Mitsuba Corporation

Other

Seiji Shioiri

Yasushi Yoshida

Takashi Hoshino

Takao Ochiai

Hiroshi Sakai

Yuichi Nagase

Hideyuki Ogawa

Tetsuya Furutatsu

The invention provides to make an automatic opening and closing apparatus for a vehicle to be thin. An outer rack is attached to an outer side of a stay fixed to a vehicle in such a manner as to freely move in an axial direction along the stay. A thickness of the stay is set to be smaller than a width, and a cross sectional shape thereof is formed so as to be in a substantially thin convex shape. A width in a base end wall portion of the outer rack is formed so as to be larger than a width of a side surface wall portion corresponding to a thickness of the outer rack, and the outer rack is formed in a substantially thin C cross sectional shape. It is possible to make a thickness of a slide mechanism about a gear with of rack gears lined up in an axial direction in the side surface wall portion by making the width of the side surface wall portion slightly larger than the gear width of the rack gear.

Automatic opening and closing apparatus for vehicle

An appearance of a vehicle is improved by reducing an opening formed in an interior trim for vehicle. An actuator unit is mounted in a pillar of the vehicle, and a linking rod is linked to a rack bar, which linearly reciprocates along an axial direction provided at this actuator unit. This linking rod protrudes from the pillar through the opening formed in an interior trim, and the other end thereof is linked to a back door. Moreover, this actuator unit is disposed so that a moving direction of the rack bar inclines on a vehicle-rear side by an opening/closing inclination angle &agr; with respect to a direction perpendicular to the vehicle and inclines inward in a vehicle-width direction by a width inclination angle.

Automatically opening and closing system for vehicle

An improved printed circuit board which can reduce or eliminate unsatisfactory soldering caused by trapped gas in surface mounting electronic components by flow soldering is disclosed. According to the invention, the printed circuit board comprises an electrically conductive pattern having a plurality of connection pads to which leads of electronic components are to be connected; and a solder resist layer formed over said electrically conductive pattern and having a plurality of windows which expose said connection pads, wherein at least one of said windows has an extension exposing an additional part of said pad, said extension being substantially narrower than said window. The extension allows the additionally exposed part of the pad to contact with the solder even when the associated pad is almost entirely covered by the trapped gas, so that the solder is pulled to the pad and spread over the pad. Because the extension require a small area, it is effective even when the components are mounted at a high density.

Printed circuit board for flow soldering

Growing community of inventors

Kiryu, Japan

Seiji Shioiri