Avago Technologies General IP (Singapore) Pte. Ltd.

Emcore Corporation

Avago Technologies Fiber IP (Singapore) Pte. Ltd

Foxconn Interconnect Technology Limited

Seng-Kum Chan

David J K Meadowcroft

Ye Chen

Bing Shao

Xiaozhong Wang

Laurence Ray McColloch

Paul Yu

David Meadowcroft

Chaitanya Arekar

Hui Xu

Edmond Lau

Robert Mosebar

Andrew Schmit

Li Ding

Ronald T Kaneshiro

Frank David Yashar

Joseph Scheibenreif

David Chak Wang Hui

Kit Cham

Matt Murphy

David J K Maedowcroft

A plug connector includes: a housing module having a mating end and including a first housing and a second housing assembled with the first housing to define a cavity therebetween; and a mating board received in the cavity and exposed to an exterior at a position close to the mating end; wherein the first housing has a main portion and a tongue extending from the main portion, the second housing has a receiving space receiving the tongue, and the tongue is deformed to latch within the receiving space.

Plug connector having a housing module with two housings interlocked by deformed tongue having two legs

An optical communications module is provided that has WDM capabilities for increased bandwidth and that is suitable for use with single mode optical fiber or multimode optical fiber. The module can be configured to have both WDM and BiDi functionality to further increase bandwidth and can have a single- or multi-channel configuration. The module has an integrally-formed body having an optical port and portions of an optical coupling system that are integrally formed in the body. The optical port is adapted to mate with an end of an optical fiber cable that holds one or more ends of one or more optical fibers, depending on whether the module is a single-channel or multi-channel module. The optical coupling system couples light between an end or ends of one or more optical fibers and one or more optoelectronic devices in a way that reduces back reflection and mode partition noise.

Wavelength division multiplexing and demultiplexing in optical communications modules, and methods

An adapter is provided for interfacing MOF connectors with one another where the MOF connectors have optical pathways that bend by a non-zero-degree angle (e.g., 90&#xb0;&#xb1;15&#xb0;) in between the ends of the optical fibers held in the connectors and the output facets of the connectors. The adapter is configured to mate with two such connectors and to bring their optical pathways into precise optical alignment with one another.

Adapter for interfacing optical fiber connectors with one another, and a method

In a bidirectional optical communications module, an optics system is provided having a lens block that uses a single surface for reflecting light into or reflecting light passing out of the end of the optical fiber and a single surface for reflecting light toward a monitor photodetector. No other surfaces in the lens block are used to turn the light path. A filter block of the optics system that is adjacent to the lens block performs wavelength multiplexing and demultiplexing. The filter block reflects light at either its lower or upper surface back toward the lens block. In some embodiments, a portion of light passes through the upper surface of the filter block to provide some attenuation of light being transmitted so that the light is not coupled back into the light source. Because the upper surface of the filter block is the topmost surface of the optics system, the optics system can be very compact while also limiting the number of surfaces that turn the light path. Limiting the number of surfaces in the optics system that turn the light path reduces optical losses and increases tolerance to optical misalignment.

Bidirectional optical communications module having an optics system that reduces optical losses and increases tolerance to optical misalignment

A plastic optical port of an optical communications module is equipped with an adapter having an inner diameter that adjusts to the outer diameter of a ferrule when the ferrule is mated with the optical port. In the mated configuration, the adapter creates an interference fit between the optical port and the ferrule that prevents or at least reduces relative movement between the optical port and the ferrule. Preventing or at least reducing relative movement between the ferrule and the optical port ensures that the distal end of the ferrule and the distal end of the fiber stub held within the port are maintained in precise optical alignment with one another. This, in turn, ensures high optical coupling efficiency for light being coupled between the distal end of the fiber stub and the distal end of the ferrule.

Optical communications module having an optical port that prevents relative movement from occurring between the optical port and a ferrule that is mated with the optical port

A fiber optic transceiver comprising a substrate, a heat dissipating structure, a receptacle and a light source is disclosed. The substrate may have a hole extending therethrough. The heat dissipating structure may be coupled to the substrate and may comprise a major surface, a plurality of fins, a projecting member, and a plurality of insulating protrusions. The plurality of fins may project from the major surface of the heat dissipating structure away from the substrate. The projecting member may extend partially or completely through the hole of the substrate. The plurality of insulating protrusions may extend substantially perpendicularly from the major surface of the heat dissipating structure and coupled to the substrate. The plurality of insulating protrusions may be configured to separate the major surface of the heat dissipating structure with the substrate so as to reduce heat transfer between the substrate and the heat dissipating structure.

