Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Seiji Tokii

Masato Udaka

Atsushi Yamaguchi

Arata Kishi

Naomichi Ohashi

Manabu Tasaki

A mounting structure for an electronic component and a method for mounting the electronic component are provided with a sufficient reinforcing effect for the relatively tall electronic component raised from a substrate. The mounting structure and the mounting method can easily respond to a change of the shape of the electronic component. In a mounting structure, a substrateand an electronic componentraised on the substrateare joined with bonding metaland a reinforcing resin bodyis bonded to the substrateand the electronic component. The reinforcing resin bodyincludes a plurality of reinforcing resin layers. The reinforcing resin layersconstituting the reinforcing resin bodyare stacked in the height direction of the raised electronic componentalong a sideof the electronic componentso as to be raised from the substrate

Mounting structure and method for supplying reinforcing resin material

A semiconductor package component () is mounted on a substrate () in such a manner that an electrode () of the substrate () and an electrode of the semiconductor package component () are brought into contact with each other through a joining material (). A reinforcing adhesive () is applied between the substrate () and the outer surface of the semiconductor package component (). Then, reflow is performed to melt the joining metal () with the reinforcing adhesive () uncured. After the reinforcing adhesive () is cured, the joining metal () is solidified.

Mounting method and mounting structure for semiconductor package component

An electronic component package includes: an insulating carrier substrate; a connection wiring that is provided on one side of the carrier substrate; an IC chip that is connected to the connection wiring; an external connection land that is disposed on the other side of the carrier substrate and is connected to the connection wiring via a wiring in the carrier substrate; and a solder ball that is disposed on the external connection land. A region of the external connection land that can be bonded to the solder ball has an outer shape that includes at least one arc portion and at least one straight portion. With this configuration, it is possible to provide an electronic component mounted apparatus in which bonding failure of the external connection land and the circuit board-side land with the solder ball can be reduced, and the bonding state can be easily inspected, and a method of inspecting a bonding portion therein.

Electronic component package, electronic component mounted apparatus, method of inspecting bonding portion therein, and circuit board

The present invention provides a printed circuit board capable of sufficiently ensuring joint strength and joint reliability when mounting a surface mounted device, and a mounting structure for a surface mounted device using the printed circuit board. A BGA package as a surface mounted device includes a plurality of solder balls arranged thereon and a printed circuit board includes a plurality of mounting pads corresponding respectively to the plurality of solder balls. The BGA package is connected to the mounting pads on the printed circuit board due to melting of the solder balls, thereby mounted on the printed circuit board. A concave via hole is formed on each of the mounting pads having a circular surface shape and a part of the solder ball is in the convex via hole. Here, the center of the convex via hole is apart from the center of each of the mounting pads by at least the diameter of the concave via hole.

Growing community of inventors

Hyogo, Japan

Seiji Tokii