Mitsubishi Shindoh Co., Ltd.

Seiji Noguchi

Takeshi Suzuki

Tadao Sakakibara

Takao Fukatami

Takuya Idoshita

Yutaka Koshiba

Rensei Futatasuka

Shunich Chiba

Toyoaki Orikasa

A copper alloy consists essentially by weight percent of 0.5 to 3% Ni, 0.5 to 2.5% Sn, 0.05 to 0.9% Si, 0.1 to 2% Zn, 0.025 to 0.25% Fe, and the balance of Cu and inevitable impurities. The inevitable impurities include C in an amount of not more than 10 ppm. The obtained copper alloy possesses improved hot rollability and exhibits excellent adhesion strength of a plated surface thereof when heated, while having satisfactory strength and platability.

Copper alloy having excellent hot rollability and excellent adhesion

A copper-based alloy connector excellent in electrical conductivity, adherence of solder of the connector when bent, high-temperature creep strength, and migration resistance, consists essentially by weight percent of 0.5 to 3% Ni, 0.1 to 0.9% Sn, 0.08 to 0.8% Si, 0.1 to 3% Zn, 0.007 to 0.25% Fe, 0.001 to 0.2% P, and the balance of Cu and inevitable impurities. The copper-based alloy connector can withstand use for a long term in a high-temperature and high-humidity environment.

Copper-based alloy connector for electrical devices

Growing community of inventors

Aizuwakamatsu, Japan

Seiji Noguchi