Mitsubishi Gas Chemical Company, Inc.

Seiji Shika

Takuya Suzuki

Yune Kumazawa

Kenji Ishii

Yoshihiro Kato

Shunsuke Katagiri

Yasumasa Norisue

Daisuke Ohno

Yoshinori Kondo

Yoshinori Mabuchi

Mitsuru Nozaki

Keiichi Hasebe

Naoki Kashima

Michio Nawata

The compound (A) is represented by formula (1).RO—R—OR  (1) (In formula (1), each Rindependently represents a group represented by formula (2), or a hydrogen atom, and Rrepresents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms, provided that at least one Ris a group represented by formula (2).) (In formula (2), -* represents a bonding hand.).

Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

A resin composition of the present invention contains: a maleimide compound (A) having a transmittance of 5% or more at a wavelength of 405 nm (h-line); a particular carboxylic acid containing compound (B); and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).

Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

A compound (A) of the present invention is represented by the formula (1): wherein each Rindependently represents a group represented by the formula (2) or a hydrogen atom, and each Rindependently represents a hydrogen atom or a linear or branched alkyl group having 1 to 6 carbon atoms, provided that at least one Ris a group represented by the formula (2); and wherein -* represents a bonding hand.

Compound and method for producing the same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

A resin composition of the present invention is a resin composition containing a bismaleimide compound (A) containing a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain, at least one resin or compound (B) selected from the group consisting of a maleimide compound other than the bismaleimide compound (A), a cyanate compound, a benzoxazine compound, an epoxy resin, a carbodiimide compound, and a compound having an ethylenically unsaturated group, and a photo initiator (C): wherein Rrepresents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; Rrepresents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; each Rindependently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms; and each n independently represents an integer of 1 to 10.

Provided is a resin composition which has good solubility and photocurability, further has good alkaline-developability when containing a photo initiator and a compound containing one or more carboxyl groups, and in addition, is capable of providing a resin sheet having suppressed tackiness; and a resin sheet, multilayer printed wiring board, and semiconductor device using the same. The resin composition of the present invention contains a particular bismaleimide compound (A), and at least two maleimide compounds (B) selected from the group consisting of six kinds of particular compounds which are different from this bismaleimide compound (A).

The resin composition of the present invention is a resin composition containing: a bismaleimide compound (A) containing a constituent unit represented by the following formula (1) and maleimide groups at both ends of the molecular chain; a compound (B) containing one or more carboxy groups; and a photo initiator (C). In the formula (1), Rrepresents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. Rrepresents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. Each Rindependently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms. Each n independently represents an integer of 1 to 10.

The resin composition of the present invention contains a maleimide compound (A) represented by the following formula (1); and a photo initiator (B) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).  In the formula (1), R, R, and Reach independently represent an alkyl group or an alkoxy group which may have a hydrogen atom, a halogen atom, a hydroxyl group, or a substituent, Rrepresents an alkylene group, an alkenylene group, an alkoxylene group, or an arylene group which may have a substituent, and Rand Reach independently represent a hydrogen atom, a linear or branched alkyl group having 1 to 6 carbon atoms, or a linear or branched alkenyl group having 1 to 6 carbon atoms.

A resin composition of the present invention contains: a maleimide compound (A) having a maleimide functional group equivalent of 300 g/eq. or more, and a transmittance of 1% or more at a wavelength of 405 nm (h-line); a maleimide compound (B) having a maleimide functional group equivalent of less than 300 g/eq.; and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).

A resin composition forms a roughened surface with low roughness on an insulating layer regardless of roughening conditions when used as an insulating layer of a printed wiring board, and is excellent in adhesion between the insulating layer and a plated conductor layer, and also has low thermal expansion coefficient (linear expansion coefficient) and high glass transition temperature and is also excellent in moist heat resistance. The resin composition includes an epoxy compound, a cyanate ester compound and an inorganic filler, wherein the cyanate ester compound is at least selected from a naphthol aralkyl type cyanate ester compound, an aromatic hydrocarbon formaldehyde type cyanate ester compound, a biphenyl aralkyl type cyanate ester compound and a novolak type cyanate ester compound; and the content of the epoxy compound is 60 to 75% by weight based on the total amount of the epoxy compound and the cyanate ester compound.

Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil clad laminate, and printed wiring board using same

A resin composition for a laminate, containing at least 10% by weight of a vinyl compound represented by the formula (1), and a prepreg and a metal-clad laminate using the resin composition. 

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Tokyo, Japan

Seiji Shika