Polyplastics Co., Ltd.

Seiji Kayukawa

Raita Nishikawa

Hiroki Fukatsu

Hirokazu Ohshiba

Kazufumi Watanabe

The present invention provides a planar connector having excellent performances including flatness, warp-deformation resistance, and heat resistance, being capable of responding to shape changes in recent planar connectors. Specifically, the planar connector is composed of a composite resin composition comprises (A) a liquid crystalline polymer containing 55% by mole or less of p-hydroxy benzoic acid residue and having a melting point of 330&#xb0; C. or higher, (B) a plate-like inorganic filler, and (C) a fibrous filler having a weight average fiber length within a range of 250 to 600 &#x3bc;m, the amount of (B) component being 25 to 35% by weight to the total composition, the amount of (C) component being 10 to 25% by weight to the total composition, the sum in total of (B) component and (C) component being 40 to 50% by weight to the total composition, wherein the connector has a lattice structure inside an outer frame, and has an opening inside the lattice area, and wherein the pitch interval of the lattice area is 1.5 mm or less, and the ratio of the thickness of the thickness of the lattice area to the outer frame area is 0.8 or less.

Planar connector

Provided is a material capable of forming a molded product which has good mechanical properties with low warpage while being excellent in any of the performance including heat resistance and flowability, even if the molded product is an asymmetric electronic parts. Specifically, the asymmetric electronic parts is prepared by molding a liquid crystalline polymer composition comprising (A) a fibrous filler having an average fiber diameter within the range of 5 to 30 &#x3bc;m, having a weight average fiber length within the range of 250 to 350 &#x3bc;m, excluding 10 &#x3bc;m or shorter fiber length, and having a content of a fibrous filler being 700 &#x3bc;m or longer within the range of 5% by weight or less; and (B) a plate-like filler having an average particle size within the range of 0.5 to 200 &#x3bc;m, the total filling amount of (A) and (B) components in the composition being within the range of 40 to 60% by weight, the weight ratio of (A) component being within the range of 10 to 20% by weight, the weight ratio of (B) component being within the range of 30 to 40% by weight, the molded product having no symmetry in any of the axial plane XY, the axial plane YZ, and the axial plane XZ of the molded product.

Growing community of inventors

Fuji, Japan

Seiji Kayukawa