Stats Chippac Pte. Ltd.

Sell Jung

HeeSoo Lee

HunTeak Lee

OhHan Kim

YoungChul Kim

Oh Han Kim

Jae Han Chung

A semiconductor manufacturing device has a cooling pad with a plurality of movable pins. The cooling pad includes a fluid pathway and a plurality of springs disposed in the fluid pathway. Each of the plurality of springs is disposed under a respective movable pin. A substrate includes an electrical component disposed over a surface of the substrate. The substrate is disposed over the cooling pad with the electrical component oriented toward the cooling pad. A force is applied to the substrate to compress the springs. At least one of the movable pins contacts the substrate. A cooling fluid is disposed through the fluid pathway.

Cooling device and process for cooling double-sided SiP devices during sputtering

An integrated circuit packaging system, and method of manufacture therefor, includes: a substrate; a mold cap formed on the substrate; fiducial mark inscribed in the mold cap; a thermal interface material applied over the substrate and referenced by the fiducial mark; and a heat spreader, mounted on the thermal interface material, precisely positioned by a position notch aligned relative to the fiducial mark.

Integrated circuit packaging system with heat spreader and method of manufacture thereof

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Seoul, South Korea

Sell Jung