Denso Corporation

Seiya Watanabe

Eiichi Kobayashi

Tooru Higuchi

A punch unit is used in a powder press molding device that includes a die plate including a cavity in which a compacted powder pellet can be formed, the powder press molding device including a ram moving in a direction approaching the die plate and in a direction away from the die plate. The punch unit includes a punch inserted into the cavity of the die plate when the ram approaches the die plate, and a supporting portion supporting the punch reciprocatably, the punch unit being movable along a plane intersecting with the moving direction of the ram in a state where the punch is removed from the cavity. The punch unit is capable of shortening a distance in which the ram moves, and a cycle time can be shortened.

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Kariya, Japan

Seiya Watanabe