Aisin Aw Co., Ltd.

Ngk Insulators, Inc.

Fuji Electric Device Technology Co., Ltd.

Nakamura Mfg. Co., Ltd.

Aisini Aw Co., Ltd.

Seiji Yasui

Kazuo Aoki

Junji Tsuruoka

Shuhei Ishikawa

Nobuaki Nakayama

Ken Suzuki

Tsutomu Mitsui

Hiroyuki Takeuchi

Yasushi Kabata

Shin Soyano

Makoto Miyahara

Takahiro Ishikawa

Masayuki Shinkai

Hideyuki Miyahara

Masaharu Kumagai

A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other surface of the base plate.

Semiconductor module and inverter device

A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other surface of the base plate. The coolant flow paths are formed such that coolant flows in a coolant flow direction.

A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other.

A heat generating member cooling structure in which a coolant space is formed between a heat releasing surface that is thermally connected to a heat generating member and an opposing surface that is positioned opposite the heat releasing surface, includes a plurality of heat releasing fins that are provided within the coolant space so as to be parallel to one another and stand from the heat releasing surface toward the opposing surface, and an inter-fin passage, through which a coolant flows, formed between every two of the plurality of heat releasing fins that are positioned adjacent to each other.

Heat generating member cooling structure and drive unit

An electronic circuit device includes a lower-side substrate formed with a main circuit; an upper-side substrate formed with a drive control circuit that drivingly controls the main circuit; a support body positionally fixed above the lower-side substrate with resin in a hardened state; and a case having a peripheral portion with an outer surface that has at least a portion of an external lead-out terminal of the drive control circuit and the main circuit thereon, and a substrate storage space that accommodates the lower-side substrate on a side inward from the peripheral portion.

Electric circuit device and the manufacturing method

Heating element cooling structure and drive device having the cooling structure

A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the intermediate layer by a third active hard brazing material, and a circuit board joined to the insulating board by a fourth active hard brazing material. The first through fourth active hard brazing materials are supplied such that the active hard brazing materials have a thickness ranging from 3 to 20 &#x3bc;m when the components of the heat spreader module are joined together under pressure, and contain an active element in an amount ranging from 400 to 1000 &#x3bc;g/cm.

Heat spreader module

A composite material includes an SiC porous ceramic sintered body, which is formed by preliminarily sintering a porous body, having a coefficient of thermal expansion lower than the coefficient of thermal expansion of copper to construct a network therein. A copper alloy impregnating the porous ceramic sintered body includes copper and one or more additive elements which are prepared to impart a coefficient of thermal conductivity of 160 W/mK or higher to the composite material. The additive elements include up to 5% of at least one element selected from Be, Al, Si, Mg, Ti, Ni, Bi, Te, Zn, Pb, Sn, and mish metal, and also contain unavoidable impurities and gas components.

Composite material

Graphite is placed in a case, and the case is set in a furnace. The interior of the furnace is subjected to sintering to produce a porous sintered member of graphite. After that, the case with the porous sintered member therein is taken out of the furnace, and is set in a recess of a press machine. Subsequently, molten metal of metal is poured into the case, and then a punch is inserted into the recess to forcibly press the molten metal in the case downwardly. Open pores of the porous sintered member are infiltrated with the molten metal of the metal by the pressing treatment with the punch.

Heat sink material and method of manufacturing the heat sink material

A mass of graphite is placed into a case, and the case is put into a furnace (step S). The space in the furnace is heated to produce a porous sintered body of graphite (step S). Thereafter, the case with the porous sintered body contained therein is removed from the furnace, and put into a cavity in a press (step S). Then, a molten mass of a metal is poured into the case (step S), and a punch is inserted into the cavity to press the molten metal into the porous sintered body in the case (step S).

Growing community of inventors

Nagoya, Japan

Seiji Yasui