Nihon Dempa Kogyo Co., Ltd.

Seiji Oda

Mitoshi Umeki

Hiroshi Uehara

Susumu Negishi

Tatsunobu Shibuya

Xinglong Gong

Yasuo Sakaba

Toshikatsu Makuta

Keisuke Hirano

Masaaki Arai

Masayoshi Okazaki

A crystal unit includes: a crystal blank in which a depression which function as a vibration region is formed; first and second excitation electrodes formed on both principle surfaces, respectively, of the crystal blank in the vibration region; first and second extending electrodes provided so as to extend from the first and second excitation electrodes, respectively, toward the outer periphery of the crystal blank; and a receptacle body. Bonding of the first extending electrode with eutectic alloy at one point of the outer periphery of the crystal blank electrically and mechanically connects the crystal blank to the receptacle body with the one point as the fixed end. The second extending electrode extends as far as the position of the fixed end and is electrically connected to the receptacle body by wire bonding at the position of the fixed end.

Quartz crystal unit and holding structure for same

In a crystal oscillator having a crystal blank, and an IC chip having integrated therein an oscillation circuit, the crystal blank has a first excitation electrode disposed on its first principal surface, and an extension electrode extended from the first excitation electrode to a peripheral region of the crystal blank, and folded back to the second principal surface. A first and a second crystal connection terminal are disposed on a first principal surface of the IC chip, and the second crystal connection terminal extends to a central region on the first principal surface of the IC chip to constitute a second excitation electrode. The extension electrode is secured to the first crystal connection terminal through a bump, such that the second principal surface of the crystal blank opposes the first principal surface of the IC chip, thereby holding the crystal blank in parallel with the first principal surface of the IC chip. The crystal blank is excited by the first and the second excitation electrodes.

Surface mount crystal oscillator

A high-frequency quartz crystal unit includes a quartz crystal blank having a hole defined in at least one principal surface thereof, providing a resonating region in a portion of the crystal blank which is made thinner by the hole, excitation electrodes disposed respectively on opposite principal surfaces of the crystal blank in the resonating region, extension electrodes extending respectively from the excitation electrodes to respective first and second positions on an outer peripheral portion of the crystal blank, and a casing. The crystal blank has a fixed end electrically and mechanically connected to the casing by eutectic alloy in the first position. The crystal blank has a free end on which the extension electrodes are electrically connected to the casing by wire bonding in the second position.

Crystal unit and holding structure of crystal unit

A crystal unit has a crystal blank having a hole defined in at least one principal surface thereof, the crystal blank having a region of a reduced thickness including the hole, the region serving as a vibrating region, excitation electrodes disposed respectively on opposite principal surfaces of the crystal blank in the vibrating region, extension electrodes extending respectively from the excitation electrodes to respective opposite ends of one side of the crystal blank, and a casing having a step formed therein. The opposite ends of the one side of the crystal blank are fixed to the step by a joining member. The crystal blank has a notched portion defined therein between the one side and the vibrating region, the notched portion extending from at least one transverse edge of the crystal blank in a transverse direction of the crystal blank.

Crystal unit

A surface mounting quartz-crystal oscillator having a container body formed with a recess of which a pair of opposite sidewalls are provided with steps, a quartz blank, an IC (integrated circuit) chip constituting an oscillating circuit including a quartz crystal member made of the quartz blank, and a cover closing the container body for sealing the quartz blank and the IC chip within the container body. At least one of the both ends of the quartz blank is bonded to the bottom face of the recess, and the opposite ends of the IC chip are held to the steps. A space is defined between the IC chip and the bottom face of the recess for permitting at least a part of the quartz blank to be disposed in the space.

Surface mounting quartz-crystal oscillator

There is provided a crystal oscillator in which a crystal blank and an integrated circuit (IC) chip are accommodated in a vessel and the IC chip is fixed through a bump to the bottom surface of the vessel by means of ultrasonic thermocompression bonding. The IC chip contains an oscillation circuit utilizing the crystal blank and has a plurality of terminal electrodes on a major surface thereof. A plurality of connection terminal portions are formed on the bottom surface of the concave portion of the vessel so that each of the connection terminal portions corresponds to one of the terminal electrodes. Each of the connection terminal portions is formed into a rectangular shape and the width of each connection terminal portion is identical. The terminal electrodes and the connection terminal portions are bonded to each other through a bump by means of ultrasonic thermocompression bonding. Thus, the IC chip is fixed to the bottom surface of the concave portion of the vessel.

Crystal oscillator and method of bonding IC chip useful for fabricating crystal oscillator

There is provided a crystal oscillator including a vessel main body having a concave portion, a cover bonded to the vessel main body so as to form an encapsulated vessel together with the vessel main body, a crystal blank held within the vessel, an IC (integrated circuit) chip containing an oscillating circuit utilizing the crystal blank and having a plurality of IC terminals on a major surface thereof, a plurality of circuit terminals formed on a bottom surface of the concave portion of the vessel main body at positions corresponding to the positions of the IC terminals, respectively. The IC chip is fixed to the bottom surface of the concave portion of the vessel main body by effecting face down bonding so that the IC terminals are bonded to the circuit terminals through bumps. At least one of the IC terminals is a group-arranged terminal including a plurality of unit terminals commonly connected to one another, and the plurality of unit terminals are s connected to corresponding circuit terminals through respective bumps.

Growing community of inventors

Saitama, Japan

Seiji Oda