Murata Manufacturing Co., Ltd.

Seiji Hidaka

Shin Abe

Michiaki Ota

Yohei Ishikawa

Norifumi Matsui

Tomoyuki Ise

Yasuo Fujii

Youhei Ishikawa

Kazuhiko Kubota

Yukihiro Fujita

Atsushi Sakuragi

Koichi Sakamoto

Hiroshi Nishida

Shigeyuki Mikami

Hiromu Tokudera

Hidekazu Wada

Kei Matsutani

Kazutaka Mukaiyama

Koichi Takizawa

Ko Yamanaga

Shingo Okajima

Yohei Yamaguchi

Hiroshi Mifune

Norihumi Matsui

A multilayer ceramic capacitor includes a capacitor body, first and second via-conductors, first and second extended electrode portions, first and second outer electrodes, and an insulative resin. The capacitor body includes first and second inner electrodes. The first and second via-conductors are inside the capacitor body, and are respectively electrically connected to the first and second inner electrodes. The first and second extended electrode portions are respectively electrically connected to the first and second via-conductors. The first and second extended electrode portions are located on an outer surface of the capacitor body so as to extend to locations different from locations at which the first and second extended electrode portions are connected to the first and second via-conductors. The first and second outer electrodes are respectively electrically connected to the first and second extended electrode portions.

Multilayer ceramic capacitor including via-conductors and outer electrodes

A multi-terminal multilayer capacitor includes first vias and second vias extending in first and second internal electrodes in a stacking direction, a first slit extending between the first via and a first insulating portion that insulates the second via and the first internal electrode from each other, and a second slit extending between the second via and a second insulating portion that insulates the first via and the second internal electrode from each other. The first via electrically connects regions of the first internal electrode split by the first slit, and the second via electrically connects regions of the second internal electrode divided by the second slit.

Multi-terminal multilayer capacitor

An inductor includes a plurality of wires disposed about an axis, a first electrode connected to a first end of each of the plurality of wires, and a second electrode connected to a second end of each of the plurality of wires. Each of the wires includes an outer-winding helical portion shifting in an axial direction while gradually increasing a radius thereof, an inner-winding helical portion shifting in the axial direction while gradually reducing a radius thereof, and an outer circumference connection portion that connects an end of the outer-winding helical portion and an end of the inner-winding helical portion at different positions in the axial direction.

Inductor and transformer

A capacitor simulation method and nonlinear equivalent circuit model enabling dynamic simulation of nonlinear characteristics when direct-current voltage is applied with high precesion are easily provided using a simple configuration. An equivalent circuit of a capacitor is represented using a series circuit of passive circuit elements. Characteristic change ratios of the passive circuit elements when a direct-current voltage is applied are expressed as an approximate function on the basis of an actually measured value. A reference voltage is referred to by control current sources connected in parallel to the passive circuit elements. The characteristic change ratios are calculated in accordance with the reference voltage Vref. Difference currents are generated on the basis of the characteristic change ratios and currents flowing when no direct-current voltage is applied, they are caused to flow concurrently with the currents flowing when no direct-current voltage is applied, and thus the nonlinear characteristics are simulated.

Capacitor simulation method and capacitor nonlinear equivalent circuit model

An inductor simulation method and nonlinear equivalent circuit model enabling dynamic simulation of nonlinear characteristics when a direct current is superimposed with high precision. An equivalent circuit of an inductor is represented using a series circuit of passive circuit elements. Characteristic change ratios of the passive circuit elements when a direct current is superimposed are expressed as an approximate function on the basis of actually measured values. A reference current measured by each of voltage source models is referred to by a control voltage source connected in series to the passive circuit elements. The characteristic change ratios are calculated in accordance with the reference current Iref. Difference voltages are generated on the basis of the characteristic change ratios and voltages occurring when no direct current is superimposed, they are superimposed on the voltages Vand Voccurring when no direct current is superimposed, thereby simulating the nonlinear characteristics.

Inductor simulation method and inductor nonlinear equivalent circuit model

An analysis device constructs an analytical model with a circuit board and a medium, and applies a concentrated load grouping composed of concentrated loads to the circuit board. In this case, the concentrated loads are established such that the sum of the respective vectors is zero, and such that the torque is zero with respect to the center of gravity. The analysis device applies a finite element method to the analytical model to figure out the vibration of the circuit board, which is caused when the concentrated loads vibrate with a constant period. The change in the pressure of the medium is computed from the vibration of the circuit board, and the change in the pressure is converted to a sound pressure.

