Fujitsu Corporation

Seimi Sasaki

Kazunori Miura

Goji Nakagawa

Ryoichi Ochiai

Naoki Yamamoto

Kazuhiro Tanaka

Hideo Sumiyoshi

Nobuhiro Fukushima

Haruhiko Tabuchi

Masaaki Norimatsu

Seiichi Ikeda

Tsugio Kumai

Youske Yamazaki

Satoshi Tachibana

The present invention is an optical device achieving miniaturization, functional integration, and cost reduction, and comprises an optical element chip, an optical fiber assembly comprised of an optical fiber, a first ferrule, and a second ferrule, a package containing and enveloping the optical element chip and having an opening for introducing the optical fiber assembly, and a support pipe mounted on an extension of the opening to support an introductory part of the optical fiber into the package together with the second ferrule constituting the optical fiber assembly to be introduced into the package and to hermetically seal the package, wherein the second ferrule is fixed inside the support pipe, one end thereof protrudes toward an inner part of the package, and another end substantially protrudes at a tip part of the support pipe by a length required for the airtight fixing.

Optical device and manufacturing method thereof

An optical integrated device in which application of an excessive stress or the appearance of a crack due to thermal expansion mismatching is prevented. A first ferrule is fixed to an optical waveguide chip. An optical fiber is inserted into the first ferrule to fix the optical fiber. A package contains the optical waveguide chip and the first ferrule. An opening is made in a sidewall of the package to pull out the optical fiber to the outside. A pipe is airtightly fixed around the opening. A second ferrule is inserted into the pipe and is airtightly fixed to an end of the pipe. The optical fiber pulled out to the outside of the package through the opening is inserted into the second ferrule to fix the optical fiber. The optical fiber without deflection is contained in the package by making a first expansion/contraction amount created due to the thermal expansion of the package and the thermal expansion of the pipe match a second expansion/contraction amount created due to the thermal expansion of the optical fiber and the thermal expansion of the second ferrule.

Optical integrated device

A wavelength multiplexing bidirectional optical transmission module includes a transparent plate having first and second reflection surfaces opposing each other, a diffraction grating formed on a part of one of the first and second reflection surfaces and photoelectric transfer elements. The diffraction grating receives a wavelength-multiplexed optical signal composed of at least two light beams of proximate wavelength bands and produces diffracted light beams one for each wavelength at different angles. The photoelectric transfer elements receive the diffracted light beams, respectively, that have been reflected and propagated between the first and second reflection surfaces.

Wavelength-multiplexing bidirectional optical transmission module

A small-sized magnetic field generator which is suitable for mass production and provides better output stability. A plurality of coils are formed on a non-magnetic insulating material by depositing at least one layer of conductive film in a spiral pattern. A hollow is made in the center of each coil, so that a plurality of main magnetic cores are arranged on the insulating substrate, with their ends fit into those hollows. By supplying appropriate electrical signals to drive the coils individually, their combined magnetic field can be controlled to have an arbitrary distribution. This combined magnetic field is applied to a magneto-optical target device held on the insulating material.

Magnetic field generator for optical devices utilizing magneto-optical effect

An optical transmission module including a substrate having a substantially trapezoidal first groove, an optical device mounted on the substrate for performing conversion between light and electricity, and a ferrule having a center hole and received in the first groove so as to be supported by beveled wall surfaces defining the first groove. An optical fiber is inserted and fixed in the center hole of the ferrule. The ferrule is cut away at a portion opposed to a bottom surface of the first groove.

Optical transmission module

An optical module including a lead frame having a plurality of leads, a substrate mounted on the lead frame and having a plurality of conductive patterns, an optical element mounted on the substrate for making conversion between light and electricity, a sleeve placed on the substrate and having a front end adjacent to the optical element, and a first resin for encapsulating the optical element. The first resin has transparency to the light related to the optical element. The first resin is formed with a convex portion closing the front end of the sleeve. The conductive patterns of the substrate are connected through wires to the leads of the lead frame, respectively. The optical module further includes a molded second resin for enclosing all of the substrate, the optical element, the sleeve, the first resin, the wires, and the lead frame except a part of the sleeve and a part of each of the leads.

