Tdk Corporation

Seiko Komatsu

Takaaki Morita

Seiichi Tajima

Kenichi Kawabata

Wakiko Sato

A multilayer board insulating sheet contains a reducing agent.

Multilayer board insulating sheet, multilayer board, and method of manufacturing multilayer board

A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.

Printed wiring board, multilayer printed wiring board and method for manufacturing printed wiring board

A manufacturing method of electronic module components according to the present invention includes: forming a plurality of module components on a principal surface of a substrate; forming a groove by dicing between the module components; spraying a conductive paste toward the principal surface of the substrate; and separating the module components. The spraying is performed so that an angle formed between a spray direction and the principal surface is an angle &#x3b8;. The angle &#x3b8; is set so as to satisfy the following expression (1), assuming that a depth of the groove is D and a width of the groove is w. The expression (1) istan(/2)&#x2266;&#x3b8;&#x2266;tan(2)

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Tokyo, Japan

Seiko Komatsu