Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Seiji Karashima

Seiichi Nakatani

Takashi Kitae

Takashi Ichiryu

Yoshihisa Yamashita

Koichi Hirano

Yoshihiro Tomita

Satoru Tomekawa

Susumu Sawada

Toshiyuki Asahi

Tousaku Nishiyama

Toshio Fujii

Yoshiyuki Saito

Toshiyuki Kojima

Shingo Komatsu

Hiroki Yabe

Yasushi Taniguchi

Takeshi Nakayama

Tsuguhiro Korenaga

Osamu Shibata

Yasuhiro Sugaya

Yasushi Nakagiri

Yukihiro Ishimaru

Kunio Hibino

Kenichi Hotehama

Nobuki Itoh

Tsukasa Shiraishi

Mikihiro Shimada

Masayoshi Koyama

Susumu Matsuoka

Seiichi Natkatani

An electronic component assembly including a first electronic component including a plurality of first electrodes provided on a first major surface of the first electronic component; and a second electronic component including a plurality of second electrodes provided on a first major surface of the second electronic component. A resin including solder powder is provided between the first electronic component and the second electronic component. Also, solder connections are provided to electrically interconnect the first and second electrodes. Elongated grooves are provided in surfaces of the electronic components. The grooves are provided for generation of bubbles during the process for producing the electronic component assembly to promote movement of the solder powder.

Electronic component assembly

An electrode structureon which a solder bump is placed includes an electrode patternmade of an electrode-constituting material selected from the group consisting of Cu, Al, Cr, and Ti, a Ni layerformed on a part of the electrode pattern, a Pd layerformed on at least a part of a region other than the part of the electrode pattern, and an Au layerformed on the Ni layerand the Pd layer

Electrode structure and method for forming bump

There is provided a flip-chip mounting resin composition which can be used for a flip-chip mounting process that is high in productivity and reliability and thus can be applicable to a flip-chip mounting of a next-generation LSI. This flip-chip mounting resin composition comprises a resin, metal particles and a convection additivethat boils upon heating the resin. Upon the heating of the resin, the metal particles melt and the boiling convection additiveconvects within the resin. This flip-chip mounting resin composition is supplied between a circuit substrateand a semiconductor chip, and subsequently the resinis heated so that the molten metal particles self-assemble into the region between each electrode of the circuit substrate and each electrode of the semiconductor chip. As a result, an electrical connection is formed between each electrode of the circuit substrate and each electrode of the semiconductor chip. Finally, the resinis allowed to cure so that the semiconductor chipis secured to the circuit substrate, which leads to in a formation of a flip chip assembly.

Flip-chip mounting resin composition and bump forming resin composition

[Means for Solving Problem] A semiconductor chiphaving a plurality of electrode terminalsis held to oppose a circuit boardhaving a plurality of connection terminalswith a given gap provided therebetween, and the semiconductor chipand the circuit boardin this state are dipped in a dipping bathcontaining a melted resinincluding melted solder particles for a given period of time. In this dipping process, the melted solder particles self-assemble between the connection terminalsof the circuit boardand the electrode terminalsof the semiconductor chip, so as to form connectorsbetween these terminals. Thereafter, the semiconductor chipand the circuit boardare taken out of the dipping bath, and the melted resinhaving permeated into the gap between the semiconductor chipand the circuit boardis cured, so as to complete a flip-chip mounting body.

Flip-chip mounting method and bump formation method

A resin containing a conductive particle and a gas bubble generating agent is supplied in a space between the substrates each having a plurality of electrodes. The resin is then heated to melt the conductive particle contained in the resin and generate gas bubbles from the gas bubble generating agent. A step portion is formed on at least one of the substrates. In the process of heating the resin, the resin is pushed aside by the growing gas bubbles, and as a result of that, the conductive particle contained in the resin is led to a space between the electrodes, and a connector is formed in the space. At the same time, the resin is led to a space between parts of the substrates at which the step portion is formed, and cured to fix the distance between the substrates.

Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates

A method for forming bumpson electrodesof a wiring boardincludes the steps of: (a) supplying a fluidcontaining conductive particlesand a gas bubble generating agent onto a first regionincluding the electrodeson the wiring board; (b) disposing a substratehaving a wall surfaceformed near the electrodesfor forming a meniscusof the fluid, so that the substratefaces the wiring board; and (c) heating the fluidto generate gas bubblesfrom the gas bubble generating agent contained in the fluid

Bump forming method using self-assembling resin and a wall surface

The invention involves mounting a solder resin composition () including a solder powder () and a resin () on the first electronic component (); arranging such that the connecting terminals () of the first electronic component () and the electrode terminals () of the second electronic component () are facing each other; ejecting a gas () from a gas generation source () included in the first electronic component () by heating the first electronic component () and the solder resin composition; and inducing the flow of the solder powder () in the solder resin composition () by inducing convection of the gas () in the solder resin composition (), and electrically connecting the connecting terminals () and the electrode terminals () by self-assembly on the connecting terminals () and the electrode terminals (). Through this are provided a flip chip packaging method that enables connecting, with high connection reliability, electrode terminals of a semiconductor chip wired with narrow pitch and connecting terminals of a circuit board, and a bump formation method for packaging on a circuit board.

