Osram Opto Semiconductors Gmbh

Seng-Teong Chang

Choon Keat Or

Wai-Choo Chai

Lee-Ying Jacqueline Ng

Chai-Yun Jade Looi

Chong-Tee Ong

A method of producing an optoelectronic semiconductor device includes providing a frame part including a plurality of openings, providing an auxiliary carrier, connecting the auxiliary carrier to the frame part such that the auxiliary carrier covers at least some of the openings at an underside of the frame part, placing conversion elements onto the auxiliary carrier in at least some of the openings, placing optoelectronic semiconductor chips onto the conversion elements in at least some of the openings, applying a housing onto the conversion elements and around the semiconductor chips in at least some of the openings, and removing the frame part and the auxiliary carrier wherein a bottom surface of at least some of the optoelectronic semiconductor chips remains free of the housing.

Method of producing an optoelectronic semiconductor device

A method for producing an optoelectronic device is specified. A housing base body is formed with a self-healing polymer material. A recess is found in the housing base body. The recess is confined by a bottom surface and at least one side wall which are formed at least in places by the plastic material of the base body. An optoelectronic semiconductor chip has a first main surface, a second main surface facing away from the first main surface and at least one side surface connecting the first main surface and the second main surface with each other. The optoelectronic semiconductor chip is placed in the recess, so that the first main surface is brought in contact with the bottom surface and the at least one side surface is brought in contact with the at least one side wall.

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Penang, Malaysia

Seng-Teong Chang