Toyoda Gosei Co., Ltd.

Sumita Optical Glass, Inc.

Seiji Yamaguchi

Yoshinobu Suehiro

Hiroki Watanabe

Kazuya Aida

Koji Tasumi

Naruhito Sawanobori

Masaaki Ohtsuka

Hiroshi Ito

Hiroyuki Tajima

Satoshi Wada

Miki Moriyama

Takashi Nonogawa

Takayoshi Yajima

Katsunori Arakane

Hiroko Sakaji

A light-emitting device includes a circuit board including a wiring on a surface of a substrate, the wiring including a raised portion, and a light-emitting element mounted on the raised portion. When the light-emitting element is of a flip-chip type, an element electrode thereof is connected to the raised portion such that an edge of the element electrode on an outer periphery side of the light-emitting element is located outside of the raised portion in a top view and an exposed portion of the element electrode is covered with a white or transparent resin. When the light-emitting element is of a face-up type, an element substrate thereof is bonded to the raised portion such that the raised portion is located inside the element substrate in the top view and an exposed portion of a bottom surface of the element substrate is covered with a white resin.

Light-emitting device and method of manufacturing the same

To prevent cracks on a sealing glass or a substrate in a LED package in which a light-emitting device is sealed with a sealing glass. The LED package comprises a substrate, a LED mounted on the substrate, and a sealing glass for sealing a LED formed on the substrate. A wiring pattern being connected to an electrode of the LED is formed on the surface of the substrate. A back electrode pattern is formed on the rear surface of the substrate. A columnar via is formed in the substrate. Thus, the wiring pattern on the surface of the substrate and the back electrode pattern on the rear surface of the substrate are electrically connected. A softening point of the substrate is set higher than softening point of the sealing glass.

LED package

A method of manufacturing a light-emitting device includes a hole forming process for forming a through-hole that continues from a front surface to a back surface of a mounting substrate, a pattern forming process for continuously forming a circuit pattern on an inner surface of the through-hole in the mounting substrate, from an end portion of the through-hole on the front surface of the mounting substrate to a mounting portion of a light-emitting element, and on a periphery of the through-hole on the back surface of the mounting substrate, a mounting process for mounting the light-emitting element on the mounting portion, and a hot pressing process in that an inorganic material softened by heating is placed on the surface of the mounting substrate and is advanced into the through-hole while sealing the light-emitting element by pressing and bonding the inorganic material to the surface of the mounting substrate.

Light-emitting device, method of manufacturing the same, method of mounting the same and lighting device

A method of manufacturing a light-emitting device including a light-emitting element mounted on a substrate and sealed with a glass. The method includes heating the glass by a first mold that is heated to a temperature higher than a yield point of the glass, the glass contacting the first mold, and pressing the glass against the light-emitting element mounted on the substrate supported by a second mold to seal the light-emitting element with the glass.

Method of manufacturing light-emitting device

The light emitting devicecomprises a mounting substrate, LED chipsflip-chip bonded on the mounting substrate, and a glass sealing membermade of a plate-shaped glass material that seals the LED chipsformed on the mounting substrate. Here, the glass sealing memberis in a state in which fine voids are almost evenly dispersed and distributed between the powder grains of the glass material, and the powder grains are connected with each other, and the fine bumps/dipsare almost evenly dispersed and distributed on the surface of the glass sealing member

Light emitting device and manufacturing method of the same

A method of manufacturing a light-emitting device includes arranging a plate-shaped glass on a light-emitting element mounting surface of a substrate having a light-emitting element mounted thereon, arranging a metal thin plate on the plate-shaped glass so as to sandwich the plate-shaped glass between the substrate and the metal thin plate, placing the substrate, the plate-shaped glass and the metal thin plate between a first mold on a side of the substrate and a second mold on a side of the metal thin plate, hot-pressing the substrate, the plate-shaped glass and the metal thin plate by using the first mold and the second mold to seal the light-emitting element with the plate-shaped glass, and after cooling the plate-shaped glass, removing the thin plate adhered to the plate-shaped glass from the plate-shaped glass.

A method of making a light emitting device, includes a mounting and a light emitting element on a substrate; hot-pressing a glass material on the light emitting element to form a glass sealing portion for sealing the light emitting element; and forming a phosphor layer on a surface of the glass sealing portion.

