Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Seiji Tsuda

Shogo Nakayama

Hiroyuki Yamada

Takeshi Iseki

Masato Hashimoto

Kazutoshi Matsumura

Akio Fukuoka

Takashi Watanabe

Kenji Senda

Toshiyuki Iwao

Tomoyuki Washizaki

Shoji Hoshitoku

Naohiro Takashima

Kazutosi Matumura

Takumi Shirai

Shoji Mori

A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.

Resistor and method for manufacturing same

In a method of manufacturing a resistor, a sheet-shaped resistive element having formed thereon a plurality of belt-shaped electrodes is cut in a direction crossing these belt-shaped electrodes to produce strip-shaped resistive elements. On the other hand, a metal paste containing a glass frit is printed in a pattern of belts arranged at regular intervals on a surface of a plate-shaped insulating substrate to form a plurality of adhesive layers. Then, the strip-shaped resistive elements are respectively applied to the adhesive layers on the plate-shaped insulating substrate, and these are fired in a nitrogen atmosphere. After firing, while a resistance value of a part between each adjacent two electrodes of each strip-shaped resistive element is measured, the strip-shaped resistive element is trimmed so that the resistance value becomes a predetermined value. Then, the plate-shaped insulating substrate having adhered thereto the strip-shaped resistive elements is divided into pieces.

Resistor and manufacturing method for same

A surface mount current fuse of the present invention includes a first base which has a recess and is smaller in width at the other end than at one end in the longitudinal direction, and a second base which has the same shape as the first base. The first base and the second base are combined to form a box-shaped body by joining the lower surface of the second base to the upper surface of the upper surface of the first base in such a manner that one end of the first base and the other end of the second base are in contact with each other. The recess of the first base and the recess of the second base form a space portion in which to dispose an element portion. The borderline between the first base and the second base passes through the center point on a side surface of the body. As a result, the surface mount current fuse has high production efficiency.

Surface-mount current fuse

The present invention relates to a resistor and a manufacturing method of the same. The invention aims at providing the resistor and the manufacturing method thereof that can reduce a soldering area that occupies a mount area, when the resistor is mounted on a mount board. In order to achieve the foregoing object, a resistor comprises a substrate ( ), a pair of first upper surface electrode layers ( ), each provided on a side portion of an upper surface toward a portion of a side surface of the substrate ( ), a pair of second upper surface electrode layers ( ) provided in a manner to make electrical connections with the first upper surface electrode layers ( ), a resistance layer ( ) provided in a manner to make electrical connections with the second surface electrode layers ( ), and a protective layer ( ) provided to cover at least an upper surface of the resistance layer ( ). The invention realizes the electrodes on side surfaces of the resistor to have a small surface area because of the pair of first surface electrode layers ( ) on side portions of an upper surface toward portions of side surfaces of the substrate ( ), thereby attaining a reduction of the actual mount area on the mount board, including soldering portions.

Resistor and method of manufacturing the same

A pair of upper electrode layers,, connected to resistor layer,, is formed with a gold system electro-conductive material containing glass frit on the side portion towards the edge of the upper surface of substrate,. The adhesive strength of which electrode layer to the substrate,is strong enough and the electrode layer withstands a thermal stress and a corrosive environment. A resistor thus manufactured maintains its superior electrical characteristics with a high operational reliability even in the harsh operating environment where there is a thermal amplitude lasting for a long term, in a corrosive atmosphere, etc.

Resistor

The present invention is to offer a resistor which can be mounted exactly on the terminals disposed on a circuit board regardless the sides of the resistor, and to offer its manufacturing method by forming the surface of the side-electrode layer at a height higher than the surface of protection layer, or by forming the surface of the second surface electrode layer at a height higher than the surface of protection layer. By these, the resistor can be mounted exactly on the terminal of circuit board at a high yield. Furthermore, since the first surface electrode layer and the second upper electrode layer are electrically connected together through a window provided on the protection layer, a higher connection reliability can be obtained.

Resistor and its manufacturing method

A resistor comprising a substrate, a pair of first top electrode layers disposed at least on the top face of the substrate, a resistance layer disposed so as to electrically connect with the first top electrode layers, a protective layer disposed so as to cover at least the resistance layer, and a pair of second top electrode layers disposed at least on the top faces of the pair of first top electrode layers. At least one of the pairs of first top electrode layers or second top electrode layers partially extends to the substrate side faces.

A high precision chip resistor having a low resistance and a small TCR is obtained. This chip resistor includes an insulating substrate, a resistive layer made of a Cu--Ni alloy formed at least on one face of the insulating substrate, and end face electrodes provided on a pair of end faces of the insulating substrate facing each other so as to be connected to the resistive layer. The resistive layer is formed by heat-treating a plating layer containing Cu and Ni at high temperature. The end face electrodes are formed by metal thin film deposition technique at low temperature. A method for producing the chip resistor is also provided.

Growing community of inventors

Fukui, Japan

Seiji Tsuda