Matsushita Electric Industrial Co., Ltd.

Seiki Yamaguchi

Satoru Takahashi

Kouji Takada

Yoshihiro Mori

Yoshiaki Hachiya

Ryuma Hirano

Yuji Yamanishi

Seiji Sogo

Yuji Ueno

In a semiconductor switch, a voltage detection circuit is provided so as to be in parallel with a first switching element for turning on/off a power supply to a load, in which a voltage detection portion for detecting a drain voltage of the first switching element by dividing a voltage upon a resistance ratio or the like and a second switching element are connected in series to each other. The second switching element is turned on/off in accordance with ON/OFF of the first switching element. Accordingly, detection of a drain voltage is performed normally when the first switching element is in an ON state. When the first switching element is in an OFF state, a leakage current can be reduced by the second switching element.

Semiconductor switch having a voltage detection function

A load driving device capable of preventing thermal destruction even when a load short-circuit or an overcurrent occurs, thereby having improved reliability, is provided. A load driving device, in which a power switch element for driving a load and a circuit for controlling the power switch element according to a signal V supplied from the outside are formed on one chip, is provided with an OFF-time delaying circuit for delaying an OFF-time transition of a level of an input signal at which the power switch element makes the transition from an ON state to an OFF state, according to a result of detection of a current flowing through the load and the level of the input signal to the power switch element.

Load driving device

The semiconductor device of the present invention includes: a semiconductor layer of a first conductivity type; source and drain regions of a second conductivity type, which are formed within the semiconductor layer; a channel region provided between the source and drain regions; and a gate electrode formed over the channel region. The device further includes: a buried region of the first conductivity type, at least part of the buried region being included in the drain region; and a heavily doped region of the second conductivity type. The heavily doped region is provided at least between a surface of the semiconductor layer and the buried region. The concentration of a dopant of the second conductivity type in the heavily doped region is higher than that of the dopant of the second conductivity type in the drain region.

Semiconductor device and method for fabricating the same

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Shiga, Japan

Seiki Yamaguchi