Mitsubishi Electric Corporation

Mitsubishi Denki Kabushiki Kaisha

Seizo Fujimoto

Masaaki Taruya

Takafumi Hara

Shinsuke Asada

Hiroshi Kobayashi

A X-Y plane is a plane parallel to abutting surfaces on which a joining portion is formed, and a Z direction is a direction perpendicular to the X-Y plane. A sealing member is held between the outer circumference side of a guide provided on a lid body and the inner circumference side of a rib provided on a case, and is pressed in a direction parallel to the X-Y plane. Laser light is scanned on the inner circumference side with respect to a ring-shaped pressurization jig with a stopper pressurized by the pressurization jig, so the pressurization jig does not break the path of the laser light. This expands the range of options in the material for the pressurization jig, which enables an easy-maintenance jig to be used, improving productivity.

Resin welded body and method for manufacturing the same

A temperature sensor is provided that can easily make possible stuffing with the filler or burying of the temperature detector element so that faster temperature response can be achieved. A temperature sensor has a closed-bottom tubular shaped case, a temperature detector element inserted and accommodated in the case, and a filler filled in the case and sealing the temperature detector element. The temperature sensor is provided with a filler flowing portion formed in a relative gap between the case and the temperature detector element along an insertion direction of the temperature detector element and having a gap relative to the temperature detector element larger than that relative to the remainder portion of the gap.

Temperature sensor

A resin welded body where a first resin part that is absorbent with respect to laser light and a second resin part that is transparent with respect to laser light are fitted together and the laser light is emitted to a predetermined position from the side of the second resin part to weld together the first and the second resin parts and form a joint portion between both resin parts, wherein on either the first or the second resin part there is disposed a projection that comes into contact with the other resin part during the welding and regulates the sinking amount at the joint portion.

Resin welded body and manufacturing method thereof

A welding method and welding apparatus for resin members is provided in which dimensional accuracy of two resin members after welding can be secured and reduction in joining strength due to excessive laser irradiation can be prevented. In a method of superimposing a resin having a laser-transmitting property and a resin having laser absorptiveness and irradiating the resin members with a laser beam from the side of the laser-transmitting resin member to deposit the resin members on each other, irradiation with the laser beam is ended in accordance with reduction in the approaching speed of the two resin members during the irradiation with the laser beam.

Welding method and welding apparatus for resin member

A method for producing a welded resin material contains steps of: superimposing a resin member having transmissibility to laser light and a resin member having absorptivity to laser light to form a contact part where the resin members are in contact with each other; forming a closed space that is adjacent to the contact part and faces one end of the contact part; and radiating the laser light from the resin member having transmissibility while pressing the resin members to each other through the contact part, so as to heat the contact part to melt a resin at the contact part, housing a resin excluded from the contact part through melting in the closed space, solidifying the resin melted at the contact part to weld the resin members.

Welded resin material

A mounting structure for a pressure sensor serves to facilitate easy attachment of the pressure sensor as well as easy detachment thereof without requiring any large work space. A pair of elastic snap fit portions () are formed on a surge tank () so as to protrude from a surface thereof, and have engagement protrusions () formed at their one end, respectively, so as to protrude to a side opposite to a case (). A pair of engaged portions () are formed on the case () so as to be engaged with the engagement protrusions (), respectively. The snap fit portions () are forced to flexibly deform to the pressure sensor () when the pressure sensor () is attached to and detached from the surge tank ().

Pressure sensor

A semiconductor pressure sensor is not influenced by a charged object in a fluid to be measured or an electric field from the outside, so satisfactory sensitivity and accuracy can be ensured. The semiconductor pressure sensor is provided with a diaphragmthat responds to the pressure of the fluid to be measured. The diaphragm includes a silicon substrate with piezoresistive elements, which together constitute a bridge circuit, being embedded therein, and a shield film for electromagnetic shielding formed on a surface of the silicon substrate at a side thereof at which the fluid to be measured is in contact with the silicon substrate. The shield film is electrically connected to the silicon substrate so as to have the same potential as that of the silicon substrate.

Growing community of inventors

Tokyo, Japan

Seizo Fujimoto