Mitsubishi Shindoh Co., Ltd.

Dexerials Corporation

Seiji Kumagai

Rensei Futatsuka

Akio Takada

Kazuyuki Shibuya

Toshiaki Sugawara

Takahiro Kimura

Yusuke Matsuno

Shigeshi Sakakibara

Takeshi Suzuki

Hideto Sagawa

Manpei Kuwahara

Masuhiro Izumida

Provided is an inorganic polarizing plate having a wire grid structure including: a transparent substrate; and grid-shaped protrusions arranged on the transparent substrate at a pitch shorter than a wavelength of light in a use band, in which the grid-shaped-protrusion includes, in order from the transparent substrate side, a reflection layer and a reflection suppressing layer which includes a dielectric material and a non-dielectric material and of which a content of the non-dielectric material increases as a separation from the reflection layer increases. In addition, provided are a method of manufacturing the inorganic polarizing plate and an optical instrument including the inorganic polarizing plate.

Inorganic polarizing plate, method of manufacturing the same, and optical instrument

There is provided a copper alloy sheet for forming a connector, having a chemical composition consisting essentially of:

Copper alloy sheet for connectors and connectors formed of same

A copper alloy lead material for leads of a semiconductor device, which consists essentially of from 2 to 2.4 percent by weight iron, from 0.001 to 0.1 percent by weight phosphorus, from 0.01 to 1 percent by weight zinc, from 0.001 to 0.1 percent by weight magnesium, and the balance of copper and inevitable impurities. The copper alloy lead material possesses satisfactory properties such as elongation and electrical conductivity required of a material for leads in a semiconductor device, and further exhibits excellent strength and heat resistance enough to be used as leads in semiconductor devices having high wiring densities, and at the same time possesses improved soldering reliability to the substrate of the semiconductor device as compared to a conventional copper alloy lead material.

Copper alloy lead material for leads of a semiconductor device

Growing community of inventors

Tokyo, Japan

Seiji Kumagai