Dic Corporation

Seiji Kimoto

Tomoyuki Imada

Shigenobu Kida

Yusuke Sato

Provided are a binder in the producing of a casting sand mold according to an ink jet type lamination shaping method in which a binder is printed with respect to sand, a method for producing the binder, and a method for producing a casting sand mold using the binder. Specifically, provided are a binder useful for a casting sand mold of an ink jet type, containing: a resol-type phenolic resin that is obtained by reacting aldehydes (A1), phenols (P1), and a compound (N) having two or more phenolic hydroxyl groups in one molecule or by reacting the aldehydes (A1) and a novolac-type phenolic resin (N1), in the presence of an alkali catalyst, and has a dispersion degree (Mw/Mn) of 1.0 to 3.5 and a phenolic monomer residue of 5% or less, a method for producing the binder, and a method for producing a casting sand mold.

Binder, method for manufacturing same and method for manufacturing casting sand mold

The present invention relates to a resin fine particle dispersion optimal for manufacturing a sheet product such as paper. Specifically, an object of the present invention is to provide a resin fine particle dispersion with which a sheet product having excellent heat resistance and high mechanical strength is obtained, and which has a small environmental load due to a small amount of resin particles remaining in wastewater after papermaking. Provided are a resin fine particle dispersion including resin fine particles (A), a fiber material (B), an ionic polyacrylamide (C), and water as essential components, and a sheet product and a friction plate using this.

Resin particle dispersion, sheet product, and friction plate

Disclosed are a phenolic hydroxyl group-containing resin which has excellent alkali developing properties and makes it possible to exhibit high heat resistance in a cured product obtained therefrom, a production method therefor, a photosensitive composition, a resist material, a coating film, a curable composition and a cured product thereof, and a resist underlayer film. A phenolic hydroxyl group-containing resin, including a compound (A) having a molecular structure represented by the following Structural Formula (1). (In the formula, Rrepresents an alkyl group, an alkoxy group, or an aryl group, Rrepresents a hydrogen atom, an alkyl group, or an aryl group, m is an integer of 1 to 3, and n is an integer of 2 to 15. In the case where m is 2 or more, plural R's may be the same as or different from each other.)

Phenolic hydroxyl group-containing resin, production method therefor, photosensitive composition, resist material, coating film, curable composition and cured product thereof, and resist underlayer film

Provided is a compound containing a phenolic hydroxy group which has excellent heat resistance, a resist composition which has excellent thermal decomposition resistance, optical sensitivity and resolution, and a composition for a resist underlayer coating which has excellent thermal decomposition resistance and dry etching resistance. The compound containing a phenolic hydroxy group has a molecular structure represented by Structural Formula (1) below: wherein Ris a hydrogen atom, an alkyl group or an aryl group, n is an integer of 2 to 10, Ris any one of an alkyl group, an alkoxy group, an aryl group, an aralkyl group and a halogen atom, m is an integer of 0 to 4, and when m is 2 or greater, a plurality of R's may be the same as or different from each other and may be bonded to either one of two aromatic rings of the naphthylene skeleton.

Compound containing phenolic hydroxy group, photosensitive composition, composition for resists, resist coating film, curable composition, composition for resist underlayer films, and resist underlayer film

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Ichihara, Japan

Seiji Kimoto