Matsushita Electric Industrial Co., Ltd.

Seiji Mizuoka

Toshihiko Tsujikawa

Kazumasa Okumura

Masao Nagamoto

Akira Kobayashi

Junichi Hada

Kazuhiro Ikurumi

Kenji Okamoto

Masanori Yasutake

Noriyuki Suzuki

Masaru Ichihara

Nobutaka Taira

Haruko Kubota

Akira Kobayasi

Youichiro Ueda

Brightness information of, for example, an average value of brightnesses at an X-ray image of a first connected part when an electronic component is mounted onto only one face of a printed board is obtained. Binary images of an X-ray image of the board with the electronic components mounted to both faces are formed by an upper and a lower levels relative to the brightness information. The binary images are synthesized with each other so as to extract an image of only a second connected part. The image of only the second connected part can be obtained in this manner on the basis of the X-ray image of the double face-mounted board, so that an accuracy for connection inspection is improved. Also, a relationship between a density in the X-ray image of the connected part and a thickness of the connected part is obtained beforehand, based on which a plurality of thickness images are obtained for a plurality of X-ray images of different image storage times. The connected part can be inspected by synthesizing the images.

Connection inspecting apparatus, connection inspecting method, and recording medium for recording programs executing the method

An inspecting apparatus is arranged on an electronic component mounting line for inspecting whether a mounting state of the component mounted on a printed circuit board by a mounting apparatus in a precedent process or a printing state of a cream solder by a cream solder printing apparatus in a precedent process is non-defective or defective. The inspecting apparatus includes an input device for taking data of the mounting state of the component to be inspected or the printing state of the cream solder to be inspected, a comparing device for comparing the data of the mounting state or the printing state input through the input device with an absolute decision criterion having a predetermined allowable range to decide whether the mounting state or the printing state is non-defective or defective and an operating state criterion which is within and narrower than the allowable range of the absolute decision criterion, and a deciding device for deciding an operating state of the mounting apparatus or the cream solder printing apparatus in the precedent process based data within the absolute decision criterion and outside the operating state criterion. An automatic position setting device is operable for setting a relative position of a metal mask and the printed circuit board. Further, a method for inspecting printing states of cream solders includes setting a window in a picked up image, performing color extraction of an element within the window and detecting predetermined patterns, calculating positions and/or areas of the elements, and deciding a defective or nondefective state by comparing the calculated position and/or area with respective reference data.

Inspecting apparatus of mounting state of component or printing state of

A mounting state of a component mounted on a printed circuit board with adhesive is inspected by an apparatus which includes an image pick-up unit for picking up in colors an image of the board after the component is mounted, a color extracting part for discriminating an adhesive portion of the image based on a predetermined color distribution of the adhesive and then extracting the adhesive portion as extracted data, a cutting part for setting a window frame for a to-be-inspected portion in the image of the board relative to the extracted data so as to detect bulging of the adhesive, and cutting out data within the window frame, and a deciding part for deciding, based on the cut data, a presence/absence of the bulging of the adhesive from a size or an area of a portion in the window frame which shows a color within the color distribution of the adhesive.

Inspecting apparatus of mounted component

An inspecting apparatus is arranged on an electronic component mounting line for inspecting whether a mounting state of the component mounted by a mounting apparatus in a precedent process or a printing state of a cream solder by a cream solder printing apparatus in a precedent process is non-defective or defective. The inspecting apparatus includes an input device for taking data of the mounting state of the component to be inspected or the printing state of the cream solder to be inspected, a comparing device for comparing the data of the mounting state or the printing state input through the input device with an absolute decision criterion having a predetermined allowable range to decide whether the mounting state or the printing state is non-defective or defective and an operating state criterion which is within and narrower than the allowable range of the absolute decision criterion and a deciding device for deciding an operating state of the mounting apparatus or the cream solder printing apparatus in the precedent process based the data which is both within the absolute decision criterion and outside the operating state criterion.

A position recognizing device receives and stores image information denoting tones or gradations of an image of a target object. Projection data is synthesized from the image information and the projection data is normalized using a maximum value thereof. A run position and a run length of the normalized projection data at a predetermined slice level are detected, and a position of the target device is detected based on the run position and the run length.

Position detecting device using run position and run length of

A method in which the position of an object pattern in an image can be accurately detected is disclosed. The method comprises the steps of: (a) preparing a reference pattern which has a pattern and a background which are composed of pixels each having a value regarding the brightness or gradation; (b) dividing the image into a plurality of sections; (c) selecting arbitrarily an area having two or more of the sections; (d) obtaining the brightness data from each of the sections; (e) obtaining a sum of products of the value of each pixel and the brightness data of each section corresponding to the pixel; (f) moving the area to another position in the image; (g) repeating steps (d) to (f); and (h) deciding that the area from which the sum having an extreme value is obtained is the one containing the object pattern.

Method of detecting the position of an object pattern in an image

An apparatus for converting image signals into binary signals is disclosed. The apparatus comprises: a binarizing section for binarizing image signals; a connectivity distribution section for obtaining connectivities between pixels from binary signals and for producing a connectivity distribution; and a judging section for, from connectivity distributions obtained with different binary levels, judging the level at which the frequencies of maximum and minimum connectivities are highest and the sum of the frequencies of intermediate connectivities is minimal.

Apparatus for binarizing image signals

In a position recognizing method and an apparatus, an edge is detected by scanning a one-dimensional model including an edge to be recognized and one-dimensional edge detecting data of an image obtained via a camera so as to determine the difference between the density of the pixel of the one-dimensional model and the density of the corresponding pixel of the one-dimensional edge detecting data and the geometric balance therebetween. Then, the amount of data for detecting the edge becomes smaller and the pattern or parts can be recognized without controlling the binary level and at a high speed.

Position recognizing method and apparatus therefor

A lead's position recognizing device including device for detecting positions of maximum points and minimum points on each outline of each region surrounded by adjacent leads or positions of a pair of corners on diagonal of each outline and a device for detecting the lead's position from intersecting point of a straight line connecting midpoints between said maximum point and minimum point taken at a given proportion or midpoints on diagonal of a pair of corners also taken at a given proportion and the outline. It features the possibility of recognizing the lead's position by the use as positional information of the maximum and minimum points of the outline or the positions of a pair of corners on the diagonal of the outline which remain unchanged even if the given IC parts are turned or have changes in shape such as burrs.

Growing community of inventors

Katano, Japan

Seiji Mizuoka