Ebara Corporation

Hitachi, Ltd.

Other

Kabushiki Kaisha Toshiba

Hitachi Displays, Ltd.

Panasonic Liquid Crystal Display Co., Ltd.

Hitachi Electronics Engineering Co., Ltd.

Seiji Ishikawa

Isao Miyazaki

Jun Nakazato

Manabu Tsujimura

Riichirou Aoki

Norio Kimura

Masao Sakata

Hiromi Yajima

Masayoshi Hirose

Yuichi Ohyama

Katsuya Okumura

Yuzo Taniguchi

Sadao Shimoyashiro

Kazuhiko Matsuoka

Hiroto Nagatomo

Kimio Muramatsu

Tsutomu Okabe

Osamu Satou

Yuzaburo Sakamoto

Shuichi Hanashima

Taizo Hashimoto

Yutaka Ebara

Yoshimi Sasaki

Hirokuni Hiyama

Yutaka Wada

Tamami Takahashi

Kenji Watanabe

Masataka Shiba

Toshimitsu Hamada

You Ishii

Akira Ogata

Mari Nozoe

Yasuhiro Yoshitake

Atsushi Shigeta

Masako Kodera

Fumio Mizuno

Yoshiyuki Miyamoto

Katsuyuki Aoki

Seiji Isogai

Ikuo Suzuki

Kiyotaka Kawashima

Yoshiharu Shigyo

Masami Ikota

Makoto Ariga

Tetsuji Yokouchi

Terushige Asakawa

Hidekuni Sugimoto

Kazuko Ishihara

Yoshinori Muramatsu

Takahiro Jingu

Toshimasa Ishigaki

Tetsuya Watanabe

Yasunori Yamaguchi

Noburu Shimizu

Hiroo Suzuki

Yuichi Hamamura

Toshiharu Miwa

Jun Ooida

Hiroyasu Matsuura

Takahiro Miyazaki

Kouki Yamada

Natsuyo Morioka

Chizu Matsumoto

Fujio Aoyama

Toshiaki Yachi

Shirou Mishima

Kazuo Ito

Takao Mitsukura

Naoki Go

Tadamichi Wachi

Katsumi Ikegaya

Manufacturing management information relating to a module battery and single battery mounted therein which are obtained in a battery manufacturing process () is collected by a manufacturing quality information collection processing unit () and stored in a database (). In a battery diagnosis system (), when the module battery () under a usage environment is charged, an operation result processing unit () collects operation result information relating to the module () and stores the operation result information in a database (). An operation result monitoring processing unit () determines whether the operation result information is abnormal, and supplies the result of the determination to a manufacturing/usage environment factor classification processing unit (). When the result of the determination indicates that the operation result information is abnormal, the manufacturing/usage environment factor classification processing unit () diagnoses, on the basis of the manufacturing management information relating to the module battery in the database (), whether the abnormality of the operation result information is caused by a manufacturing factor or a usage environment factor, and the result of the diagnosis is created and displayed by the diagnosis result creation processing unit ().

Diagnosis system and diagnosis method for lithium ion secondary battery

A maskless exposure method of drawing a circuit pattern includes: moving a substrate with respect to a projection optical system; scanning, by the projection optical system, the substrate in a first direction; shifting a scanning region in a second direction; scanning the substrate in the first direction so that an overlapping part is formed. A plurality of marks different from the circuit pattern are exposed in a vicinity of the overlapping part. The plurality of marks are a set of marks at least including two marks disposed on one side of the overlapping part and two marks disposed on another side of the overlapping part. Deviations between the pair of the scanning regions, an inclination of exposing light, and a yawing angle of a stage are analyzed by measuring deviations of distances among the plurality of marks. Calibration data are obtained from a result of the analyzing.

Maskless exposure method

An exposure method that suppresses distribution of pattern shapes at the time of exposure. In a manufacturing method for a display unit, a layer forming a reference for pattern arrangement is determined among layers formed on a panel. An arrangement of a pattern in a layer above the reference layer is determined using a value obtained from distribution of the pattern arrangement in the reference layer.

Method of manufacturing display unit

An average fault ratio is calculated from product characteristics of a product as a target of yield prediction, in order to predict yield accurately in the course of manufacturing the prediction target product. With respect to a reference product, whose wiring pattern is different from the prediction target product but manufactured by the same manufacturing process, a monthly electric fault density is calculated from actually measured data. Respective average fault ratios are obtained from product characteristics of the prediction target product and the reference product. A monthly electric fault density of the prediction target product is obtained by multiplying the monthly electric fault density of the reference product by the ratio of the average fault ratios. The yield is calculated by using the monthly electric fault density of the month in which a yield prediction target lot of the prediction target product was processed.

Semiconductor device yield prediction system and method

A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable and the top ring are movable relatively to each other to polish a surface of the workpiece supported by the top ring with the abrasive cloth. The abrasive cloth has a projecting region on a surface thereof for more intensive contact with the workpiece than other surface regions of the abrasive cloth. The projecting region has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the projecting region is held in contact with the workpiece. A position of the projection region is determined on the basis of an area in which the projecting region acts on the workpiece.

Polishing apparatus including turntable with polishing surface of different heights

A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device

A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled to a pressure cylinder for pressing the top ring, and to a motor for rotating the top ring. A spherical bearing is interposed between the top ring and the top ring drive shaft for allowing the top ring to align with the upper surface of the moving turntable. A torque transmitting mechanism is operatively coupled between the top ring and the top ring drive shaft for rotating the top ring in synchronization with the top ring drive shaft.

Polishing apparatus

A process management system in accordance with the present invention includes inspection apparatuses for inspecting defects on a wafer, the inspection apparatuses being connected through a communication network, inspection information and image information obtained from these inspection apparatuses being collected to construct a data base and an image file, therein definition of defects is given by combinations of elements which characterize the defect based on the inspection information and the image information obtained from the inspection apparatuses. By giving definition of the defect, characteristics of the defect can be subdivided and known. Therefore, the cause of a defect can be studied.

Process management system

The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And, in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Inspection data analyzing system

Process control system

The present invention provides data analysis stations respectively for a probing tester and an automatic particle inspection machine. And in the data analysis station, the coordinates on which the disposition of the chips are described on a product basis are equal to those on which the locations of the defects are described. Further, the station provides a function of determining which of the chips each defect belongs to. These data analysis stations are connected through a communication line. The present invention is capable of analyzing the data on a chip basis, resulting in being able to grasp the relation between how the defects are caused on each chip and the product character of the chip.

Growing community of inventors

Yokohama, Japan

Seiji Ishikawa