Samsung Electronics Co., Ltd.

Seo-hyun Cho

Jae-sik Min

Myung-song Jung

Kyong-il Kim

Yong-shik Park

Sung-joon Park

Byung-ha Park

Hyung-hyu Hwang

Myung-jong Kwon

Il Gyu Kim

Sang-wook Lee

Tae-Kyun Kim

Jae-cheol Lee

Tae-kyun Kim

Young-su Lee

Jeong-Seon Kim

Moo-Youl Kim

Jun-hyub Park

Sang-chul Koh

Keon Kuk

Sa-Yoon Kang

Young-Su Lee

Dong-kee Jung

Dae-Woo Son

Jae-cheal Lee

Sang-cheol Ko

A system and method of correcting an alignment error of an array inkjet head having a plurality of head chips to print a main scanning line can include determining a reference head chip, printing a plurality of reference lines in the main scanning direction to be separated from one another at a reference interval in a sub-scanning direction using the reference head chip, and printing a plurality of test lines which can be offset by a multiple m, where m is an integer, of a test interval with respect to the reference interval using other head chips, and determining one of the plurality of test lines that matches any of the plurality of reference lines of each of the head chips, and determining an amount of offset of the determined test line as an amount of offset of each head chip.

Method of correcting alignment error of array inkjet head

An ink cartridge includes a residual ink sensing unit having a simple structure of an upper electrode plate and a lower electrode plate to accurately detect a capacitance between the upper and lower electrode plate. Therefore, data of a remaining amount of ink is reliably measured, there is less possibility that an ink bag is damaged when the residual ink sensing unit is installed in the ink bag, and damage to the ink cartridge and defective printing due to unstable supply of ink and the missing of the time for replacing the ink cartridge are prevented.

Ink cartridge including a unit to sense a remaining amount of ink

A head of an inkjet printer is formed by bonding of a heater substrate and a nozzle plate. In order to bond the heater substrate where a heater thin film and a protecting film are vapor-deposited, and the nozzle plate where a nozzle is formed, an intermediate layer is formed by forming a thin film of glass on the heater substrate by vapor-depositing, and the nozzle plate is installed on the heater substrate. SiOis formed at an interface between the nozzle plate and the heater thin film due to heating and application of an electric field, and thus the nozzle plate and the heater substrate are bonded with an electrostatic force of SiO. The nozzle plate and the heater substrate are bonded by using the intermediate layer made of the thin film of glass instead of a general polymer as the bonding layer, thereby preventing swelling of the polymer and isolation of layers of the head occurring due to ink penetration into interfaces of the layers. Moreover, a bonding process is performed in wafer units to improve mass productivity.

Head of inkjet printer and method of manufacturing the same

A foam used in a print cartridge and a method of forming the same. The foam includes 0.1-5.0 wt % of silver nanoparticles, based on the total weight of the foam. The print cartridge has a deodorizing, antibacterial, and disinfectant function.

Foam, method of forming the foam, print cartridge including the foam, and printing apparatus including the print cartridge

An ink-jet printhead and a manufacturing method thereof include a substrate on which an ink chamber having a predetermined volume is formed, a passage for supplying ink to the ink chamber which is formed on a bottom of the ink chamber, a nozzle plate which includes a nozzle corresponding to a center of the ink chamber and at least two insulating layers formed on the substrate, a bubble guide formed inside the nozzle plate and extending from the nozzle into the ink chamber, and a heater which surrounds the nozzle and is disposed between the two insulating layers. A hydrophobic coating layer is formed on a surface of a uppermost layer of the nozzle plate, and a droplet ejecting portion that has a diameter smaller than that of the nozzle of the nozzle plate and is disposed on the same axis as the nozzle, is formed in the hydrophobic coating layer. The nozzle plate is prevented from becoming wet due to ink, stability of an ink spray and a consecutive spray performance are improved, and thus a printing quality and a printing performance of the ink-jet printhead are generally improved.

Ink-jet printhead with droplet ejecting portion provided in a hydrophobic layer

An ink cartridge includes a container body to accommodate an ink and having a pipe at a lower end through which the ink is discharged, an ink holding member disposed in the container body to absorb the ink, and a negative pressure generation part stepped with respect to a reference bottom side in the container body to increase a negative pressure by compressing the ink holding member as approaching an inlet of the pipe.

Ink cartridge

An ink-jet printhead includes a substrate on which an ink chamber is formed, and a nozzle plate to cover the ink chamber, having a nozzle through which ink droplets are ejected from the ink chamber, and formed of a stack of a multi-layer insulating layer. The ink-jet printhead also includes a heater buried in the nozzle plate to surround the nozzle, an interconnection layer buried in the nozzle plate to electrically connect to the heater, and a coating layer formed of photoresist on the nozzle plate and having a through hole-type droplet guide connected to the nozzle of the nozzle plate. The droplet guide is formed through the coating layer, which has a sufficient thickness, and enables a meniscus of ink to be rapidly restored and stabilized, and ink droplets to be ejected at a high speed and high frequency. Also, the ink-jet printhead has improved resistance to abrasion and chemicals.

