Murata Manufacturing Co., Ltd.

Seiji Koga

Takashi Omori

Jun Ikeda

Yukio Sanada

Yasuhiro Nishisaka

Tetsuya Kisumi

Toshiki Nagamoto

Masato Kimura

Tomochika Miyazaki

A multilayer ceramic electronic component in which an interface of an edge region of an external electrode that extends around to a side surface of a ceramic body and the ceramic configuring a surface of the ceramic body, an inorganic matter is present containing 26 mol % or more and less than 45 mol % of SiOand having a molar ratio (TiO+ZrO)/(SiO+TiO+ZrO) of 0.154 or more, or an inorganic matter is present containing 45 mol % or more of SiOand having a molar ratio (TiO+ZrO)/(SiO+TiO+ZrO) of 0.022 or more. Furthermore, the inorganic matter may contain BOhaving a molar ratio relative to SiOwithin 0.25&#x2264;BO/SiO&#x2264;0.5.

Multilayer ceramic electronic component having inorganic matter at an interface between an external electrode and the ceramic body

Multilayer ceramic electronic component having an inorganic matter at an interface between an external electrode and the ceramic body

A multilayer ceramic electronic component includes a ceramic body having an end surface and a side surface adjacent to thereto such that the end surface and the side surface meet at an edge. The ceramic body has a plurality of internal electrodes with adjacent pairs of the internal electrodes being separated by a respective ceramic layer. An external electrode containing a metal, an inorganic component and voids is electrically connected to at least some of the internal electrodes and both covers the end surface and extends over the edge onto the side surface to form an extending-around portion which extends at least 50 &#x3bc;m onto the side surface as measured in a direction perpendicular to the edge and ends at a leading edge remote from the edge. A portion of the extending-around area which extends 50 &#x3bc;m from the leading edge towards the edge has an average occupancy area ratio which is at least 25 but not greater than 75. The occupancy area ratio is the ratio between the area of the conductive component and an area of the inorganic component on the one hand to the area of the conductive component, the area of the inorganic component and the area of the voids on the other.

Multilayer ceramic electronic component

An external electrode included in a laminated ceramic electronic component is formed on a ceramic body by baking a conductive paste including a glass component. The ceramic body with the conductive paste applied thereto is subjected to heat treatment under the conditions where the top temperature is 800&#xb0; C. or higher, and the electromotive force at the top temperature is 600 to 900 mV. In this heat treatment, the glass component in the conductive paste penetrates into grain boundaries between ceramic grains of the ceramic body, and a crystalline substance containing elements constituting the glass component is generated which has dissolving resistance against plating solutions.

Laminated ceramic electronic component and manufacturing method therefor

A multilayer ceramic electronic component in which an interface of an edge region of an external electrode that extends around to a side surface of a ceramic body and the ceramic of the surface of the ceramic body in contact therewith, there exists glass (a) containing BaO serving as a first alkaline earth oxide and at least one of CaO and SrO serving as a second alkaline earth oxide, (b) having a total content ratio of the first alkaline earth oxide and the second alkaline earth oxide in a range of 30 to 70 mol %, and (c) having an SiOcontent ratio in a range of 15 to 60 mol %. The molar ratio of the first alkaline earth oxide to the second alkaline earth oxide is in a range of 0.1 to 0.5.

A monolithic ceramic electronic component having outer electrodes that include an inorganic substance containing at least Si, a crystal phase C containing at least Si, Ti, and Ba at the interfaces to a ceramic layer in peripheral end portions of the outer electrodes. A value of the crystal phase area ratio indicating the relationship between the area of the crystal phase C and the area of a glass phase G, which are formed at the interface to the ceramic layer, in a region within 5 &#x3bc;m from the peripheral end portion of the outer electrode is within a range of 75% to 98%.

Monolithic ceramic electronic component and method for manufacturing the same

A ceramic electronic component wherein outer electrode is placed over both end portions of a ceramic body. A first coating mainly containing Ni and a second coating containing Sn, solder, or the like are placed on a surface of the outer electrode. The outer electrode includes an end-surface portion and a side-surface turnover portion. The outer electrode includes a glass layer which is placed in a region within at least 5 &#x3bc;m in linear distance L from a covering end portion of the side-surface turnover portion in a direction toward the end-surface portion so as to be in contact with the ceramic body and which contains, at least, Si. The average thickness t of the glass layer is 3 &#x3bc;m to 10 &#x3bc;m. The content of a Si component is 11% by weight or more (preferably 40% by weight or less).

Ceramic electronic component

A ceramic electronic component includes a ceramic body, a glass coating layer, and an electrode terminal. The ceramic body includes a plurality of internal electrodes whose ends are exposed on the surface of the ceramic body. The glass coating layer covers a portion of the ceramic body on which the internal electrodes are exposed. The electrode terminal is provided directly on the glass coating layer. The electrode terminal includes a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The metal powder particles define conduction paths that electrically connect the internal electrodes with the electrode terminal.

Ceramic electronic component and method for producing the same

A monolithic ceramic electronic component includes a first internal electrode including a first region extending to a first end surface and having a relatively large dimension in a width direction and a second region located at the side closer to a front end than is the first region and having a relatively small dimension in a width direction, wherein d&#x3e;c+ng (n represents a constant based on the size of the monolithic ceramic electronic component) is satisfied, where the distance from a first end point which is closest in the first region to the first side surface and which is closest to the second end surface to the second end surface is d, the distance between first and second wraparound portions is g, and the distance between a front end of the second wraparound portion and the second end surface is c

Monolithic ceramic electronic component and mounting structure thereof

A monolithic ceramic electronic component includes a first internal electrode including a first region which extends to a first end surface and which has a relatively large dimension in a width direction and a second region which is located at the side closer to a front end than is the first region and which has a relatively small dimension in a width direction, wherein d&#x3e;c+ng (n represents a constant determined in accordance with the size of the monolithic ceramic electronic component) is satisfied, where the distance from a first end point which is closest in the first region to the first side surface and which is closest to the second end surface to the second end surface is d, the distance between first and second wraparound portions and is g, and the distance between a front end of the second wraparound portion and the second end surface is cwhile a first side surface defines a mounting surface.

A ceramic electronic component that is hardly influenced by a stress generated when an external electrode containing a metal sintered compact is formed at the end of the ceramic component body, and a method for manufacturing the same are provided. A laminated ceramic capacitor includes a ceramic component body and first electrodes to be connected to internal electrodes that are led to the end surfaces are formed. The first external electrodes are arranged so that the ends are spaced apart from the side surfaces of the ceramic component body. Second external electrodes containing a conductive resin are arranged so as to entirely cover the first electrodes and first and second metal layers and are formed thereon. The first external electrodes are formed by supplying a conductive paste containing conductive metal powder and glass frit having a softening point higher than the sintering starting temperature of the conductive metal powder, and heating the same.

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Nagaokakyo, Japan

Seiji Koga