Ebara Corporation

Other

Kabushiki Kaisha Toshiba

Kabushiki Kaisha Yaskawa Denki

Seiji Katsuoka

Kenichi Kobayashi

Masahiko Sekimoto

Mitsuru Miyazaki

Takahiro Ogawa

Teruyuki Watanabe

Toshio Yokoyama

Tetsuji Togawa

Kunihiko Sakurai

Hiroyuki Shinozaki

Junji Kunisawa

Natsuki Makino

Naoki Matsuda

Manabu Tsujimura

Yasuyuki Motoshima

Naoki Dai

Osamu Nabeya

Kenichi Suzuki

Hiroshi Sotozaki

Toyomi Nishi

Ryo Kato

Shinya Morisawa

Hiroyuki Osawa

Norio Kimura

Yasuyuki Motojima

Junichiro Yoshioka

Yasuhiko Endo

Akira Owatari

Yugang Guo

Masahiro Hatakeyama

Yuta Suzuki

Taro Takahashi

Nobuyuki Takada

Shunichiro Kojima

Masayuki Kumekawa

Hidetaka Nakao

Koji Mishima

Hozumi Yasuda

Hiroaki Inoue

Toru Maruyama

Masako Kodera

Hiroyuki Kanda

Hiromi Yajima

Tadakazu Sone

Soichi Isobe

Hidenao Suzuki

Kenichi Shigeta

Akira Ogata

Hiroki Sanemasa

Kazuki Chiba

Kunihito Ide

Hideo Yamamoto

Kazufumi Nomura

Shin Ohwada

Naoomi Torii

Naoki Mihara

Kenji Fujimoto

Naoki Noji

In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing padand a semiconductor waferdisposed opposed to the polishing padincludes a polishing tableA for holding the polishing padand a top ringA for holding the semiconductor wafer. A swing shaft motorswings a swing armfor holding the top ringA. The arm torque detection sectiondetects arm torque applied to the swing arm. An end point detection sectiondetects a polishing end point indicating an end of polishing based on the detected arm torque.

Polishing apparatus

An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method

A polishing apparatus includes a peripheral-portion polishing unit configured to polish a peripheral portion of the substrate, a CMP unit configured to polish a flat surface of the substrate W, a cleaning unit configured to clean the polished substrate, a transport system configured to transport the substrate. The transport system transports the substrate that has been polished in one of the peripheral-portion polishing unit and the CMP unit to the cleaning unit, and transports the substrate that has been cleaned in the cleaning unit to the other of the peripheral-portion polishing unit and the CMP unit.

Polishing apparatus and polishing method

A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section.

Substrate holding apparatus, substrate holding method, and substrate processing apparatus

A method can effectively eliminate a surface level difference (irregularities) in a film formed on an object without producing scratches in a surface of the film, and can polish and remove the film into a flat surface with greatly increased productivity. The method comprises carrying out a first polishing step by pressing a polishing pad of a polishing device, having a diameter which is smaller than the radius of the object, against the surface of the object at a first pressure while moving the polishing pad and the object relative to each other at a first relative speed. The first polishing step is terminated at a point in time when a surface level difference in the object is eliminated to a targeted level. The method further comprises carrying out a second polishing step by pressing a polishing pad of a polishing device, having a diameter which is larger than the diameter of the object, against the surface of the object at a second pressure while moving the polishing pad and the object relative to each other at a second relative speed.

Method and apparatus for polishing object

A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.

Substrate processing method and apparatus

A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.

Substrate holder, plating apparatus, and plating method

A handis constituted by a hand baseserving as a base portion, a rocking handdisposed to be superposed on the hand baseand serving to support a substrate, and a rocking mechanismprovided between the hand baseand the rocking handand serving to support the rocking handto be tiltable and movable in parallel with respect to the hand base

Hand having rocking mechanism and substrate delivering device having the same

A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

Substrate polishing apparatus and method

Growing community of inventors

Tokyo, Japan

Seiji Katsuoka