Analysis device and analysis method

A method for deriving an equivalent circuit model of a capacitor which makes it possible to derive, with high accuracy and with ease, an equivalent circuit model having characteristics in accordance with a direct current voltage applied to a capacitor. Characteristic values of predetermined resistive elements and capacitive elements forming an equivalent circuit model of a capacitor change in response to a DC bias voltage being applied to the capacitor, and the change is attributable to the material of a dielectric forming the capacitor. However, by multiplying the characteristic values of the resistive elements and the capacitive elements held while the DC bias voltage is not applied by a dimensionless coefficient in accordance with an application rule, the characteristic values of the resistive elements and the capacitive elements are corrected to values in accordance with the voltage of the DC bias voltage applied to the capacitor.

Method for deriving equivalent circuit model of capacitor

A resonator, a filter, and a communication apparatus that can be easily miniaturized even if the resonant frequency is relatively low are provided. Conductor layers are laminated in the state in which they are partially insulated from each other by a dielectric layer. Conductor openings free from any conductor layer in the laminate direction serve as inductive areas, and the portion where the conductor layers oppose each other with the dielectric layer therebetween serves as a capacitive area CA. With this configuration, the resulting resonator serves as a stepped-impedance-structured slot resonator. By increasing the impedance step ratio of the capacitive area to the inductive areas according to this structure, the resonator is miniaturized. Additionally, the conductor loss of the resonator is reduced by suppressing the intrusion of magnetic field energy to the capacitive area. It is thus possible to obtain a small resonator having high Qo.

Resonator, filter, and communication unit

A planar circuit having a conductive film on either main surface of a substrate. The conductive film on one of the main surfaces is patterned with two-dimensionally and repeatedly arranged unit cells, which are basic conductor patterns. Each of the unit cells has a capacitive region at the center thereof. Capacitance is induced between the center area and the conductor film formed on the main surface of the substrate opposite the center area. An area located near the middle of each of sides in the peripheral portion serves as an inductive region. In any two adjacent unit cells, the inductive regions have a multiple spiral-shaped conductor pattern, in which the center ends thereof are connected to each other at a halfway position between the two unit cells, and the outer peripheral ends thereof are connected to the capacitive regions.

Planar circuit, high-frequency circuit device, and transmission and reception apparatus

A dielectric substrate is provided with first and second conductor openings communicating with each other via a first slit, and third and fourth conductor openings communicating with each other via a second slit, and the slits intersect each other. With this structure, two resonant modes including an even mode in which magnetic field vectors are directed from the first to third conductor openings and from the fourth to second conductor openings, and an odd mode in which magnetic field vectors are directed from the third to second conductor openings and from the first to fourth conductor openings, or two resonant modes including an X mode in which magnetic field vectors are directed from the first to second conductor openings, and a Y mode in which magnetic field vectors are directed from the third to fourth conductor openings are generated.

Resonator, filter, nonreciprocal circuit device, and communication apparatus

A high-frequency circuit device, a high-frequency module, and a communication apparatus, which prevent generation of an undesired wave to prevent electrical power loss and undesired coupling, are provided. The high-frequency circuit device includes a first slot line and a second slot line, which are provided at respective surfaces of a dielectric substrate, are formed with the same shape. An FET is provided on the first slot line. For preventing the mounting of the FET from causing a phase difference to occur between a high-frequency signal, which propagates along the first slot line, and a high-frequency signal, which propagates along the second slot line, a phase-adjusting stub is formed at a position of a stub at the second slot line. The phase is adjusted by changing the length of the stub.

High-frequency circuit device, high-frequency module, and communication apparatus

A conductive film is provided on a dielectric substrate. The conductive film has conductor opening portions, which serve as inductive regions, and a conductor opening portion, which serves as a capacitive region. Multi-step ring resonator elements, each including a conductor line aggregate, are provided on respective substrates to configure resonator elements. The resonator elements are mounted above the conductor opening portions that serve as the inductive regions. This arrangement provides a resonator having a high Qo.

Resonator, filter, communication apparatus

A resonator device including a plurality of resonance units formed on a dielectric substrate, each resonance unit having a plurality of conductor lines forming a capacitive area and an inductive area in a ring shape.

Resonator device, filter, duplexer and communication device

Ring-shaped resonant elements include respectively conductor lines, andeach formed on a substratealong a full one turn of circumferential length of a ring. Each of the conductor lines, andhas two end portions which additionally extend and which are located such that they closely adjoin each other in a width direction. The respective ring-shaped resonant elements are disposed in a concentric fashion. Capacitive parts are formed in areas in which two ends of respective conductor lines are located in close proximity to each other, and the other parts of the respective conductor lines function as inductive parts. Each conductor line operates as a half-wave transmission line whose both ends are electrically open. It is not needed to form a ground electrode on a surface of the substrate opposite to the surface on which the conductor lines are formed. Thus, a resonator can be formed using a very small number of constituent elements. A resonator, a filter, a duplexer, and a communication apparatus having a small size and a high conductor Q-factor can be produced at reasonably low cost.

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Nagaokakyo, Japan

Seiji Hidaka