Nec Corporation

Nec Informatec Systems, Ltd.

Seishi Eya

Takahiro Yaguchi

Takashi Harada

Akira Wakui

Hideki Sasaki

Toshihide Kuriyama

Shunsuke Fujimoto

A device for estimating the required number of board layer to provide necessary wiring in a printed circuit board or a LSI package, a system including the device, a method and a program for estimating the same. In this system, positional information of pins mounted to each component and a board, and connection information between pins are retrieved from a pin positional information file and a net list file. Further, information about an order of layers to be added, a diameter of a via in respective layers and obstacles to wiring is retrieved from the net list file an added layer structure defining file. Thereafter, information about a layer structure, vias, an area where wiring is prohibited is stored in a storage. A wiring route searching section determines whether or not it is possible to form necessary wiring under the present structure. When the wiring route searching section determines it to be impossible, a layer in the next order is added according to information about added layers. Subsequently, the wiring route searching section judges the possibility again. When determining it to be possible, the wiring route searching section outputs the present layer structure to an output device. By this means, it becomes possible to estimate a layer structure and the number of layers.

Device for estimating number of board layers constituting board, system including the device, and method for estimating the same and program for executing the method

A printed circuit wiring board designing support device includes a layout data receiving section receiving printed circuit board layout data through an input/output section, a section for extracting structures of power supply/ground planes, a via hole extracting section for extracting a via hole interconnecting the wirings extending over power supply/ground planes, a capacitor extracting section for extracting a capacitor connected between power supply/ground planes, a distance measuring section for measuring the distance between the via hole and the capacitor, a database where the allowable distance value between the via hole and the capacitor in respect to the distance between the power supply and ground planes is recorded, an examination section for comparing the capacitor/via hole distance with the allowable distance value, and a warning section for issuing a warning when the distance between the via hole and the capacitor is larger than the allowable distance value.

Printed circuit wiring board designing support device, printed circuit board designing method, and its program

In a printed circuit board design support apparatus for supporting design of a printed circuit board by calculating a radiation amount of electromagnetic radiation caused by an interconnection on the basis of design information related to each of the printed circuit board having a ground plane, interconnections formed on the printed circuit board, and components to be mounted on the printed circuit board, an arithmetic unit calculates a common mode (CM) radiation amount of the interconnection on the basis of a CM radiation amount ratio that indicates a ratio of a common mode (CM) radiation amount of electromagnetic radiation caused by the ground plane in correspondence with the interconnection to a differential mode (DM) radiation amount of electromagnetic radiation caused by the interconnection. A printed circuit board design support method and program are also disclosed.

Printed circuit board design support apparatus, method, and program

Growing community of inventors

Kanagawa, Japan

Seishi Eya