Other

Hitachi Maxell, Limited

Maxell Seiki, Ltd.

Seiji Kegai

Hiroyoshi Takagi

Koichi Ozaki

Masayoshi Onishi

Kaname Tamada

A board for an IC card includes a main body in the shape of a plate. A recess is formed in the main body for receiving and adhering a component therein. The recess includes a bottom wall integrated as one body with the main body, and an adhesion section for adhering the component. A wall of the adhesion section is an uneven surface. Ribs may be provided which extend from an inner side of the recess to contact the component.

Board for IC card having component mounting recess

A plate for an IC card having recesses for mounting components is formed by injection molding of plastics. First, a mold for forming recesses for mounting components is formed to have a slide core. After molten resin is filled in a cavity, the slide core is forced to penetrate into the cavity. Thus, the molten resin is removed by the slide core so as to form the recesses and walls. Because the resin has been filled beforehand, even if the wall is thin, the filling process is carried out normally, and the walls can be formed without increasing an injection pressure.

Injection molding method for board for IC card

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Yamatokouriyama, Japan

Seiji Kegai