Ink-jet printhead and method for manufacturing the same

An ink-jet printhead includes a substrate, a doughnut-shaped heater formed on the top surface of the substrate, an ink chamber barrier disposed on the substrate to enclose the heater, an ink chamber defined by the substrate and the ink chamber barrier, and an ink passage extending through the substrate in the perpendicular direction to the surface of the heater. The ink passage includes a narrow passage and a wide passage. The narrow passage communicates with the ink chamber. The ink passage concentrically communicates with an opening formed at the center of the heater and a nozzle. An ink introducing direction for supplying the ink into the ink chamber coincides with an ink ejecting direction for ejecting the ink from the nozzle, and the ink chamber barrier is disposed between the substrate and the nozzle plate.

Monolithic ink-jet printhead and method of manufacturing the same

A method of manufacturing an ink-jet printhead, including forming an insulation film on a substrate, depositing a metal layer onto said insulation film and patterning said metal layer to form a heater, forming an electrical wire on said substrate, etching said substrate at a predetermined depth from a top surface of said substrate in a direction perpendicular to a major surface of said heater to form a narrow passage, depositing an ink chamber barrier layer on said top surface of said substrate and patterning said ink chamber barrier layer to form an ink chamber, stacking a nozzle plate having a nozzle on said ink chamber barrier layer and disposed on an upper portion of said ink chamber barrier layer, and applying predetermined pressure and temperature onto said nozzle plate to bond said nozzle plate and said substrate, and etching said substrate from a bottom surface thereof to form a wide passage communicating with said narrow passage.

Method of manufacturing an ink-jet printhead

A flexible printed circuit board connected to a printer head having at least one heater discharging ink, the flexible printed circuit board including: at least one voltage supplying terminal selectively supplying an operating voltage to the at least one heater in response to receiving a printing command signal from a printer; at least one first cable connected at each end to the at least one voltage supplying terminal and at least one first bonding pad, respectively, transferring the operating voltage to the at least one heater; at least one grounded terminal; and at least one second cable connected at each end to the at least one grounded terminal and at least one second bonding pad, respectively, in which the at least one second cable is divided into at least two portions at a predetermined position and a first portion of the at least two divided portions is provided along one side of the at least one first cable, and a second portion of the at least two divided portions is provided along the other side of the first cable.

Flexible printed circuit board

Ink-jet printhead and manufacturing method thereof

An inkjet printhead and a manufacturing method thereof. The inkjet printhead includes a substrate, a substantially cylindrical ink chamber storing ink and formed in an upper portion of the substrate, and a manifold supplying ink to the ink chamber in a bottom portion of the substrate, a channel-forming layer disposed between the ink chamber and the manifold and having an ink channel communicating between the ink chamber and the manifold, a nozzle plate stacked on the substrate and having a nozzle at a location corresponding to the central part of the ink chamber, a heater formed to surround the nozzle of the nozzle plate, and electrodes electrically connected to the heater to supply current to the heater. Therefore, the quantity of ink stored in an ink chamber can be increased. Also, when bubbles grow, the cylindrical ink chamber confines an ink flow area to ink ejectors, thereby reducing a back flow of the ink. Further, the quantity of ink supplied to the ink chamber can be adjusted by varying the number of ink channels formed in the channel-forming layer, thereby improving frequency characteristics of the inkjet printhead.

Inkjet printhead and manufacturing method thereof

A method of manufacturing a head of an inkjet printer includes forming a heater on a substrate and also forming an ink feeding passage through the substrate in a vertical relation to a surface where the heater is formed, forming an ink chamber communicating with the ink feeding passage of the substrate; attaching the substrate to the nozzle plate, and forming a tapered nozzle in the nozzle plate, the tapered nozzle being narrower in diameter in an inside of the nozzle plate than an outside of the nozzle plate, by radiating a laser beam from inside toward the outside of the nozzle plate, wherein the substrate is used as a mask. Since the nozzle is formed by radiating the laser beam to the nozzle plate through the ink feeding passage of the substrate after attaching the nozzle plate to the substrate, the accuracy of the nozzle in form and position improves, and the nozzle of desirable structure of the improved ink discharge efficiency can be obtained by radiating the laser beam only once. Also, the manufacturing process becomes simpler, and due to improved manufacturing process, the productivity increases.

Method of manufacturing head of inkjet printer

A bonding apparatus and method thereof to bond the bonding portions of an FPC cable to pads of a print head die in order to electrically connect the print head die of an ink jet print head assembly include a stage and a bonding tool. The print head die includes resistive heaters, signal lines connected to the resistive heaters, and electrical pads to connect the signal lines to an outside of the print head die to the FPC cable having conductors having bonding portions facing the pads. The print head die is supported on the stage with the pads facing upward. The bonding tool includes a tip that press bonding portions of the FPC cable against corresponding pads of the print head die placed on the stage, and heats the bonding portions in contact with the pads to bond the bonding portion to the pads. The bonding tool includes a protrusion positioned to align with a position beyond the boundary of the print head die, and that extends lower than the tip, such that, during the bonding operation, the protrusion bends the FPC cable downward. In addition, during the bonding operation, the upper protective film of the FPC cable around the bonding portions are left intact to provide protective layer over the resulting bond, and thus results in less amount of encapsulation over the bond.

Growing community of inventors

Gyeonggi-do, South Korea

Seo-hyun Cho