structure and the pad being connected to the signal line; forming a structure in a third wafer to have space corresponding to the vacuum area of the MEMS structure; and bonding the third wafer to the polished surface of the first wafer in a vacuum state. For protection of the structure and maintaining a vacuum level required for operation, the fabricated structure is vacuum-packaged at the wafer level, thereby improving the yield of fabrication. In addition, since a special vacuum packaging process is not necessary, the fabrication can be simplified.

Method of fabricating micro electro mechanical system structure which can be vacuum-packed at wafer level

A micro inertia sensor fabrication method in which thick silicon bonded to glass is processed at a high sectional ratio, is provided. In this method, silicon is bonded to a glass substrate, the bonded silicon is polished to have a desired thickness, a silicon structure is formed by etching the polished silicon using an RIE method, and the silicon structure is separated from the bottom by selectively etching glass below the silicon structure via grooves in etched silicon. Since the thick silicon bonded to glass is processed at a high sectional ratio, the area and thickness of the silicon to be measured are increased. Also, this method is simple since only one mask is used.

Method for fabricating micro inertia sensor

Growing community of inventors

Suwon, South Korea

Seog-soon Baek