Samsung Electronics Co., Ltd.

Seog Ho Lim

Dong Soo Lee

Chang Ho Shin

Sun Chul Kim

Young Kyung Kim

Jae Jun Bang

Ji Hyun Lim

Myoung Sun Ha

A method of fabricating a LED module includes preparing a circuit board, such that the circuit board includes a reflective laminate around a chip mounting region and an electrode pad in the chip mounting region, preparing a mask, such that the mask includes a protruding portion with a discharge hole, and the protruding portion is inserted into a space surrounded by the reflective laminate, dispensing solder paste onto the electrode pad using the mask, and bonding an electrode of a LED chip to the electrode pad of the circuit board using the solder paste.

Method of fabricating light emitting diode module

A light source module is provided. The light source module includes a substrate having a first surface on which a circuit portion is disposed, and a second surface disposed opposite thereto. The light source module further includes a plurality of light emitting devices mounted on the first surface of the substrate and electrically connected to the circuit portion, wherein the substrate is provided with a groove portion in the second surface thereof, and has a structure bent along the groove portion.

Light source module and backlight unit having the same

Growing community of inventors

Seongnam-si, South Korea

Seog Ho Lim