Tokyo Electron Limited

Sensho Kobayashi

Shinji Wakabayashi

Keisuke Kondoh

Hiroshi Nakamura

Toshiaki Kodama

Takashi Horiuchi

Keita Kumagai

Gaku Ikeda

Masahide Itoh

Hisashi Gomi

Toru Yamauchi

Kazuya Uoyama

A substrate transfer chamber for unloading the substrates from the containers includes a housing-shaped main body and a plurality of container connecting mechanisms to which the containers are connected. In the main body, some of the container connecting mechanisms are arranged on top of one another in a height direction of the main body.

Substrate transfer chamber and container connecting mechanism with lid opening mechanisms

A support information display method is provided with an acquiring process for acquiring a first image by photographing, via a camera provided in a head mount display, a predetermined part of a substrate processing apparatus as a maintenance object, an estimating process for estimating the support information related to the predetermined part in the first image from information stored in a database, an image creating process for creating a second image by converting the support information estimated in the estimating process into an image, and a displaying process for displaying the second image on the head mount display in order for the operator to visually recognize the support information.

Support information display method, maintenance support method of substrate processing apparatus, support information display control apparatus, substrate processing system and recording medium

In this vacuum processing apparatus, four process modules and four load-rock modules are arranged in clusters around a two-stage conveyance vacuum chamber. In the apparatus, the entirety of the second stage of the vacuum conveyance chamber is a third vacuum conveyance area and the third vacuum conveyance area extends from the second stage to the first stage through an aperture to enter between first and second vacuum conveyance areas. A third vacuum conveyance robot has: left and right-side conveyance units, which can move straight in the depth direction in the second stage of the third vacuum conveyance area; and left and right-side conveyance units, which can move straight in the vertical direction, i.e. can move up and down, in the aperture of the vacuum conveyance area.

Vacuum processing apparatus

A load lock device includes a vessel of which an internal pressure is variable between a pressure corresponding to a vacuum chamber and an atmospheric pressure; a purge gas supply source configured to supply a purge gas into the vessel; an exhaust device configured to evacuate an inside of the vessel; a pressure controller configured to adjust the internal pressure of the vessel to be the pressure corresponding to the vacuum chamber and the atmospheric pressure; a cooling member within the vessel configured to cool a substrate while the substrate is placed adjacent thereto; a first purge gas discharging member configured to discharge the purge gas to flow in parallel with the substrate while controlling a turbulent flow thereof; and a second purge gas discharging member formed of a porous material and configured to discharge the purge gas toward a bottom surface of the substrate from below the substrate.

Load lock device

Disclosed is a substrate processing apparatus including: a housing section configured to house a substrate; a transfer chamber that includes a plurality of airtight chambers connected to the periphery thereof, and a transfer mechanism provided therewithin, each of the plurality of airtight chambers being configured to process the substrate under an airtight state, and the transfer mechanism being configured to transfer the substrate to and from the airtight chambers; a carry-in section configured to carry the substrate into the transfer chamber via a first opening provided in the transfer chamber; and a carry-out section configured to carry out the substrate discharged from a second opening provided at a different position from that of the first opening of the transfer chamber, to the housing section, without returning the substrate to the transfer chamber.

Substrate processing apparatus

A substrate processing apparatus includes a plurality of vacuum transfer modules including transfer mechanisms for transferring a substrate between a plurality of process modules arranged near the vacuum transfer modules that are configured to process the substrate under a reduced-pressure atmosphere; one or more load lock modules provided at each of the vacuum transfer modules; a first atmosphere transfer mechanism that transfers the substrate that is fed from outside to one load lock module; and a second atmosphere transfer mechanism that receives the substrate from the first atmosphere transfer mechanism and transfers the received substrate to another load lock module. The second atmosphere transfer mechanism is arranged above or below the vacuum transfer module that is provided with the one load lock module, and the vacuum transfer modules are arranged in series along a substrate transfer direction of the second atmosphere transfer mechanism.

An exhaust system for a film forming apparatus including an exhaust pipe passage connected to an exhaust port of the film forming apparatus for forming a film on a object by using vaporized gas of an organic metal compound. The film forming apparatus includes a pressure transfer unit provided for the exhaust pipe passage and arranged to transfer, through the exhaust pipe passage, gas in the film forming apparatus as exhaust gas. A cooling mechanism is provided for the pressure transfer unit and arranged to cool the pressure transfer unit to a temperature lower than a temperature, at which the organic metal compound is decomposed, so as to prevent precipitation of the organic metal compound contained in the exhaust gas introduced into the pressure transfer unit. A removing unit is disposed at an intermediate position of the exhaust pipe passage, downstream from the pressure transfer unit, so as to remove the organic metal compound contained in the exhaust gas which is introduced through the exhaust pipe passage.

Growing community of inventors

Yamanashi, Japan

Sensho Kobayashi