Central Glass Company, Limited

Seiji Hasegawa

Hidehisa Nanai

Masamichi Maruta

Yoshihiro Moroi

Hiroshi Takahashi

Kazuhiko Maeda

Kentaro Tsutsumi

Satoru Kobayashi

Satoru Narizuka

Takashi Kume

Yukio Ikeda

Michio Ishida

Makoto Koide

Yoshi Hirashima

Yuzuru Morino

The invention relates to a method for producing a benzoic acid derivative represented by the general formula (1). The method includes the step of reacting an aromatic compound represented by the general formula (2), with carbon monoxide and a hydroxy compound (i.e., water or an alcohol), in the presence of (a) a metal compound containing a metal of 8, 9 and 10 groups of periodic table, (b) a first phosphine derivative represented by the general formula (R,),P&mdash;Q&mdash;P(R,),, and (c) a base,

Method for producing benzoic acid derivatives

The invention relates to a fluorine-containing resin (graft copolymer) used for preparing a paint. This resin is prepared by a graft copolymerization of a fluorine-containing copolymer with a first monomer composition. The fluorine-containing copolymer comprises a first constitutional unit derived from a fluoroolefin and at least one of second and third constitutional units. The second constitutional unit is derived from a particular carboxylic acid vinyl ester represented by a general formula of R--C(.dbd.O)OCH.dbd.CH.sub.2 where R is a special group. The third constitutional unit is derived from a first monomer which is at least one compound selected from vinyl ethers and allyl ethers. The first monomer is represented by a general formula of R--O--(CH.sub.2)n--CH.dbd.CH.sub.2. The first monomer composition for preparing the resin contains a second monomer which is at least one compound selected from methacrylic acid esters and acrylic esters. The second monomer is represented by a general formula of CH.sub.2 .dbd.C(--R')C(.dbd.O)O--R where R' is hydrogen atom or methyl group. A composition prepared by mixing the resin with vinylidene fluoride resin or with a combination of vinylidene fluoride resin and acrylic resin is capable of providing a coated film having high gloss, high weather resistance, and good results in bending test for a long time. Another composition prepared by mixing the resin with a hardener is capable of providing a coated film having high hardness, good adhesion to various other coated films, high weather resistance, and high stain resistance.

Fluorine-containing resin for preparing paint

The present invention relates to a water-based fluorine-containing emulsion. This emulsion contains a fluorine-containing copolymer in a disperse phase thereof This copolymer is prepared by copolymerizing: (A) a fluoroolefin, (B) an organosilicon compound containing an olefinic unsaturated bond and an alkoxysilyl group, (C) an unsaturated carboxylic acid represented by a general formula of CH.sub.2 .dbd.CH--(CH.sub.2).sub.n --COOH where n is an integer of from 3 to 15, and (D) at least one other copolymerizable monomer. A paint prepared from the emulsion is superior in storage stability and mechanical stability, although this paint belongs to a one-package paint. A coated film formed by applying the paint is superior in water resistance in its early stages, stain resistance, and weather resistance.

Water-based fluorine-containing emulsion

A polyimide precursor composition which is produced by (i) providing a polyamide acid solution obtained by reacting an aromatic tetracarboxylic acid component and a diamine component in the presence of an oxygen-containing solvent and (ii) subjecting said polyamide acid solution to heat treatment. The polyimide precursor composition exhibits a desirable apparent viscosity and a desirable thixotropic property and it excels in film forming ability, and because of this, it enables the formation a high quality relief pattern film with no defect and which excels in form retention by way of the screen printing. Further, the polyimide precursor composition is extremely suitable for the formation of a relief pattern by way of screen printing in the production of electronic, electric, optical, or precision devices, wherein the relief pattern is required to have a reduced dielectric constant and a reduced residual stress and to have a sufficient heat resistance, moisture resistance, physical strength, and chemical stability.

Polyimide precursor composition, polyimide composition, process for the

A polyimide precursor composition which is produced by (i) providing a polyamide acid solution obtained by reacting an aromatic tetracarboxylic acid component and a diamine component in the presence of an oxygen-containing solvent and (ii) subjecting said polyamide acid solution to heat treatment. The polyimide precursor composition exhibits a desirable apparent viscosity and a desirable thixotropic property and it excels in film forming ability, and because of this, it enables the formation a high quality relief pattern film with no defect and which excels in form retention by way of the screen printing. Further, the polyimide precursor composition is extremely suitable for the formation of a relief pattern by way of the screen printing in production of electronic, electric, optical, or precision devices, wherein the relief pattern is required to have a reduced dielectric constant and a reduced residual stress and to have a sufficient heat resistance, moisture resistance, physical strength, and chemical stability.

Polyimide precursor composition and the production of said polyimide

A polyimide precursor composition solution includes a tetracarboxylic acid component containing not less than 70 mol % of at least one selected from the group consisting of benzenetetracarboxylic acid and its reactive derivatives; a maleimide compound; and a diamine component containing not less than 70 mol % of 2,2'-substituted-4,4'-benzidine represented by the general formula (I) and siloxydiamine amounting to from 1 to 10 mol %. The tetracarboxylic acid component, the maleimide compound and the diamine component are dissolved in a solvent which is consisting essentially of .gamma.-butyrolactone. The amount of the tetracarboxylic acid component is substantially equivalent to that of the diamine component. The amount of the maleimide compound is from 5 to 30 wt % of the total weight of the tetracarboxylic acid and the diamine component. A polyimide coating film prepared from the polyamide precursor solution is very low in residual stress and superior in adhesion to a substrate, has a very flat surface and can be desirably treated by wet etching process with an etching solution which is not hazardous. ##STR1## wherein R are the same or different ones selected from the group consisting of CF.sub.3, CH.sub.3, C.sub.2 H.sub.5, OCH.sub.3, OC.sub.2 H.sub.5, Cl, Br and phenyl group.

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Higashimatsuyama, Japan

Seiji Hasegawa