Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Samsung Led Co., Ltd.

Seog Moon Choi

Young Ki Lee

Sang Hyun Shin

Chang Hyun Lim

Kwang Soo Kim

Sung Jun Lee

Woong Lin Hwang

Ho Joon Park

Sang Hyun Choi

Sung Keun Park

Tae Hoon Kim

Tae Hyun Kim

Ji Hyun Park

Shan Gao

Yong Suk Kim

Yong Sik Kim

Hyoung Ho Kim

Ju Pyo Hong

Jung Eun Kang

Taek Jung Lee

Kyu Bum Han

Hyung Jin Jeon

Joon Seok Chae

Jong Man Kim

Young Soo Oh

Bum Sik Jang

Tae Gyu Ryu

Hye Sook Shin

Seung Wook Park

Jin Su Kim

Young Bok Yoon

Jong Woon Kim

Young Jin Cho

Seon Goo Lee

Jin Suk Son

Hyun Hong Kim

Young Hoon Kwak

Hong Seok Lee

Kyu Hwan Oh

Young Ho Sohn

Job Ha

Jae Cheon Doh

Sung Youl Choi

Bo Hyun Seo

Heung Soo Park

Yong Hui Joo

Alexander L'Vovich Zakgeym

A sensing device includes a fixed member, a rotation member disposed at both ends of the fixed member, a camera installed on the fixed member, and respective radar units installed on the rotation members, where the respective radar units are configured to sense respective objects at edges of a viewing angle of the camera and respective objects outside of the viewing angle of the camera.

Sensing device

An antenna apparatus includes a substrate, a transmission antenna disposed on the substrate, and an auxiliary substrate disposed in an upper portion of the transmission antenna and having a radio wave guide unit having a horn shape. The auxiliary substrate further includes an insulator and a second metal pattern disposed in the radio wave guide unit on the insulator.

Antenna apparatus

Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes first and second lead frames disposed to face each other; ceramic coating layers formed on a portion of a first surface of both or one of both of the first and second lead frames; and semiconductor devices mounted on second surfaces of the first and second lead frames.

Power module package and method for manufacturing the same

The present invention relates to a light emitting device package and a method of manufacturing the same. There is provided a light emitting device package including a metal core; an insulating layer formed on the metal core; a metal layer formed on the insulating layer; a first cavity formed by removing parts of the metal layer and the insulating layer to expose a top surface of the metal core; and a light emitting device directly mounted on the top surface of the metal core in the first cavity and further there is provided a method of manufacturing the light emitting device package.

Light emitting device package and method of manufacturing the same

An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.

Insulation structure for high temperature conditions and manufacturing method thereof

Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.

Method of manufacturing a hybrid heat-radiating substrate

Disclosed herein is a power module package, including: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being coupled with the first substrate such that a side surface in a thickness direction thereof is disposed on an upper surface of the first substrate.

Power module package and system module having the same

Disclosed herein is a 3D power module package, including: a power converting unit packaged to include a heat radiating substrate, a power device connected to the heat radiating substrate, and a lead frame; a controlling unit packaged to include a controlling unit substrate and IC and controlling devices mounted on an upper portion of the controlling unit substrate; and an electrical connecting unit electrically connecting the packaged power converting unit and the packaged controlling unit.

3D power module package

Disclosed herein is a semiconductor package. The semiconductor package includes: semiconductor elements, a first heat dissipation substrate formed under the semiconductor elements, a first lead frame electrically connecting the lower portions of the semiconductor elements to an upper portion of the first heat dissipation substrate, a second heat dissipation substrate formed over the semiconductor elements, and a second lead frame having a protrusion formed to be protruded from a lower surface thereof and electrically connecting the upper portions of the semiconductor elements to a lower portion of the second heat dissipation substrate.

Semiconductor package

Embodiments of the invention provide a method of manufacturing a printed circuit board, including: mounting a strip substrate on a fixing member; separating the strip substrate into unit substrates by performing a singulation process; attaching solder balls onto the unit substrates using a jig; and fixing the solder balls on the unit substrates by performing a reflow process. The method of manufacturing a printed circuit board is advantageous in that the solder balls can be accurately formed at the predetermined positions of the strip substrate because they are attached to the unit substrates after the warpage of the strip substrate was reduced by a singulation process.

Method of manufacturing printed circuit board

Disclosed herein is a semiconductor package substrate including a base substrate, a mounting member mounted on an upper portion of the base substrate, and an adhesive layer formed between the base substrate and the mounting member, wherein the adhesive layer includes a thermally conductive adhesive and a ductile adhesive formed at the outer circumference of the thermally conductive adhesive.

Semiconductor package substrate

Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames.

Power module package and method for fabricating the same

Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.

Heat-dissipating substrate and fabricating method thereof

Disclosed herein is a power module package including: a first substrate; a second substrate having a pad for connection to the first substrate formed on one side or both sides of one surface thereof and having external connection terminals for connection to the outside formed on the other surface thereof; and a lead frame having one end bonded to the first substrate and the other end bonded to the pad of the second substrate to thereby vertically connect the first and second substrates to each other.

Disclosed herein is a heat dissipation device for a power conversion module. The device includes a casing, a high-heat-dissipation heat sink and a circuit board. The casing includes a heat-dissipation fin unit which has heat dissipation fins arranged at positions spaced apart from each other by predetermined intervals. The casing has a mounting space therein. The high-heat-dissipation heat sink is installed in the mounting space of the casing. The circuit board is coupled to a lower surface of the casing. Therefore, the weight and size of the heat dissipation device can be reduced. In addition, the heat sink and the casing having the heat dissipation fins dissipate heat at the same time, thus enhancing the heat dissipation efficiency. Moreover, in an optimal design, the high-heat-dissipation heat sink is located at a position corresponding to a part which generates high heat so that the heat dissipation efficiency can be maximized.

Heat dissipation device for power conversion module

Growing community of inventors

Seoul, South Korea

Seog Moon Choi