Atotech Deutschland Gmbh

Sengül Karasahin

Matthias Dammasch

Heiko Brunner

Lars Kohlmann

Hans-Jürgen Schreier

Marco Haryono

Simon Pape

Sandra Lucks

The present invention relates to a method for providing a copper seed layer on top of a barrier layer wherein said seed layer is deposited onto said barrier layer from an aqueous electroless copper plating bath comprising a water-soluble source for Cu(II) ions, a reducing agent for Cu(II) ions, at least one complexing agent for Cu(II) ions and at least one source for hydroxide ions selected from the group consisting of RbOH, CsOH and mixtures thereof. The resulting copper seed layer has a homogeneous thickness distribution and a smooth outer surface which are both desired properties.

Method for depositing a copper seed layer onto a barrier layer and copper plating bath

The present invention relates to additives which may be employed in electroless metal and metal alloy plating baths and a process for use of said plating baths. Such additives reduce the plating rate and increase the stability of electroless plating baths and therefore, such electroless plating baths are particularly suitable for the deposition of said metal or metal alloys into recessed structures such as trenches and vias in printed circuit boards, IC substrates and semiconductor substrates. The electroless plating baths are further useful for metallization of display applications.

Plating bath compositions for electroless plating of metals and metal alloys

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Berlin, Germany

Sengül Karasahin