Mitsui Minings & Melting Co., Ltd.

Seiji Nagatani

Takuya Yamamoto

Hiroshi Watanabe

Masahiko Nakano

Kazufumi Izumida

Kenichiro Iwakiri

Object is to provide a surface-treated copper foil free from chromium in the surface-treatment layer and excellent in peel strength of a circuit and chemical resistance against to degradation of the peel strength after processing into a printed wiring board. To achieve the object, the surface-treated copper foil having a surface-treatment layer on a bonding surface of a copper foil for manufacturing a copper-clad laminate by laminating it to an insulating resin substrate has the surface-treatment layer formed by depositing a metal component having high melting point not lower than 1400&#xb0; C. by dry process film formation method to the bonding surface of the copper foil after the cleaning treatment and further depositing a carbon component to the surface.

Surface-treated copper foil

An object of the present invention is to provide a copper foil with carrier sheet which permits releasing of the carrier sheet from the copper foil layer even when hot pressing at a temperature exceeding 300&#xb0; C. is applied in the production of a printed wiring board. In order to achieve the object, a copper foil with physically releasable carrier sheet having a copper foil layer on the surface of the carrier sheet through a bonding interface layer, characterized in that the bonding interface layer is composed of a metal layer and a carbon layer. It is preferable for the bonding interface layer to be composed of a metal layer of 1 nm to 50 nm thick and a carbon layer of 1 nm to 20 nm thick.

Copper foil with carrier sheet, method for manufacturing copper foil with carrier sheet, and surface-treated copper foil with carrier sheet

An electrodeposited copper foil with carrier foil on which a resin layer for forming an insulating layer is formed, comprising a carrier foil, a bonding interface layer, an electrodeposited copper foil with smooth surfaces on both sides and a resin layer. The resin layer is composed of 20 to 80 parts by weight of an epoxy resin and a curing agent, 20 to 80 parts by weight of a solvent soluble aromatic polyamide resin polymer and optionally a curing accelerator in a suitable amount.

Electrodeposited copper foil with carrier foil on which a resin layer for forming insulating layer is formed, copper-clad laminate, printed wiring board, method for manufacturing multilayer copper-clad laminate, and method for manufacturing printed wiring board

To reduce warping of a copper clad laminate coated with copper foils of different thicknesses on both sides, and thereby to improve production efficiency of the printed-wiring boards, there is provided a copper clad laminate coated with copper foils of different thicknesses on both sides, wherein a first copper foil on one side of the laminate is not recrystallizable by hot pressing for production of said laminate and a second foil on the other side is recrystallizable by the hot pressing and thicker than the first foil.

Copper clad laminate

The object is to provide copper foil of high adhesion even when the roughness Rof a nodular surface of the copper foil is low, and a method of manufacturing the copper foil. To achieve this object, there is adopted a copper foil which is characterized in that an area coefficient C(S), which is defined by A(S)/B(S) from a three-dimensional surface area A(S), which is obtained by performing three-dimensional measurement of a surface area of a nodular surface of a copper foil sample S under a laser microscope, and from a measuring region area B(S), which is an area of a measuring region of the three-dimensional surface area A(S), and a roughness R(S) of a nodular surface of the copper foil sample S, which is measured by a stylus-type roughness meter, have a relationship of equation (1) below, and in that the roughness R(S) is 1.0 &#x3bc;m to 3.0 &#x3bc;m,0.5&#xd7;()+0.5&#x2266;()&#x2003;&#x2003;(1)where R(S) is a numerical value represented by &#x3bc;m.

Copper foil and method of manufacturing the same

The present invention provides electrodeposited copper foil with a carrier foil which permits the formation of finer-pitch circuits and also enables the multilayer process to be easily performed to meet the requirements for recent printed wiring boards. According to the invention, there is provided electrodeposited copper foil with a carrier foil in which an adhesive interface layer is formed on a surface of the carrier foil and an electrodeposited copper foil layer is formed on the adhesive interface layer, which is characterized in that the electrodeposited copper foil layer is provided with a passivated layer formed without performing roughening treatment as nodular treatment and that a nickel-zinc alloy consisting essentially of 50 to 99% nickel by weight and 50 to 1% zinc by weight is adopted as the passivated layer.

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Ageo, Japan

Seiji Nagatani