Flip chip mounting method and bump forming method

A connection structure (package) has a first plate bodyand a second plate body; in the first plate body, a wiring pattern having a plurality of connection terminalsis formed, and the second plate body has at least two connection terminals (electrode terminals) arranged facing the connection terminals of the first plate body. The connection terminals of the first and second plate bodies are connection terminals formed as projections on the surfaces of the first and second plate bodies. A conductive substanceis accumulated to cover at least a part of each side face of the connection terminals opposed to each other of the first and second plate bodies, and the connection terminals thus opposed are connected to each other via the conductive substance. The package thus formed is ready for a high-pin-count, narrow-pitch configuration of a next-generation semiconductor chip, and exhibits excellent productivity and reliability. The present invention is advantageous for such a package, for a connection structure applicable to the production of the package, and for a method of producing the connection structure.

Flip chip connection structure having powder-like conductive substance and method of producing the same

The flip chip mounted body of the present invention includes: a circuit board () having a plurality of connection terminals (); a semiconductor chip () having a plurality of electrode terminals () that are disposed opposing the connection terminals (); and a porous sheet () having a box shape that is provided on an opposite side of a formation surface of the electrode terminal () of the semiconductor chip (), is folded on an outer periphery of the semiconductor chip () on the formation surface side of the electrode terminal () and is in contact with the circuit board (), wherein the connection terminal () of the circuit board () and the electrode terminal () of the semiconductor chip () are connected electrically via a solder layer (), and the circuit board () and the semiconductor chip () are fixed by a resin (). Thereby, the flip chip mounted body with excellent productivity and reliability that can mount the semiconductor chip on the circuit board, and a method and an apparatus for mounting the flip chip mounted body are provided.

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

A module with a built-in component is provided which can be produced without a via-forming step. The module with a built-in componentincludes an insulating sheet substratewhich has an upper surface, a lower surfaceopposed to the upper surfaceand a side surfacewhich connects these surfaces. At least one wiringextends from the upper surface to the lower surface through the side surface, and an electronic componentis disposed within the sheet substrate.

Module with a built-in component, and electronic device with the same

A flip chip mounting process includes the steps of supplying a resin () containing solder powder and a convection additive () onto a wiring substrate () having a plurality of electrode terminals (II), then bringing a semiconductor chip () having a plurality of connecting terminals () into contact with a surface of the supplied resin (), and then heating the wiring substrate () to a temperature that enables the solder powder to melt. The heating step is carried out at a temperature that is higher than the boiling point of the convection additive () to allow the boiling convection additive () to move within the resin (). During this heating step, the melted solder powder is allowed to self-assemble into the region between each electrode terminal () of the wiring substrate () and each connecting terminal () of the semiconductor chip to form an electrical connection between each electrode terminal () and each connecting terminal ().

Flip chip mounting process and flip chip assembly

To provide a flip-chip mounting method and a bump formation method applicable to flip-chip mounting of a next generation LSI and having high productivity and high reliability. A semiconductor chiphaving a plurality of electrode terminalsis held to oppose a circuit boardhaving a plurality of connection terminalswith a given gap provided therebetween, and the semiconductor chipand the circuit boardin this state are dipped in a dipping bathcontaining a melted resinincluding melted solder particles for a given period of time. In this dipping process, the melted solder particles self-assemble between the connection terminalsof the circuit boardand the electrode terminalsof the semiconductor chip, so as to form connectorsbetween these terminals. Thereafter, the semiconductor chipand the circuit boardare taken out of the dipping bath, and the melted resinhaving permeated into the gap between the semiconductor chipand the circuit boardis cured, so as to complete a flip-chip mounting body.

An electronic component mounting method includes a step of applying a resin composition () including solder powder, convective additive and resin having fluidity at the melting temperature of the solder powder on a main surface of a wiring substrate () provided with conductive wirings and connecting terminals, a step of preparing a group of electronic components consisting of a plurality of electronic components (and) including at least a passive component, the respective electronic components comprising electrode terminals, position-aligning connecting terminals with the electrode terminals, and making the group of electronic components abut a surface of the resin composition, a step of heating at least the resin composition so as to melt solder powder and make the solder powder self-assembled between the connecting terminals and the electrode terminals by the convective additive, and thereby connecting the connecting terminals and the electrode terminals by soldering, and a step of fixedly adhering the group of electronic components to the wiring substrate using the resin by hardening the resin in the resin composition. Accordingly, a mounting process can be remarkably simplified without forming bumps in advance.

Electronic component mounting method

A resin containing conductive particles and a gas bubble generating agent is supplied between a first substrate and a second substrate, and then the resin is heated to generate gas bubbles from the gas bubble generating agent contained in the resin so that the resin is self-assembled between electrodes. Then, the resin is further heated to melt the conductive particles contained in the resin, thereby forming connectors between electrodes. A partition member sealing the gap between the substrates is provided near a peripheral portion of the resin, and gas bubbles in the resin are discharged to the outside through the peripheral portion of the resin where the partition member is absent.

Growing community of inventors

Osaka, Japan

Seiji Karashima