Koa Corporation

Seiji Karasawa

Yoji Gomi

Koichi Minowa

Yuichi Abe

Michio Kubota

Koji Fujimoto

An object is to provide a resistor manufacturing method and a resistor capable of suppressing variation in the thickness of a thermally conductive layer intervening between a resistive body and electrode plates. The method of manufacturing the resistor according to the present invention includes a step of forming an uncured first thermally conductive layer on a surface of a resistive body, a step of curing the first thermally conductive layer, a step of laminating an uncured second thermally conductive layer on a surface of the first thermally conductive layer, and a step of bending electrode plates respectively disposed at both sides of the resistive body, curing the second thermally conductive layer, and performing adhesion between the resistive body and the electrode plates via the first thermally conductive layer and the second thermally conductive layer.

Resistor manufacturing method and resistor

The present disclosure provides a method for manufacturing a resistor. The method may include providing a resistor structure having a layer of first thermally conductive material covering at least a surface of the resistive body, the first thermally conductive material being semi-cured, semi-hardened and substantially non-fluid, and the layer of first thermally conductive material having a first thickness; bending a pair of electrodes at the opposite ends of the resistive body toward a surface of the layer of first thermally conductive material; and pressing the pair of electrodes against the surface of the layer of first thermally conductive material, while maintaining in a heated state the first thermally conductive material to cause further curing and hardening of the first thermally conductive material and a reduction in the first thickness, so as to obtain a cured and hardened thermally conductive layer having a desired second thickness.

Method for manufacturing resistor, and resistor

An object is to provide a method for manufacturing a resistor capable of suppressing variations in the thickness of a thermally conductive layer interposed between a resistive body and electrode plates. The method for manufacturing a resistor according to the present invention includes a step of forming an unhardened thermally conductive layer on a surface of a resistive body, a step of bringing the thermally conductive layer into a semi-hardened state, and a step of bending electrode plates respectively disposed at both sides of the resistive body, further hardening the thermally conductive layer, and performing adhesion between the resistive body and the electrode plates via the thermally conductive layer.

Method for manufacturing resistor

The present invention is to provide an electronic component where positional accuracy for arranging members constituting a circuit element such as a resistor element and the like is mitigated and corrosion of a terminal electrode caused by sulfur in the atmosphere is reduced. The four chips connected resistor deviceas an electronic component comprises: an insulating substrateincluding a front surface, a back surfaceand a side surfaceconnecting the front surfacewith the back surface; a pair of terminal electrodes placed on the front and back surfacesandand the side surface; a resistor elementincluding a resistor memberconnected to the pair of terminal electrodes, and a protective layer (a glass filmand an overcoating film) for protecting the resistor member: the auxiliary electrodeplaced with covering the interfacebetween the overcoating filmand the terminal electrode; and a nickel plated layerand a solder plated layerplaced on the surfaces of the terminal electrodeand the auxiliary electrode. The interfaceis placed at the end portionof the insulating substrate

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Ina, Japan

Seiji Karasawa