Yamaha Corporation

Nippon Gakki Seizo Kabushiki Kaisha

Seiya Nishimura

Tokuyoshi Ohta

Yoshihisa Maejima

Kenzaburou Iijima

Yoshinori Hayashi

Yoshihiko Murase

Toru Makino

Osamu Tomita

Masayoshi Takabayashi

Terumoto Nonaka

Makoto Hosokawa

Tadashi Imaizumi

Mitsuo Yamaguchi

Katsuyuki Yokoi

One object of the present invention is to provide a production method of a steering wheel in which divided bodies are securely integrated into a single unit without using adhesive. In order to achieve the object, the present invention provides a production method of a steering wheel comprising the steps of: a) providing a plurality of divided bodies , each of which comprises a surface material and a plastic layer provided on the inside of said surface material ; b) forming an outer shell by integrally welding said plastic layers of said divided bodies ; c) providing a core metal to be arranged in said outer shell ; and d) filling plastic between said outer shell and said core metal

Composite molded article, steering wheel and production method therefor

A steering wheel is manufactured by making a steering wheel core member by forming a first resin layer about a metal core bar, and then attaching outer parts to the outside of this core member.

Steering wheel and manufacturing method therefor

A lead frame for use in producing of a semiconductor integrated circuit comprises a lead frame member, a plurality of leads, a tie bar, a plurality of auxiliary leads, a support-stay portion and a connecting portion. A semiconductor element such as an IC chip is mounted on a semiconductor-element-mounting portion of the lead frame member, while the leads are arranged along and extending from a side portion of the lead frame member. The tie bar is connected among the leads and auxiliary leads at their tip-edge portions. Herein, the auxiliary leads are electrically unconnected from the semiconductor element. Further, the support-stay portion is provided at a corner portion of the lead frame member. The connecting portion is provided between a base-edge portion of the support-stay portion and a base portion of the auxiliary lead. A location of the connecting portion is selected in such a manner than the connecting portion will be unaffected by bending of the leads. In the electroplating of the leads, electric power is certainly applied to the auxiliary lead through the support-stay portion and connecting portion. In order to obtain an uniform thickness of the plated layer formed on the leads, the leads and auxiliary leads are arranged with generally equal spacing therebetween.

Lead frame

An electroplating apparatus carries out an electroplating on a work by using an insoluble anode for keeping the electrolyte clean, and, thereafter, makes up ionized metal into the electrolyte by respectively connecting a soluble anode and the insoluble anode with a positive electrode and a negative electrode, thereby preventing an operator from the make-up work.

Method of electroplating

Electroplating apparatus

A thermo-compression tool incorproated in an assembly/disassembly system melts solder films of conductive leads of an electric circuit componet for bonding the conductive leads to pads of a circuit board, and nozzles blow high-temperature nitrogen gas to the conductive leads during the bonding work for preventing the solder films from oxidization.

Thermo-compression assembly/disassembly system for electric circuit

An electroplating apparatus positively biases an anode with respect to a work dipped in an electrolyte in an electrolysis vessel for depositing metal on the work, and an inert ambience is created over the electrolyte so that the electrolyte is never oxidized.

Electroplating method and apparatus

A lead frame at least provides a semiconductor-element-mounting portion, plural leads and plural auxiliary leads. The auxiliary leads are arranged to be associated with plural leads, while a tie bar is provided and connected among the leads. According to a method of making the lead frame, an IC-chip mounting process, a wire-bonding process, a sealing process, a resin-cutting process and a dambar-cutting process are sequentially effected on the lead frame. After effecting the dambar-cutting process, a thin-plating process is effected so as to form a thin-plated layer, approximately having a thickness of 5 .mu.m to 15 .mu.m, on the leads. Then, the leads are bent by a predetermined bending process. Thereafter, a thick-plating process is effected so as to form an uniform thick-plated layer, approximately having a thickness of 15 .mu.m to 100 .mu.m, on the leads. After effecting the thick-plating process, a trimming process is effected on the leads. Incidentally, the thin-plating process can be effected after the bending process and before the thick-plating process.

Method of making lead frame

In constructoin of a magnetic recording medium provided with one circular track for magnetic graduations and another circular track for standard marks, the standard marks are accompanied with specified magnetic identification marks so that discrimination between the standard marks can be fairly done without any influence by the number of the standard marks only by reading them out together with the identification marks. The medium is advantageously used for displacement detectors such as magnetic rotary encoders and magnetic linear scales.

Magnetic recording medium for displacement detectors

In construction of a magnetic encoder used for detection of displacement of a mobile body, a circular magnetized pattern is formed on one longitudinal end face of a magnetic rotary spindle mechanically coupled to the mobile body, and a magnetic sensor faces the magnetized pattern with a prescribed gap. Direct formation of the magnetized pattern on the rotary spindle excludes production errors caused by the conventional coupling process and end-face magnetization assures significant compactness of the entire construction.

Compact magnetic encoder

In construction of a peripheral-magnetization type magnetic encoder having a rotary spindle and a magnetic head, a resin housing is formed by insert moulding so as to embrace the spindle leaving a slight tubular clearance to allow free axial rotation of the spindle, thereby providing direct, simple and stable support to the rotary spindle for enhanced precision in direction.

Magnetic encoder and a method for producing the same

A magnetoresistive detection head for detecting relative displacement of a magnetic recording medium relative to the detection head includes two sets of magnetoresistive elements which change their respective resistances in response to changes in the intensity of a magnetic field generated by the magnetic recording medium during the relative displacement. The magnetoresistive elements are overlapped and spaced relative to each other by a specified space lag in the direction of the relative displacement. One set of magnetoresistive elements produce a sine output and the other a cosine output. The overlapping and precise spacing of the elements aligns the phases of the signal envelopes of the sine and cosine outputs, reducing reading errors when physical warps appear on the magnetic recording medium.

Overlapped magnetoresistive displacement detecting transducers having

In construction of a golf club head having a fiber reinforced plastic shell, the neck section of the shell provides the first hold and an inward bulge on the sole side section of the shell provides the second hold, both for the club shaft so that presence of a dual hold joint structure enables effectual energy transmission at hitting balls and reliably prevents accidental separation of the club head from the club shaft.

Golf club head

A wood-type golf club head containing a fiber reinforced plastic outer shell formed by heat pressing in a mould, around an intermediate shell. A solid center core is formed inside the intermediate shell by injection of foam synthetic resin for reduced generation of harsh and keen noises at hitting balls, ideal transmission of striking energy to balls and high durability against shocks by hitting balls. The elastic modulus of the outer shell material is greater than that of the intermediate shell material. The buckling strength of the intermediate shell material is greater than that of the foam resin core material.

Growing community of inventors

Shizuoka, Japan

Seiya Nishimura