Denso Corporation

Tdk-micronas Gmbh

Seiji Nishimoto

Yoshiyuki Kono

Akitoshi Mizutani

Tomoyuki Takiguchi

Masahiro Yamamoto

Yoshinori Inuzuka

Akimasa Niwa

Takahiro Iwamura

Camillo Pilla

Ninh Duc Hoang

Kohei Shinomiya

Toshiyuki Koumori

A magnetic field detection device includes an IC package, a terminal, a resin mold member. The IC package includes a magnetism detection element, a lead frame located on a first side of the magnetism detection element, and a resin member covering the magnetism detection element and the lead frame. The resin mold member includes a base portion and a head portion. The head portion includes a thickest portion. An outer wall surface of the thickest portion located on a second side of the magnetism detection element is a detection reference surface. An element corresponding surface that is an outer wall surface of the IC package located on the second side is exposed to an outside of resin mold member or covered with a detection side thin portion thinner than a thickness from the element corresponding surface to the detection side reference surface.

Magnetic field detection device

A transistor drive circuit drives a bipolar-type transistor and a MOSFET that are connected in parallel to each other. A temperature detection element that detects a temperature of a the bipolar-type transistor or the MOSFET. When the temperature is equal to or less than a threshold, the transistor drive circuit turns on both of the MOSFET and the bipolar-type transistor. When the temperature exceeds the threshold, the transistor drive circuit turns on only the bipolar-type transistor.

Transistor drive circuit and motor drive control apparatus

A method for manufacturing semiconductor devices is provided. The method includes bonding a semiconductor element to a first surface of a planar lead frame, clamping a partial area of the lead frame to hold the lead frame and the semiconductor element in molding dies, and covering at least a part of the lead frame and the semiconductor element with a resin member by resin molding which fills the molding dies with resin. A thin-walled portion having a relative small thickness is previously formed on a shortest virtual line connecting a clamp area of the lead frame to an area where the semiconductor element is bonded.

Method for manufacturing semiconductor devices

A sensor module is adapted to be attached to an actuator body incorporating an electric actuator. The sensor module includes a sensor assembly, a sensor cover, and a connector housing. The sensor assembly includes a sensor detection part and a sensor housing. The sensor detection part is configured to detect a physical change amount of a driven body driven by the electric actuator and to convert the physical change amount into an electrical signal. The sensor housing incorporates the sensor detection part. The sensor cover is provided separately from the sensor housing and is attached to the actuator body. The sensor module is configured integrally by attaching the sensor assembly to the sensor cover. A connector terminal electrically connected to a connection terminal of the sensor detection part is insert-molded in the connector housing. The connector housing is provided integrally with the sensor housing.

Sensor module

A rotation angle and stroke amount detection device includes a sensor unit, a rotation angle calculation unit, and a stroke amount calculation unit. The sensor unit includes sin and cos sensors which are magnetic sensing elements that detect changes in a magnetic field caused by rotation or linear displacement of a detection target. The sensor unit outputs sin and cos signals based on detection values of the sin and cos sensors. The rotation angle calculation unit calculates a rotation angle of the detection target based on the sin and cos signals output by the sensor unit. The stroke amount calculation unit calculates a stroke amount of the detection target based on the same signals as those used by the rotation angle calculation unit, i.e., the sin and cos signals. Accordingly, the configuration of the sensor unit may be simplified and the physical size of the device may be reduced.

Rotation angle and stroke amount detection device

A magnetic flux emission unit is mounted on a detection object and rotatable integrally with the detection object. An IC package includes a magnetism detection element, which sends a signal according to change in a magnetic flux caused when the magnetic flux emission unit rotates. A cover member includes a bottom portion and a tubular portion. The tubular portion is extended from an outer periphery of the bottom portion. The cover member surrounds the magnetic flux emission unit with the bottom portion when mounted to the housing. A support portion is projected from the bottom portion toward an opening of the tubular portion to support the IC package. A projection is projected toward the opening from the bottom portion to at least a position corresponding to the magnetism detection element.

Growing community of inventors

Kariya, Japan

Seiji Nishimoto