Nichia Corporation

Seiji Kiyota

Eiichiro Okahisa

Kazuma Kozuru

Soichiro Miura

Hiroaki Yuto

Kei Adachi

A light-emitting device includes: a substrate including a base and a side wall; a plurality of semiconductor laser elements arrayed in a first direction on an upper surface of the base; a sealing member fixed to the substrate, wherein the sealing member and the substrate define a sealed space in which the semiconductor laser element is located; and a lens array disposed above the sealing member, the lens array including a plurality of lens sections arrayed in the first direction. In the lens array, a maximum outer diameter of each lens sections is 1.25 times or more than an inter-vertex distance between adjacent ones of the lens sections in the first direction.

Light-emitting device

A method of manufacturing a light-emitting device includes providing a base body including a base section; fixing a plurality of semiconductor laser elements on an upper surface of the base section; and fixing an optical member to the base body, the optical member including a plurality of lens sections, and a non-lens section disposed at a periphery of the plurality of lens sections in a top view. In the step of fixing the optical member: the optical member is arranged above the base body; (i) an inclination and a height of the optical member are adjusted after interposing an adhesive between the base body and the non-lens section, or (ii) an adhesive is interposed between the base body and the non-lens section after adjusting the inclination and the height of the optical member; and subsequently, the adhesive is cured to fix the optical member to the base body.

Manufacturing method of light-emitting device

A light-emitting device includes: a substrate comprising a base; a semiconductor laser element disposed on an upper surface of the base; a sealing member located above the base and fixed to the substrate, wherein the sealing member and the substrate define a sealed space in which the semiconductor laser element is located; and a lens member fixed to the sealing member by adhesive, the lens member comprising a lens section through which light emitted from the semiconductor laser element passes. A space between the sealing member and the lens member is open to an area outside the light-emitting device.

A light-emitting device includes: a substrate including a base and a side wall; a plurality of semiconductor laser elements disposed in a row direction and in a column direction on an upper surface of the base; a plurality of pairs of wires that penetrate the side wall in the row direction; and a lens array fixed to the substrate, the lens array comprising a plurality of lens sections disposed in the row direction and in the column direction above the plurality of semiconductor laser elements. Each laser beam that is emitted from the semiconductor laser elements and is incident on a light incident surface of the lens array has a beam shape with a greater width in the column direction than in the row direction.

An optical component includes: an upper surface; a lower surface; a first light reflecting surface extending at least partially between the upper surface and the lower surface, the first light reflecting surface comprising a flat surface; and a rounded region formed between the first light reflecting surface and the lower surface. An angular edge is located at a first light reflecting surface side of the upper surface.

Optical component, method of manufacturing same, and light emitting device

A light-emitting device includes a substrate; a lens array having a plurality of lens sections in a matrix pattern; and a plurality of semiconductor laser elements disposed on the substrate. Each of the semiconductor laser elements emits a respective laser beam, each laser beam having a beam shape with a greater width in a column direction than in a row direction on a light incident surface of each respective lens section. The lens sections have an inter-vertex distance in the row direction that is smaller than both (i) a maximum outer diameter of each of the lens sections, and (ii) an inter-vertex distance in the column direction. A curvature of the lens sections in the row direction is the same as a curvature of the lens sections in the column direction.

A method of manufacturing an optical component includes: providing a base comprising a first projection, wherein the first projection includes: an upper surface, and a plurality of lateral surfaces, wherein the plurality of lateral surfaces includes a first lateral surface including: a first light control region, a first non-light-control region that is continuous with the first light control region, and a second non-light-control region on an upper surface side of the first light control region, and wherein the first light control region is located between the first non-light-control region and the second non-light-control region; forming a lower surface of the optical component by processing a lower surface of the base such that the first non-light-control region in the base remains; and forming an upper surface of the optical component by processing an upper surface of the base to remove the second non-light-control region.

A method of manufacturing a light emitting device includes: providing a first support member having an outer circumferential lateral surface and a first through-hole penetrating from an upper surface to a lower surface; disposing a light-transmissive member containing a fluorescent material in the first through-hole; providing a second support member having an inner circumferential lateral surface and a second through-hole penetrating from an upper surface to a lower surface, an inner dimension of the second support member being smaller than an outer dimension of the first support member at room temperature; and performing shrink fitting, which comprises heating the first support member and the second support member to increase the inner dimension of the second support member to be greater than the outer dimension of the first support member, thereafter disposing the first support member in the second support member.

Method of manufacturing light emitting device using shrink fitting

A light emitting device includes a first support member having an outer circumferential lateral surface and a first through-hole, a light-transmissive member including a fluorescent material and disposed in the first through-hole, a second support member having an inner circumferential lateral surface and a second through-hole and a light emitting element disposed below the first support member. At a temperature higher than a first temperature in a range of 200&#xb0; C. to 800&#xb0; C., an outer dimension of the first support member is smaller than an inner dimension of the second support member. At room temperature, the outer dimension of the first support member without being fixed is greater than the inner dimension of the second support member without being fixed. The first temperature is a temperature at which a magnitude correlation between the outer dimension of the first support member and the inner dimension of the second support member is reversed.

Light emitting device and method of manufacturing the same

A method for manufacturing a light-emitting device includes: providing a base including a first depressed portion and a second depressed portion both upwardly opening; and positioning and mounting at least one semiconductor laser element on or above the base based on a predetermined point on a line connecting the first depressed portion and the second depressed portion in a plan view.

Method for manufacturing light-emitting device, method for manufacturing laser module, and light-emitting device

A light emitting device includes: a base member; a laser element disposed on or above a mounting surface of the base member; a fluorescent member including a first main surface and a second main surface respectively positioned on opposite sides of the fluorescent member, the second main surface being fixed to the mounting surface of the base member; a first optical member configured to change a traveling direction of laser light emitted by the laser element to be directed toward the first main surface of the fluorescent member; and a lid connected to the base member and enclosing the laser element, the fluorescent member, and the first optical member in a space beneath the lid, the lid being configured to transmit light from the fluorescent member.

Light emitting device

A light-emitting device includes: a base having a depressed portion upwardly opening, the depressed portion having a bottom surface, surrounding surfaces and at least one placement surface disposed at a position higher than the bottom surface; at least one semiconductor laser element mounted on or above the bottom surface; and a wavelength conversion member enclosed in the depressed portion to convert a wavelength of light from the at least one semiconductor laser element, the wavelength conversion member having a lower surface disposed on the at least one placement surface and a circumferential edge partly surrounded by the surrounding surfaces.

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Itano-gun, Japan

Seiji Kiyota