Light emitting device including a sealing portion, and method of making the same

A method of manufacturing a light-emitting device includes, when sealing a light-emitting element on a mounting portion by a glass material softened by heating or when processing the glass material after the sealing, producing a concave portion partially on the glass material by partially contacting and pressing a die against an upper surface of the glass material such that a part of the upper surface being not in contact with the die is deformed and forms a curved surface.

A solid state device has a solid state component, a power receiving/supplying portion that mounts the solid state component thereon for receiving/supplying electrical power from/to the solid state component, and a glass sealing portion that seals the solid state component. The glass sealing portion is formed of a BO&#x2014;SiO&#x2014;LiO&#x2014;NaO&#x2014;ZnO&#x2014;NbObased glass, which is composed of 21 wt % to 23 wt % of BO, 11 wt % to 13 wt % of SiO, 1 wt % to 1.5 wt % of LiO, and 2 wt % to 2.5 wt % of NaO.

Solid state device

A method of making a light emitting device includes mixing a glass powder with a phosphor powder including at least one of a sulfide phosphor, an aluminate phosphor and a silicate phosphor to produce a mixed powder in which the phosphor powder is dispersed in the glass powder, heating and softening the mixed powder to provide an integrated material, and subsequently solidifying the integrated material to provide a phosphor-dispersed glass, and fusion-bonding the phosphor-dispersed glass onto a mounting portion on which a light emitting element is mounted by hot pressing, and simultaneously sealing the light emitting element with the phosphor-dispersed glass on the mounting portion.

Method of making phosphor containing glass plate, method of making light emitting device

A light emitting device includes a light emitting element, a substrate with a flat mounting surface for mounting the light emitting element thereon, a sealing part for the light emitting element on the mounting surface of the substrate. The sealing part is formed of glass including a phosphor to be excited by light emitted from the light emitting element to radiate a wavelength conversion light. The sealing part is shaped like a rectangular solid wherein a lateral length is defined as a distance between a center of a bottom surface of the sealing part bonded to the mounting surface and a side face perpendicular to the mounting surface, a vertical length is defined as a distance between the mounting surface and a top surface of the sealing part, and at least one of the lateral length is longer than the vertical length. The device further includes a transparent member formed on the top surface of the sealing part. The transparent member includes the phosphor at a concentration higher than the sealing part.

Light emitting device and light emitter

A solid-state element device having: a solid-state element; a power receiving/supplying portion for mounting thereto the solid-state element, and receiving/supplying a power from/to the solid-state element; and a wavelength converting portion having a phosphor layer formed inside a sealing glass having the same coefficient of thermal expansion as that of the power receiving/supplying portion for sealing the solid-state element, the phosphor layer being obtained by mixing a glass and a phosphor with each other, and melting the glass.

Solid-state element device and light-emitting apparatus using same

A solid-state element has: a semiconductor layer formed on a substrate, the semiconductor layer having a first layer that corresponds to an emission area of the solid-state element to and a second layer through which current is supplied to the first layer; a light discharge surface through which light emitted from the first layer is externally discharged, the light discharge surface being located on the side of the substrate; and an electrode having a plurality of regions that are of a conductive material and are in ohmic-contact with the second layer.

Solid-state element and solid-state element device

A solid-state optical device includes a solid-state element, a power supplying/retrieving portion on which the solid-state element is mounted, the power supplying/retrieving portion supplying or retrieving electric power to/from the solid-state element, and a glass sealing material that seals the solid-state element. The glass sealing material has a thermal expansion coefficient equivalent to that of the power supplying/retrieving portion. The glass sealing material includes a PO&#x2014;AlO&#x2014;ZnO-based low-melting glass that includes 55 to 62 wt % of PO, 5 to 12 wt % of AlOand 20 to 40 wt % of ZnO in weight %.

Solid-state optical device

A lighting device having: a light-emitting diode lamp having a light-emitting diode device sealed by a glass sealing part; and a fluorescent layer disposed on the side of an illuminated object of the light-emitting diode lamp. The fluorescent layer is operable to radiate a wavelength-converted light by being excited by light emitted from the light-emitting diode device.

Growing community of inventors

Aichi-ken, Japan

Seiji Yamaguchi