Fiber optic transceiver with a heat dissipating structure

A heat dissipation system and method are embodied in an optical subassembly (OSA) that mechanically couples with an electrical subassembly (ESA) of an optical communications module. When the OSA is coupled with the ESA, a heat dissipation block that is embedded in the OSA is spaced apart from components of the ESA by a small air gap. At least a portion of the heat that is generated by one or more of these components passes into the heat dissipation block, which extends through top and bottom surfaces of the OSA. Because the heat dissipation block never makes physical contact with the ESA or with components of the ESA, there is no risk of the block damaging the ESA or detrimentally affecting the electrical performance of the module.

Heat dissipation device and method for use in an optical communications module

An optical communications module includes a receptacle with a stop member. The receptacle has a keyway and a latchway. The keyway is configured to receive and guide a body of the connector plug in a direction along a keyway axis. The latchway is defined by a total flexure range of the flexible latch arm between a fully flexed state and a fully relaxed state. The latchway is configured to receive and guide the flexible latch arm through a range of movement having a directional component perpendicular to the keyway axis. The stop member extends from a wall of the receptacle into the latchway. The stop member is configured to restrain the flexible latch arm in a latched state between the fully flexed state and the fully relaxed state.

Low-profile optical transceiver connector receptacle

Heat dissipation resources are allocated in an optical communications module based on the sensitivity of electrical and optoelectronic components of the module to temperature. Components that have a higher sensitivity to temperature are allocated a greater proportion of available heat dissipation resources than components that have a lower sensitivity to temperature. In addition, heat dissipation resources that are allocated to components that have different sensitivities to temperature are thermally decoupled from one another.

Methods and systems for dissipating heat in optical communications modules

A bidirectional optical communication system includes first and second transceivers arranged at opposed ends of an optical medium. Opto-electronic devices within the transceivers are arranged on respective mounting surfaces of planar substrates. First and second optical assemblies couple the respective transceivers to the optical medium. The optical assemblies include first and second optical elements arranged along an axis normal to the substrates. The first optical element is transparent to the optical signal transmitted from the respective transceiver and redirects the received optical signal from the other transceiver. The optical assemblies enable a single alignment of the opto-electronic devices and the optical medium.

Dual-wavelength bidirectional optical communication system and method for communicating optical signals

A socket is provided that is configured to be secured to a surface of a host circuit board by solder using a solder reflow process. The solder reflow process that is used for this purpose may be the same solder reflow process that is used to make electrical connections between the array of electrical contacts disposed on the lower surface of the socket and the array of electrical contacts disposed on the upper surface of the host CB. Because the solder reflow process is an automated process, the process of securing the socket to the surface of the host CB does not have to be performed manually, but can be performed automatically as part of a typical automated surface mount technology (SMT) process of the type that is typically used to mount components on a PCB.

Methods, apparatuses and systems for mid-plane mounting parallel optical communications modules on circuit boards

A heat dissipation solution is provided that is suitable for use in, but not limited to use in, CXP modules. The heat dissipation solution allows the performance of a CXP module to be significantly improved without having to increase the size of the heat dissipation device that is currently used with known CXP modules. The heat dissipation solution thermally decouples the heat dissipation path associated with the laser diodes from the heat dissipation path associated with other heat-generating components of the module, such as the laser diode driver IC and the receiver IC. Decoupling these heat dissipation paths allows the temperature of the laser diodes to be kept cooler as they are operated at higher speeds while allowing the temperatures of the other components to run hotter, if desired or necessary.

A package structure and methods of manufacturing the same are disclosed. The package structure corresponds, in one example, to a transceiver module having a substrate with a pocket formed therein. The pocket is configured to receive one or multiple parts of a leadframe and helps reduce the amount of wire bonding required to connect the leadframe or components mounted thereon to traces on the substrate.

Leadframe pocket

A connector cover includes a body having a lower recessed portion configured to receive a portion of a reflecting connector of a type that retains the ends of optical fibers therein and has a reflector that redirects or turns the optical signals. The body has an upper housing portion that covers the reflector when the reflecting connector is received in the lower recessed portion of the body. The body also has a pair of arms extending from a forward end of the body. Each arm has a distal end with an arm distal end engagement. The arms are configured to engage a portion of an optical transceiver module.

Optical module connector system and method

An array of optical devices includes singlets diced or separated from a first diced surface and a second diced surface of a semiconductor wafer. Each singlet includes a single optical emitter or a single photosensitive semiconductor device. The singlets are identified as operationally fit before being arranged in corresponding features in a receiving region of a submount. The corresponding features of the submount are arranged to align and precisely control the pitch or separation distance between optical portions of a desired number of singlets. The use of operationally fit singlets dramatically increases production efficiency as it is no longer necessary to identify N contiguous operational optical devices in a semiconductor wafer to produce a precisely aligned array of N operational optical devices.

Growing community of inventors

Santa Clara, CA, United States of America

Seng-Kum Chan