Optical module encapsulated with resin and manufacturing method therefor

An optical module includes a mounting board, an optical element, an optical fiber having an optical axis, the optical fiber inserted in the mounting board to align the optical axis with the optical element, and a positioning mark provided to position the optical element on the mounting board. The mounting board has a groove provided in the middle of the mounting board and extending in a direction of the optical axis of the optical fiber, the groove enclosing the optical fiber when inserted. The groove has a vertical wall which is perpendicular to the direction of the optical axis and confronts a leading edge of the optical fiber when inserted. The positioning mark is located adjacent to an internal edge of the groove where the vertical wall is provided on the mounting board.

Optical module for connecting optical element and optical fiber

An optical transmission terminal device including a printed wiring board and an optical module mounted on the printed wiring board. The optical module includes an optical component mounting substrate, a photoelectric converter mounted on the substrate, a first optical fiber having one end optically coupled to the photoelectric converter, and a ferrule mounted on the substrate so as to partially project from the substrate. The other end portion of the first optical fiber is inserted and fixed in the ferrule. A wiring pattern formed on the printed wiring board and a feed electrode formed on the substrate are connected together by wire bonding. An optically coupled portion between the photoelectric converter and the first optical fiber and a connected portion between the wiring pattern and the feed electrode are commonly covered with a transparent resin. The optical transmission terminal device further includes an optical fiber connector housing mounted on the optical module for allowing connection of the first optical fiber to a second optical fiber.

Optical transmission terminal device

A photoreception device includes an oblique surface on a semiconductor substrate for causing a deflection of an optical beam incident thereto and a photodetection region provided on a first side of the semiconductor substrate for detecting the deflected optical beam, the photodetection region including a first electrode, wherein the photoreception device further includes a second electrode for biasing the photodetection region an a second, opposite side of the semiconductor substrate.

Optical module including a photoreception device

An optical transmission module which can provide hermetic sealing with reliability, is low in cost and excellent in mass productivity and a method of producing such an optical transmission module is provided. A sealing material is affixed to a cover section in advance. The sealing material is in the form of a film formed by screen printing along the joining portion between a body section and the cover section and having a thickness matching the amount of gap between the body section and the cover section at the joining portion. A conversion device is received in a recess of the body section, and an optical fiber is inserted into the body section from outside along a stepped portion and connected to the conversion device. With the cover section placed on the body section, the two are heated. As the sealing material, soldering paste is used, for example.

Optical transmission module and a method of producing the same

In an optical parts fixing device of the present invention, a substrate has an extension groove formed on an optical fiber fixing groove and has a width wider than that of the optical fiber fixing groove, or a substrate has the third groove which crosses end portions, opposed to each other, of the first groove for fitting an optical fiber therein and the second groove for fitting an optical device therein.

Optical parts fixing apparatus and method of manufacturing the same

An optical link module connection system for connecting an optical fiber to an optical link module that performs conversion between an electrical signal and an optical signal. The system is aimed at reduction of the manufacturing cost of printed circuit boards containing those fiber-optic products by allowing an automated soldering process to be applied thereto. The system will also facilitate the product handling as well as storage and improve the board space utilization by shortening the length of the optical fiber. While optoelectronic conversion means comprises a first ferrule, coupling means consists of a second ferrule, a split sleeve, etc. The first ferrule is inserted into the split sleeve in the coupling means so as to contact the second ferrule, thus completing an optical path between a first optical fiber and a second optical fiber. The optoelectronic conversion means will be soldered to a printed circuit board before being joined to the coupling means. That is, when soldering the printed circuit board, the second optical fiber having only a poor heat resistance is not yet mounted on the board, thus allowing automated soldering equipment to be used for the process.

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Kawasaki, Japan

Seimi Sasaki